From steffen.8 at osu.edu  Sun Aug  1 13:23:23 2021
From: steffen.8 at osu.edu (Steffen, Paul)
Date: Sun, 1 Aug 2021 17:23:23 +0000
Subject: [labnetwork] Dektak 150 Service
In-Reply-To: <1506216787.1717058.1627684417280@mail.yahoo.com>
References: <CAEXS_M_hVa6UkdiBkwjDDw_UepOoAhqB2k3nKvFvLK=okCCYOQ@mail.gmail.com>
 <06bb352c-9d25-70f8-f3c8-2c41b18cea12@physics.ubc.ca>
 <CAHxjSh=EiKFsvxi91wzgdFJ+rSn1dLBB12hmF9F6fB93L9nMfQ@mail.gmail.com>,
 <1506216787.1717058.1627684417280@mail.yahoo.com>
Message-ID: <CH2PR01MB575220533E8C0EB003F365B3B6EE9@CH2PR01MB5752.prod.exchangelabs.com>

Hank Calles

HRC CONSULTING

340 S. Kellogg Ave. Ste. D

Goleta, CA 93117

Cell: 805-680-1368<tel:+18056801368>

Main: 805-845-1618<tel:+18058451618>

Fax: 805-845-1619<tel:+18058451619>

Email: hrc-consulting at sbcoxmail.com<mailto:hrc-consulting at sbcoxmail.com>

www.hrdektak.com<https://urldefense.com/v3/__http://www.hrdektak.com__;!!KGKeukY!hiNxEWW3ECkVVgmSqLHmjkgCqumLt3kooy_LNS6UxMUjPsZJN4qQQXff3TwMZFRzRg$>


Get Outlook for Android<https://aka.ms/AAb9ysg>
________________________________
From: labnetwork <labnetwork-bounces at mtl.mit.edu> on behalf of Dennis Culver <djculver at aol.com>
Sent: Friday, July 30, 2021 3:33:37 PM
To: bill_flounders at berkeley.edu <bill_flounders at berkeley.edu>; beaudoin at physics.ubc.ca <beaudoin at physics.ubc.ca>
Cc: labnetwork at mtl.mit.edu <labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] Dektak 150 Service

Hello All,
Dennis Culver from Culver Consulting.

FYI  I continue to support Veeco/Sloan Legacy systems such as the Dektak II, IIA, IID, 3030, 3030 Auto 1 [can no longer support the 3030 Auto II programmable stage or automation however I can still keep the base profiler operational] Dektak 3030ST, Dektak 3 and D3ktak 3ST systems.  I am now dropping legacy support of the Dektak "V" series systems as much of the motion controller section is obsolete and can't be supported.  No replacements available.  Bruker has chosen not to allow outside support of their Legacy systems in favor of letting those systems die so you are stuck with replacing them.

I continue to support Veeco ion beam etching systems such as the ME 301, ME 302, ME 601, ME 602 & ME 1001 systems to include gauge controllers and power supplies.

When in doubt, please contact me directly.

Dennis J.  Culver
Culver Consulting

5960 Valentine Road
Unit 14, Mail box 13
Ventura, CA 93003

Ph (805) 648-1184
Fx (805) 648-1485

Cell(805)680-7389

dennis at culverequipment.com

-----Original Message-----
From: Albert William (Bill) Flounders <bill_flounders at berkeley.edu>
To: Beaudoin, Mario <beaudoin at physics.ubc.ca>
Cc: Fab Network <labnetwork at mtl.mit.edu>
Sent: Fri, Jul 30, 2021 10:17 am
Subject: Re: [labnetwork] Dektak 150 Service

>From Previous LabNet posts (many years old)
but the website for culverequipment.com<https://urldefense.com/v3/__http://culverequipment.com/__;!!KGKeukY!nmb4uPzLt6SGJrAmIwhqTnM9Li8MOKotSaPRBAVAZoQZiAZFGDxi8aHZe8McXY7RYQ$> is still live

Dennis J.  Culver
Culver Consulting
57 W. McFarlane St.
Ventura, CA 93001
Ph (805) 648-1184
Fx (805) 648-1485
Cell (805)680-7389
dennis at culverequipment.com<mailto:dennis at culverequipment.com>
Website: www.culverequipment.com<https://urldefense.com/v3/__http://www.culverequipment.com/__;!!KGKeukY!nmb4uPzLt6SGJrAmIwhqTnM9Li8MOKotSaPRBAVAZoQZiAZFGDxi8aHZe8P_ictDkw$>

HR CONSULTING
DEKTAK REPAIR SERVICE & SALES
590 E. GUTIERREZ ST. STE. C.
SANTA BARBARA, CA 93103
UNITED STATES
Phone: 805.845.1618.
Cell: 805.680.1368
Fax: 805.845.1619
E-mail: hr-consulting at cox.net<mailto:hr-consulting at cox.net>

On Fri, Jul 30, 2021 at 9:22 AM Beaudoin, Mario <beaudoin at physics.ubc.ca<mailto:beaudoin at physics.ubc.ca>> wrote:
Bruker bought this from Veeco I believe.
Mario
On 2021-07-29 8:44 a.m., James Mitchell wrote:
[CAUTION: Non-UBC Email]
Does anyone know of someone who supports this tool?
It is a stylus profilometer.

Thanks, Jim

--
James Mitchell
Specialty Trades Technician
Dept. of Electrical and Computer Engineering
NCSU Nanofabrication Facility
MRC RM243A Box 7911
2410 Campus Shore Dr., Raleigh, NC 27606
jtmitch5 at ncsu.edu<mailto:jtmitch5 at ncsu.edu>
Desk: 919-515-5394
Cell: 919-717-7325
[https://docs.google.com/uc?export=download&id=1QiGLugvY4oVHF_7tSBf4gS9OLOrs_wZf&revid=0B6IsvvpTMVVfZ1Q1Q2gzejVsY3dhRmZ3U3FwdnR5d0x1cWdVPQ]



_______________________________________________
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--
[cid:JJzwpXE7LDk9VPoOIJce]
_______________________________________________
labnetwork mailing list
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From terreb at umich.edu  Tue Aug  3 09:06:03 2021
From: terreb at umich.edu (Terre Briggs)
Date: Tue, 3 Aug 2021 09:06:03 -0400
Subject: [labnetwork] LPCVD film anomaly
Message-ID: <CACLT+Pz+rCdb2BNa3a2QbpWVy6G42gRy67Gwfcj3xY8ztW13ZA@mail.gmail.com>

Hello All,
    We are currently having film quality issues with our LPCVD Low Stress
Nitride, HTO and Nitride films. Without getting into all of the details
just yet I am sharing with you some SEM images. The anomaly, as our furnace
manufacturer describes it, are what look like spheres, or bubbles on the
surface of the films. We are pretty confident that the spheres are only on
the surface and not down into the film itself.
It is very random across the wafers and across the wafer load. After
further processing, the spheres come off and leave behind a divot, or
crater on the surface. This can also be seen in the SEM images.
   My question is, has anyone ever seen anything like this with any of your
LPCVD films? I have been working with Tempress for the last several months
to resolve the issue, but they have never seen anything like this, and so
far we have not made any progress in determining the source. Any help would
be appreciated.

Thanks.....Terre

Terre Briggs
Engineer in Research Sr.
Lurie Nanofabrication Laboratory
University of Michigan
1301 Beal Ave.
Ann Arbor, MI 48109
734-320-4470
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From pkarulkar9 at gmail.com  Tue Aug  3 12:51:56 2021
From: pkarulkar9 at gmail.com (Pramod Karulkar)
Date: Tue, 3 Aug 2021 09:51:56 -0700
Subject: [labnetwork] LPCVD film anomaly
In-Reply-To: <CACLT+Pz+rCdb2BNa3a2QbpWVy6G42gRy67Gwfcj3xY8ztW13ZA@mail.gmail.com>
References: <CACLT+Pz+rCdb2BNa3a2QbpWVy6G42gRy67Gwfcj3xY8ztW13ZA@mail.gmail.com>
Message-ID: <CAPpZqNBzKckPrWpdnuP4ndpQtDXRr-hg90Dyshfp0RrCWytJEA@mail.gmail.com>

These may be arising from microscopic water drops.  A wafer clean & rinse
is not cleaning/drying wafers properly, leaving residue, has a post process
dispense of fluid, or a dryer component or the wafer handling process is
adding moisture residue to wafers.   Audit the whole process  (including
face masks).  Compare results in oxide and silicon areas of starting
wafers.  Water problem will be more prevalent in silicon aras.
Good luck.
Pramod C Karulkar Ph D
+15037561433

On Tue, Aug 3, 2021, 9:19 AM Terre Briggs <terreb at umich.edu> wrote:

> Hello All,
>     We are currently having film quality issues with our LPCVD Low Stress
> Nitride, HTO and Nitride films. Without getting into all of the details
> just yet I am sharing with you some SEM images. The anomaly, as our furnace
> manufacturer describes it, are what look like spheres, or bubbles on the
> surface of the films. We are pretty confident that the spheres are only on
> the surface and not down into the film itself.
> It is very random across the wafers and across the wafer load. After
> further processing, the spheres come off and leave behind a divot, or
> crater on the surface. This can also be seen in the SEM images.
>    My question is, has anyone ever seen anything like this with any of
> your LPCVD films? I have been working with Tempress for the last several
> months to resolve the issue, but they have never seen anything like
> this, and so far we have not made any progress in determining the source.
> Any help would be appreciated.
>
> Thanks.....Terre
>
> Terre Briggs
> Engineer in Research Sr.
> Lurie Nanofabrication Laboratory
> University of Michigan
> 1301 Beal Ave.
> Ann Arbor, MI 48109
> 734-320-4470
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From spb1699 at rit.edu  Tue Aug  3 15:50:19 2021
From: spb1699 at rit.edu (Scott Blondell)
Date: Tue, 3 Aug 2021 19:50:19 +0000
Subject: [labnetwork] Pyrogenic internal torch
Message-ID: <55a406eb0b94486ea8397fa89080027a@ex04mail01a.ad.rit.edu>

Greetings Labnetters,

We're in the process of tweaking our wet ox process. Hardware changes provided an opportunity to consider
alternatives to our current internal "candy cane" torch arrangement employed in several tubes. Currently running 6" silicon
in 205/211mm quartz w/candy cane torch. This doesn't give us the luxury of a simple visual inspection without pulling the tube.

A straight coaxial torch is being qualified now, and it's presenting some challenges. Growth rates are lower than predicted and
across boat uniform is >6%.

Polling the audience: what are your preferences - cane v straight?; straight torch design details/vendors?; gas flows?
There's a lot of knobs to turn - at 2/runs per day it's slow to fine tune.

We do have an MRL external torch that served us well for lower temp processes. Space and budget precludes using it in
multiple tubes.

Appreciate any feedback, tips or outright opinions.

Regards,

Scott P. Blondell
Fac. Mgr.
RIT SMFL
315.738.4073
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From spaolini at cns.fas.harvard.edu  Tue Aug  3 17:00:28 2021
From: spaolini at cns.fas.harvard.edu (Paolini, Steven)
Date: Tue, 3 Aug 2021 21:00:28 +0000
Subject: [labnetwork] Pyrogenic internal torch
In-Reply-To: <55a406eb0b94486ea8397fa89080027a@ex04mail01a.ad.rit.edu>
References: <55a406eb0b94486ea8397fa89080027a@ex04mail01a.ad.rit.edu>
Message-ID: <BL0PR07MB4050B6AAFD4965DB762D7C7CDFF09@BL0PR07MB4050.namprd07.prod.outlook.com>

Scott,
  Over the years, I have had great results with MRL external torches. The main advantage is being able to see the combustion and whether or not the torch depth is correct. The other big advantage is being able to use a flame detector that will shut off the H2 flow in a couple of seconds (adjustable) to avoid injecting  gas continuously into a cold torch. You may be seeing uniformity issues with the coaxial if you have tiny air leaks being pulled into the tube from the ground glass joints. Are you using Teflon seals? In any event, please ensure that you are running the H2/O2 mix Oxygen rich to prevent accumulating H2 downstream.
  Equipment Dood

Steve Paolini
Principal Equipment Engineer
Harvard University Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA 02138
617- 496- 9816
spaolini at cns.fas.harvard.edu
www.cns.fas.harvard.edu

From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Scott Blondell
Sent: Tuesday, August 03, 2021 3:50 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Pyrogenic internal torch

Greetings Labnetters,

We're in the process of tweaking our wet ox process. Hardware changes provided an opportunity to consider
alternatives to our current internal "candy cane" torch arrangement employed in several tubes. Currently running 6" silicon
in 205/211mm quartz w/candy cane torch. This doesn't give us the luxury of a simple visual inspection without pulling the tube.

A straight coaxial torch is being qualified now, and it's presenting some challenges. Growth rates are lower than predicted and
across boat uniform is >6%.

Polling the audience: what are your preferences - cane v straight?; straight torch design details/vendors?; gas flows?
There's a lot of knobs to turn - at 2/runs per day it's slow to fine tune.

We do have an MRL external torch that served us well for lower temp processes. Space and budget precludes using it in
multiple tubes.

Appreciate any feedback, tips or outright opinions.

Regards,

Scott P. Blondell
Fac. Mgr.
RIT SMFL
315.738.4073
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From whipp003 at umn.edu  Tue Aug  3 17:29:03 2021
From: whipp003 at umn.edu (Tony Whipple)
Date: Tue, 3 Aug 2021 16:29:03 -0500
Subject: [labnetwork] LPCVD film anomaly
In-Reply-To: <CACLT+Pz+rCdb2BNa3a2QbpWVy6G42gRy67Gwfcj3xY8ztW13ZA@mail.gmail.com>
References: <CACLT+Pz+rCdb2BNa3a2QbpWVy6G42gRy67Gwfcj3xY8ztW13ZA@mail.gmail.com>
Message-ID: <CAOzkqn+oaKrgcn4toOz0Qy_o0Pd9nNxPCg+icxQa1Lep5PyOtQ@mail.gmail.com>

Hello Terre;
I thought I saw this type of image before and we had a similar problem with
our LSN process, see image below.
It turned out that with our setup we were having a reaction with residual
that would react when we vented the tube.  This
reaction would cause particles to fall ( rain ) on the wafers when the tube
was vented and being unloaded. We had talked
with Bob Hamilton at Berekley while visiting there and noticed his LPCVD
setup and his solution before we noticed the
same problem with our LPCVD.    After installing the fix we did not have
this issue anymore.

The solution is to provide a very limited small low flowing path around the
gate valve so that when the gate valve is closed
( such as during tube vent ) the tube still has a small draw on it pulling
any reactions toward the pump and away from the
wafers.  If you have this type of bypass already, the only thing would be
to confirm that it is still working I guess. We had a
pressure gauge installed next to this to confirm that it was working and
not plugged.  We would see a pressure change
that indicated it needed cleaning soon.

Regards, Tony W.


[image: image.png]




On Tue, Aug 3, 2021 at 11:20 AM Terre Briggs <terreb at umich.edu> wrote:

> Hello All,
>     We are currently having film quality issues with our LPCVD Low Stress
> Nitride, HTO and Nitride films. Without getting into all of the details
> just yet I am sharing with you some SEM images. The anomaly, as our furnace
> manufacturer describes it, are what look like spheres, or bubbles on the
> surface of the films. We are pretty confident that the spheres are only on
> the surface and not down into the film itself.
> It is very random across the wafers and across the wafer load. After
> further processing, the spheres come off and leave behind a divot, or
> crater on the surface. This can also be seen in the SEM images.
>    My question is, has anyone ever seen anything like this with any of
> your LPCVD films? I have been working with Tempress for the last several
> months to resolve the issue, but they have never seen anything like
> this, and so far we have not made any progress in determining the source.
> Any help would be appreciated.
>
> Thanks.....Terre
>
> Terre Briggs
> Engineer in Research Sr.
> Lurie Nanofabrication Laboratory
> University of Michigan
> 1301 Beal Ave.
> Ann Arbor, MI 48109
> 734-320-4470
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From mtang at stanford.edu  Tue Aug  3 20:03:26 2021
From: mtang at stanford.edu (Mary Tang)
Date: Tue, 3 Aug 2021 17:03:26 -0700
Subject: [labnetwork] LPCVD film anomaly
In-Reply-To: <CAOzkqn+oaKrgcn4toOz0Qy_o0Pd9nNxPCg+icxQa1Lep5PyOtQ@mail.gmail.com>
References: <CACLT+Pz+rCdb2BNa3a2QbpWVy6G42gRy67Gwfcj3xY8ztW13ZA@mail.gmail.com>
 <CAOzkqn+oaKrgcn4toOz0Qy_o0Pd9nNxPCg+icxQa1Lep5PyOtQ@mail.gmail.com>
Message-ID: <00087246-8ab5-8530-f458-8da78d776919@stanford.edu>

Thanks Tony!

Yes, I was trying to remember what Ted Berg, our furnace guy at the 
time, did about the "champagne nitride".? I don't recall the plumbing 
solution exactly, but he took a cue from Berkeley and found a way to 
ensure a constant, low draw during unload.

Mary

-- 
Mary X. Tang, Ph.D.
Managing Director
Stanford Nanofabrication Facility
Paul G. Allen Building
420 Via Palou Mall
Stanford, CA 94305
https://snf.stanford.edu
mtang at stanford.edu


On 8/3/2021 2:29 PM, Tony Whipple wrote:
> Hello Terre;
> I thought I saw this type of image before and we had a similar problem 
> with our LSN process, see image below.
> It turned out that with our setup we were having a reaction with 
> residual that would react when we vented the tube.? This
> reaction would cause particles to fall ( rain ) on the wafers when the 
> tube was vented and being unloaded. We had talked
> with Bob Hamilton at Berekley while visiting there and noticed his 
> LPCVD setup and his solution before we noticed the
> same problem with our LPCVD.??? After installing the fix we did not 
> have this issue anymore.
>
> The solution is to provide a very limited small low flowing path 
> around the gate valve so that when the gate valve is closed
> ( such as during tube vent ) the tube still has a small draw on it 
> pulling any reactions toward the pump and away from the
> wafers.? If you have this type of bypass already, the only thing would 
> be to confirm that it is still working I guess. We had a
> pressure gauge installed next to this to confirm that it was working 
> and not plugged.? We would see a pressure change
> that indicated it needed cleaning soon.
>
> Regards, Tony W.
>
>
> image.png
>
>
>
>
> On Tue, Aug 3, 2021 at 11:20 AM Terre Briggs <terreb at umich.edu 
> <mailto:terreb at umich.edu>> wrote:
>
>     Hello All,
>     ? ? We are currently having film quality issues with our LPCVD Low
>     Stress Nitride, HTO and Nitride films. Without?getting into all of
>     the details just yet I am sharing with you some SEM images. The
>     anomaly, as our furnace manufacturer describes it, are what look
>     like spheres, or bubbles on the surface of the films. We are
>     pretty confident that the?spheres are only on the surface and not
>     down into the film itself.
>     It is very random across the wafers and across the wafer load.
>     After further processing, the spheres come off and leave behind a
>     divot, or crater on the surface. This can also be seen in the SEM
>     images.
>     ? ?My question is, has anyone ever seen anything like this with
>     any of your LPCVD films? I have been working with Tempress for the
>     last several months to resolve the issue, but they have never seen
>     anything like this,?and so far we have not made?any progress
>     in?determining the source. Any help would be appreciated.
>
>     Thanks.....Terre
>
>     Terre Briggs
>     Engineer in Research Sr.
>     Lurie Nanofabrication Laboratory
>     University of Michigan
>     1301 Beal Ave.
>     Ann Arbor, MI 48109
>     734-320-4470
>
>     _______________________________________________
>     labnetwork mailing list
>     labnetwork at mtl.mit.edu <mailto:labnetwork at mtl.mit.edu>
>     https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>     <https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From bill_flounders at berkeley.edu  Tue Aug  3 20:09:05 2021
From: bill_flounders at berkeley.edu (Albert William (Bill) Flounders)
Date: Tue, 3 Aug 2021 17:09:05 -0700
Subject: [labnetwork] LPCVD film anomaly
In-Reply-To: <CAOzkqn+oaKrgcn4toOz0Qy_o0Pd9nNxPCg+icxQa1Lep5PyOtQ@mail.gmail.com>
References: <CACLT+Pz+rCdb2BNa3a2QbpWVy6G42gRy67Gwfcj3xY8ztW13ZA@mail.gmail.com>
 <CAOzkqn+oaKrgcn4toOz0Qy_o0Pd9nNxPCg+icxQa1Lep5PyOtQ@mail.gmail.com>
Message-ID: <CAHxjShn1=PK6M1gSZNrbh=3+F9e809DguPvZ98C3PF4b3F6LMA@mail.gmail.com>

Terre,
Bob Hamilton wrote to me also and advised your issue is possibly caused by
entrainment when the gate valve is closed and the tube is backfilled.
I welcome an offline discussion to describe our "flow path around the gate
valve" which we call the "shunt bypass"
and it includes integrated pressure gauge to insure operational. The last
addition was the pin for clearing the bypass
when it became clogged.

Bill Flounders
UC Berkeley

On Tue, Aug 3, 2021 at 4:49 PM Tony Whipple <whipp003 at umn.edu> wrote:

> Hello Terre;
> I thought I saw this type of image before and we had a similar problem
> with our LSN process, see image below.
> It turned out that with our setup we were having a reaction with residual
> that would react when we vented the tube.  This
> reaction would cause particles to fall ( rain ) on the wafers when the
> tube was vented and being unloaded. We had talked
> with Bob Hamilton at Berekley while visiting there and noticed his LPCVD
> setup and his solution before we noticed the
> same problem with our LPCVD.    After installing the fix we did not have
> this issue anymore.
>
> The solution is to provide a very limited small low flowing path around
> the gate valve so that when the gate valve is closed
> ( such as during tube vent ) the tube still has a small draw on it pulling
> any reactions toward the pump and away from the
> wafers.  If you have this type of bypass already, the only thing would be
> to confirm that it is still working I guess. We had a
> pressure gauge installed next to this to confirm that it was working and
> not plugged.  We would see a pressure change
> that indicated it needed cleaning soon.
>
> Regards, Tony W.
>
>
> [image: image.png]
>
>
>
>
> On Tue, Aug 3, 2021 at 11:20 AM Terre Briggs <terreb at umich.edu> wrote:
>
>> Hello All,
>>     We are currently having film quality issues with our LPCVD Low Stress
>> Nitride, HTO and Nitride films. Without getting into all of the details
>> just yet I am sharing with you some SEM images. The anomaly, as our furnace
>> manufacturer describes it, are what look like spheres, or bubbles on the
>> surface of the films. We are pretty confident that the spheres are only on
>> the surface and not down into the film itself.
>> It is very random across the wafers and across the wafer load. After
>> further processing, the spheres come off and leave behind a divot, or
>> crater on the surface. This can also be seen in the SEM images.
>>    My question is, has anyone ever seen anything like this with any of
>> your LPCVD films? I have been working with Tempress for the last several
>> months to resolve the issue, but they have never seen anything like
>> this, and so far we have not made any progress in determining the source.
>> Any help would be appreciated.
>>
>> Thanks.....Terre
>>
>> Terre Briggs
>> Engineer in Research Sr.
>> Lurie Nanofabrication Laboratory
>> University of Michigan
>> 1301 Beal Ave.
>> Ann Arbor, MI 48109
>> 734-320-4470
>>
>> _______________________________________________
>> labnetwork mailing list
>> labnetwork at mtl.mit.edu
>> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From markc at exper-tech.com  Tue Aug  3 23:35:43 2021
From: markc at exper-tech.com (mark cooper)
Date: Wed, 4 Aug 2021 03:35:43 +0000
Subject: [labnetwork] Pyrogenic internal torch
In-Reply-To: <BL0PR07MB4050B6AAFD4965DB762D7C7CDFF09@BL0PR07MB4050.namprd07.prod.outlook.com>
References: <55a406eb0b94486ea8397fa89080027a@ex04mail01a.ad.rit.edu>,
 <BL0PR07MB4050B6AAFD4965DB762D7C7CDFF09@BL0PR07MB4050.namprd07.prod.outlook.com>
Message-ID: <SJ0PR04MB7904F0FEA1E0CF528E597C168EF19@SJ0PR04MB7904.namprd04.prod.outlook.com>

Back in the day Bruce, Thermco, MRL and Persys all had multiple versions of the external torch hardware, and some were integrated well, and some were clunky.

The original J hook actually had the flame active in the source zone and could create 10 degree shift in the temperature as the flame tickled the back of the tube. The external torch designs cut down the source zone delta t to a degree or less in process conditions. Huge improvement. J hook had reliability issues with the flame and flow patterns, small flow changes effected the flame direction and quality.

You need to maintain your flow ratio of H2 O2 to 1.88 or less, and most of the torches will allow you to wait 10 seconds to see the flame after gasses flow.

The MRL and the Thermco style both use a reliable Honeywell uv sensor for flame sense, pretty reliable.

MRL designs have a jacket around the torch to help manage heat. Persys use a lot of CDA to cool the torch, and Thermco design requires a scavenger to pull the excess heat out of the source cabinet. Thermco did make a water cooled unit that was pretty fancy, and wasnt used often.

Bruce had its own design, and migrated to a version of the persys torch hardware with its 5600 model external torch control system

Persys uses lamps technology to light the flame, and once the flame is set, the lamps turn off.

If your furnace is profiled, it should be able to obtain 1% or 2 % process uniformity using the external torch designs.

Expertech does have product knowledge across all of the versions, and can help guide you. Feel free to reach out directly and we can get you back on track. We do offer new, remanufactured, and subject to availability used working parts. I cant say we support every torch perturbation from in 40 years but we are qualified historians and know the evolution.

thanks




Mark Cooper

General Manager

10 Victor Square, Suite 100

Scotts Valley, CA.  95066

Office: (831) 439-9300

Direct:(831) 440-4422

Mobile:(831) 332-9396

markc at exper-tech.com<mailto:markc at exper-tech.com>


________________________________
From: labnetwork <labnetwork-bounces at mtl.mit.edu> on behalf of Paolini, Steven <spaolini at cns.fas.harvard.edu>
Sent: 03 August 2021 14:00
To: Scott Blondell <spb1699 at rit.edu>; labnetwork at mtl.mit.edu <labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] Pyrogenic internal torch


Scott,

  Over the years, I have had great results with MRL external torches. The main advantage is being able to see the combustion and whether or not the torch depth is correct. The other big advantage is being able to use a flame detector that will shut off the H2 flow in a couple of seconds (adjustable) to avoid injecting  gas continuously into a cold torch. You may be seeing uniformity issues with the coaxial if you have tiny air leaks being pulled into the tube from the ground glass joints. Are you using Teflon seals? In any event, please ensure that you are running the H2/O2 mix Oxygen rich to prevent accumulating H2 downstream.

  Equipment Dood



Steve Paolini

Principal Equipment Engineer

Harvard University Center for Nanoscale Systems

11 Oxford St.

Cambridge, MA 02138

617- 496- 9816

spaolini at cns.fas.harvard.edu

www.cns.fas.harvard.edu



From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Scott Blondell
Sent: Tuesday, August 03, 2021 3:50 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Pyrogenic internal torch



Greetings Labnetters,



We?re in the process of tweaking our wet ox process. Hardware changes provided an opportunity to consider

alternatives to our current internal ?candy cane? torch arrangement employed in several tubes. Currently running 6? silicon

in 205/211mm quartz w/candy cane torch. This doesn?t give us the luxury of a simple visual inspection without pulling the tube.



A straight coaxial torch is being qualified now, and it?s presenting some challenges. Growth rates are lower than predicted and

across boat uniform is >6%.



Polling the audience: what are your preferences ? cane v straight?; straight torch design details/vendors?; gas flows?

There?s a lot of knobs to turn ? at 2/runs per day it?s slow to fine tune.



We do have an MRL external torch that served us well for lower temp processes. Space and budget precludes using it in

multiple tubes.



Appreciate any feedback, tips or outright opinions.



Regards,



Scott P. Blondell

Fac. Mgr.

RIT SMFL

315.738.4073

Expert Semiconductor Technology, Inc.

Phone: (831) 439-9300

Fax: (831) 439-8139

This email message is for the sole use of the addressee(s) and may contain Expertech confidential and legally privileged information. Access, review, use, disclosure or distribution of this email by anyone other than the intended addressee is unauthorized and prohibited. If you are not the intended recipient, please notify the sender immediately and destroy all paper and electronic copies of the original message and any attachments.

mark cooper

Expert Semiconductor Technology, Inc.

Phone: (831) 439-9300

Fax: (831) 439-8139

This email message is for the sole use of the addressee(s) and may contain Expertech confidential and legally privileged information. Access, review, use, disclosure or distribution of this email by anyone other than the intended addressee is unauthorized and prohibited. If you are not the intended recipient, please notify the sender immediately and destroy all paper and electronic copies of the original message and any attachments.
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From markc at exper-tech.com  Wed Aug  4 10:11:57 2021
From: markc at exper-tech.com (mark cooper)
Date: Wed, 4 Aug 2021 14:11:57 +0000
Subject: [labnetwork] LPCVD film anomaly
In-Reply-To: <00087246-8ab5-8530-f458-8da78d776919@stanford.edu>
References: <CACLT+Pz+rCdb2BNa3a2QbpWVy6G42gRy67Gwfcj3xY8ztW13ZA@mail.gmail.com>
 <CAOzkqn+oaKrgcn4toOz0Qy_o0Pd9nNxPCg+icxQa1Lep5PyOtQ@mail.gmail.com>,
 <00087246-8ab5-8530-f458-8da78d776919@stanford.edu>
Message-ID: <SJ0PR04MB79048DBA25BD1DFEE1CDDAFA8EF19@SJ0PR04MB7904.namprd04.prod.outlook.com>

The soft pump, (sometimes called the half gate) should be non interlocked and allow you to open while you are pulling the load. We did custom tools with a slow pump valve with standard 1/2 inch nupro, a medium pump with a NW25 gate, and a main vacuum valve with ISO 80 valve, gave more options in the pump down and backfill.
The ammonium chloride will build up on Nitride, so blanket heaters are always important.
The N2 backfill should be able to flow while the process door is open, but make sure the flow it attached to the load area either through a connection to the front flange, or through an rear connected injector.
We had built some CVD polysilicon configurations with a blanket or curtain purge in the scavenger box so the wafers would pass through N2.




Mark Cooper

Expertech General Manager

10 Victor Square, Suite 100

Scotts Valley, CA.  95066

Office: (831) 439-9300

Direct:(831) 440-4422

Mobile:(831) 332-9396

markc at exper-tech.com


________________________________
From: labnetwork <labnetwork-bounces at mtl.mit.edu> on behalf of Mary Tang <mtang at stanford.edu>
Sent: 03 August 2021 17:03
To: Tony Whipple <whipp003 at umn.edu>; Terre Briggs <terreb at umich.edu>
Cc: Labnetwork <labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] LPCVD film anomaly


Thanks Tony!

Yes, I was trying to remember what Ted Berg, our furnace guy at the time, did about the "champagne nitride".  I don't recall the plumbing solution exactly, but he took a cue from Berkeley and found a way to ensure a constant, low draw during unload.

Mary

--
Mary X. Tang, Ph.D.
Managing Director
Stanford Nanofabrication Facility
Paul G. Allen Building
420 Via Palou Mall
Stanford, CA 94305
https://snf.stanford.edu
mtang at stanford.edu<mailto:mtang at stanford.edu>


On 8/3/2021 2:29 PM, Tony Whipple wrote:
Hello Terre;
I thought I saw this type of image before and we had a similar problem with our LSN process, see image below.
It turned out that with our setup we were having a reaction with residual that would react when we vented the tube.  This
reaction would cause particles to fall ( rain ) on the wafers when the tube was vented and being unloaded. We had talked
with Bob Hamilton at Berekley while visiting there and noticed his LPCVD setup and his solution before we noticed the
same problem with our LPCVD.    After installing the fix we did not have this issue anymore.

The solution is to provide a very limited small low flowing path around the gate valve so that when the gate valve is closed
( such as during tube vent ) the tube still has a small draw on it pulling any reactions toward the pump and away from the
wafers.  If you have this type of bypass already, the only thing would be to confirm that it is still working I guess. We had a
pressure gauge installed next to this to confirm that it was working and not plugged.  We would see a pressure change
that indicated it needed cleaning soon.

Regards, Tony W.


[image.png]




On Tue, Aug 3, 2021 at 11:20 AM Terre Briggs <terreb at umich.edu<mailto:terreb at umich.edu>> wrote:
Hello All,
    We are currently having film quality issues with our LPCVD Low Stress Nitride, HTO and Nitride films. Without getting into all of the details just yet I am sharing with you some SEM images. The anomaly, as our furnace manufacturer describes it, are what look like spheres, or bubbles on the surface of the films. We are pretty confident that the spheres are only on the surface and not down into the film itself.
It is very random across the wafers and across the wafer load. After further processing, the spheres come off and leave behind a divot, or crater on the surface. This can also be seen in the SEM images.
   My question is, has anyone ever seen anything like this with any of your LPCVD films? I have been working with Tempress for the last several months to resolve the issue, but they have never seen anything like this, and so far we have not made any progress in determining the source. Any help would be appreciated.

Thanks.....Terre

Terre Briggs
Engineer in Research Sr.
Lurie Nanofabrication Laboratory
University of Michigan
1301 Beal Ave.
Ann Arbor, MI 48109
734-320-4470

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork



_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork


Expert Semiconductor Technology, Inc.

Phone: (831) 439-9300

Fax: (831) 439-8139

This email message is for the sole use of the addressee(s) and may contain Expertech confidential and legally privileged information. Access, review, use, disclosure or distribution of this email by anyone other than the intended addressee is unauthorized and prohibited. If you are not the intended recipient, please notify the sender immediately and destroy all paper and electronic copies of the original message and any attachments.

mark cooper

Expert Semiconductor Technology, Inc.

Phone: (831) 439-9300

Fax: (831) 439-8139

This email message is for the sole use of the addressee(s) and may contain Expertech confidential and legally privileged information. Access, review, use, disclosure or distribution of this email by anyone other than the intended addressee is unauthorized and prohibited. If you are not the intended recipient, please notify the sender immediately and destroy all paper and electronic copies of the original message and any attachments.
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From kbarnes at semitorrdist.com  Wed Aug  4 14:52:08 2021
From: kbarnes at semitorrdist.com (Keith Barnes)
Date: Wed, 4 Aug 2021 18:52:08 +0000
Subject: [labnetwork] Pyrogenic internal torch
In-Reply-To: <SJ0PR04MB7904F0FEA1E0CF528E597C168EF19@SJ0PR04MB7904.namprd04.prod.outlook.com>
References: <55a406eb0b94486ea8397fa89080027a@ex04mail01a.ad.rit.edu>,
 <BL0PR07MB4050B6AAFD4965DB762D7C7CDFF09@BL0PR07MB4050.namprd07.prod.outlook.com>
 <SJ0PR04MB7904F0FEA1E0CF528E597C168EF19@SJ0PR04MB7904.namprd04.prod.outlook.com>
Message-ID: <DM6PR11MB4612F79046569C944C2DCCD9D4F19@DM6PR11MB4612.namprd11.prod.outlook.com>

Here is what you should be using anyway. Most of the wetox processes from wafer producers use this technology.

Fatsr, more uniform growth. Safer, etc.

Thank you,

Keith F. Barnes
Sales Representative

SEMITORR GROUP, INC.
High Purity, Sanitary, Industrial Divisions

1951 Rutan Drive
Livermore, CA  94551
tel:   925.667.3607
cell:  925.337.2221
email:  kbarnes at semitorrinc.com<mailto:kbarnes at semitorrinc.com>
web:  www.semitorrinc.com
______________________________________________________________________________
"This email and any files transmitted with it are confidential and intended solely for the use of the individual or entity to whom they are addressed. If you have received this email in error please notify the system manager. This message contains confidential information and is intended only for the individual named. If you are not the named addressee you should not disseminate, distribute or copy this e-mail. Please notify the sender immediately by e-mail if you have received this e-mail by mistake and delete this e-mail from your system. If you are not the intended recipient you are notified that disclosing, copying, distributing or taking any action in reliance on the contents of this information is strictly prohibited."

From: labnetwork [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of mark cooper
Sent: Tuesday, August 3, 2021 8:36 PM
To: Paolini, Steven; Scott Blondell; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Pyrogenic internal torch

Back in the day Bruce, Thermco, MRL and Persys all had multiple versions of the external torch hardware, and some were integrated well, and some were clunky.

The original J hook actually had the flame active in the source zone and could create 10 degree shift in the temperature as the flame tickled the back of the tube. The external torch designs cut down the source zone delta t to a degree or less in process conditions. Huge improvement. J hook had reliability issues with the flame and flow patterns, small flow changes effected the flame direction and quality.

You need to maintain your flow ratio of H2 O2 to 1.88 or less, and most of the torches will allow you to wait 10 seconds to see the flame after gasses flow.

The MRL and the Thermco style both use a reliable Honeywell uv sensor for flame sense, pretty reliable.

MRL designs have a jacket around the torch to help manage heat. Persys use a lot of CDA to cool the torch, and Thermco design requires a scavenger to pull the excess heat out of the source cabinet. Thermco did make a water cooled unit that was pretty fancy, and wasnt used often.

Bruce had its own design, and migrated to a version of the persys torch hardware with its 5600 model external torch control system

Persys uses lamps technology to light the flame, and once the flame is set, the lamps turn off.

If your furnace is profiled, it should be able to obtain 1% or 2 % process uniformity using the external torch designs.

Expertech does have product knowledge across all of the versions, and can help guide you. Feel free to reach out directly and we can get you back on track. We do offer new, remanufactured, and subject to availability used working parts. I cant say we support every torch perturbation from in 40 years but we are qualified historians and know the evolution.

thanks




Mark Cooper

General Manager

10 Victor Square, Suite 100

Scotts Valley, CA.  95066

Office: (831) 439-9300

Direct:(831) 440-4422

Mobile:(831) 332-9396

markc at exper-tech.com<mailto:markc at exper-tech.com>


________________________________
From: labnetwork <labnetwork-bounces at mtl.mit.edu> on behalf of Paolini, Steven <spaolini at cns.fas.harvard.edu>
Sent: 03 August 2021 14:00
To: Scott Blondell <spb1699 at rit.edu>; labnetwork at mtl.mit.edu <labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] Pyrogenic internal torch


Scott,

  Over the years, I have had great results with MRL external torches. The main advantage is being able to see the combustion and whether or not the torch depth is correct. The other big advantage is being able to use a flame detector that will shut off the H2 flow in a couple of seconds (adjustable) to avoid injecting  gas continuously into a cold torch. You may be seeing uniformity issues with the coaxial if you have tiny air leaks being pulled into the tube from the ground glass joints. Are you using Teflon seals? In any event, please ensure that you are running the H2/O2 mix Oxygen rich to prevent accumulating H2 downstream.

  Equipment Dood



Steve Paolini

Principal Equipment Engineer

Harvard University Center for Nanoscale Systems

11 Oxford St.

Cambridge, MA 02138

617- 496- 9816

spaolini at cns.fas.harvard.edu

https://link.edgepilot.com/s/b7b03dc8/ZCMBBvoxO0m0LqkUTi5CxA?u=http://www.cns.fas.harvard.edu/



From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Scott Blondell
Sent: Tuesday, August 03, 2021 3:50 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Pyrogenic internal torch



Greetings Labnetters,



We're in the process of tweaking our wet ox process. Hardware changes provided an opportunity to consider

alternatives to our current internal "candy cane" torch arrangement employed in several tubes. Currently running 6" silicon

in 205/211mm quartz w/candy cane torch. This doesn't give us the luxury of a simple visual inspection without pulling the tube.



A straight coaxial torch is being qualified now, and it's presenting some challenges. Growth rates are lower than predicted and

across boat uniform is >6%.



Polling the audience: what are your preferences - cane v straight?; straight torch design details/vendors?; gas flows?

There's a lot of knobs to turn - at 2/runs per day it's slow to fine tune.



We do have an MRL external torch that served us well for lower temp processes. Space and budget precludes using it in

multiple tubes.



Appreciate any feedback, tips or outright opinions.



Regards,



Scott P. Blondell

Fac. Mgr.

RIT SMFL

315.738.4073

Expert Semiconductor Technology, Inc.

Phone: (831) 439-9300

Fax: (831) 439-8139

This email message is for the sole use of the addressee(s) and may contain Expertech confidential and legally privileged information. Access, review, use, disclosure or distribution of this email by anyone other than the intended addressee is unauthorized and prohibited. If you are not the intended recipient, please notify the sender immediately and destroy all paper and electronic copies of the original message and any attachments.

mark cooper

Expert Semiconductor Technology, Inc.

Phone: (831) 439-9300

Fax: (831) 439-8139

This email message is for the sole use of the addressee(s) and may contain Expertech confidential and legally privileged information. Access, review, use, disclosure or distribution of this email by anyone other than the intended addressee is unauthorized and prohibited. If you are not the intended recipient, please notify the sender immediately and destroy all paper and electronic copies of the original message and any attachments.


Links contained in this email have been replaced. If you click on a link in the email above, the link will be analyzed for known threats. If a known threat is found, you will not be able to proceed to the destination. If suspicious content is detected, you will see a warning.
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From terreb at umich.edu  Wed Aug  4 17:43:03 2021
From: terreb at umich.edu (Terre Briggs)
Date: Wed, 4 Aug 2021 17:43:03 -0400
Subject: [labnetwork] LPCVD film anomaly
In-Reply-To: <SJ0PR04MB79048DBA25BD1DFEE1CDDAFA8EF19@SJ0PR04MB7904.namprd04.prod.outlook.com>
References: <CACLT+Pz+rCdb2BNa3a2QbpWVy6G42gRy67Gwfcj3xY8ztW13ZA@mail.gmail.com>
 <CAOzkqn+oaKrgcn4toOz0Qy_o0Pd9nNxPCg+icxQa1Lep5PyOtQ@mail.gmail.com>
 <00087246-8ab5-8530-f458-8da78d776919@stanford.edu>
 <SJ0PR04MB79048DBA25BD1DFEE1CDDAFA8EF19@SJ0PR04MB7904.namprd04.prod.outlook.com>
Message-ID: <CACLT+Py05xfa_7DS1Xt0OiH0rVo60xAU_E6offo_rj6exqNeVw@mail.gmail.com>

I want to thank everyone who has replied up to this point. I have several
new directions to head in and several items that I need to check out.
Unfortunately our furnaces suffered a hard shutdown due to loss of power. I
will be quite busy bringing them back on line and won't have time to look
into this at the moment. I am planning to email each one of you when I have
some free time, so look for a response in the future. Thank you again for
your willingness to help us resolve this issue. I will also reply to the
thread once this problem is finally solved.

Terre

On Wed, Aug 4, 2021 at 10:12 AM mark cooper <markc at exper-tech.com> wrote:

> The soft pump, (sometimes called the half gate) should be non interlocked
> and allow you to open while you are pulling the load. We did custom tools
> with a slow pump valve with standard 1/2 inch nupro, a medium pump with a
> NW25 gate, and a main vacuum valve with ISO 80 valve, gave more options in
> the pump down and backfill.
> The ammonium chloride will build up on Nitride, so blanket heaters are
> always important.
> The N2 backfill should be able to flow while the process door is open, but
> make sure the flow it attached to the load area either through a connection
> to the front flange, or through an rear connected injector.
> We had built some CVD polysilicon configurations with a blanket or curtain
> purge in the scavenger box so the wafers would pass through N2.
>
>
>
> *Mark Cooper*
>
> *Expertech General Manager*
>
> *10 Victor Square, Suite 100*
>
> *Scotts Valley, CA.  95066*
>
> *Office: (831) 439-9300*
>
> *Direct:(831) 440-4422*
>
> *Mobile:(831) 332-9396*
>
> *markc at exper-tech.com <markc at exper-tech.com>*
>
>
> ------------------------------
> *From:* labnetwork <labnetwork-bounces at mtl.mit.edu> on behalf of Mary
> Tang <mtang at stanford.edu>
> *Sent:* 03 August 2021 17:03
> *To:* Tony Whipple <whipp003 at umn.edu>; Terre Briggs <terreb at umich.edu>
> *Cc:* Labnetwork <labnetwork at mtl.mit.edu>
> *Subject:* Re: [labnetwork] LPCVD film anomaly
>
>
> Thanks Tony!
> Yes, I was trying to remember what Ted Berg, our furnace guy at the time,
> did about the "champagne nitride".  I don't recall the plumbing solution
> exactly, but he took a cue from Berkeley and found a way to ensure a
> constant, low draw during unload.
>
> Mary
>
> --
> Mary X. Tang, Ph.D.
> Managing Director
> Stanford Nanofabrication Facility
> Paul G. Allen Building
> 420 Via Palou Mall
> Stanford, CA 94305https://snf.stanford.edumtang at stanford.edu
>
>
> On 8/3/2021 2:29 PM, Tony Whipple wrote:
>
> Hello Terre;
> I thought I saw this type of image before and we had a similar problem
> with our LSN process, see image below.
> It turned out that with our setup we were having a reaction with residual
> that would react when we vented the tube.  This
> reaction would cause particles to fall ( rain ) on the wafers when the
> tube was vented and being unloaded. We had talked
> with Bob Hamilton at Berekley while visiting there and noticed his LPCVD
> setup and his solution before we noticed the
> same problem with our LPCVD.    After installing the fix we did not have
> this issue anymore.
>
> The solution is to provide a very limited small low flowing path around
> the gate valve so that when the gate valve is closed
> ( such as during tube vent ) the tube still has a small draw on it pulling
> any reactions toward the pump and away from the
> wafers.  If you have this type of bypass already, the only thing would be
> to confirm that it is still working I guess. We had a
> pressure gauge installed next to this to confirm that it was working and
> not plugged.  We would see a pressure change
> that indicated it needed cleaning soon.
>
> Regards, Tony W.
>
>
> [image: image.png]
>
>
>
>
> On Tue, Aug 3, 2021 at 11:20 AM Terre Briggs <terreb at umich.edu> wrote:
>
> Hello All,
>     We are currently having film quality issues with our LPCVD Low Stress
> Nitride, HTO and Nitride films. Without getting into all of the details
> just yet I am sharing with you some SEM images. The anomaly, as our furnace
> manufacturer describes it, are what look like spheres, or bubbles on the
> surface of the films. We are pretty confident that the spheres are only on
> the surface and not down into the film itself.
> It is very random across the wafers and across the wafer load. After
> further processing, the spheres come off and leave behind a divot, or
> crater on the surface. This can also be seen in the SEM images.
>    My question is, has anyone ever seen anything like this with any of
> your LPCVD films? I have been working with Tempress for the last several
> months to resolve the issue, but they have never seen anything like
> this, and so far we have not made any progress in determining the source.
> Any help would be appreciated.
>
> Thanks.....Terre
>
> Terre Briggs
> Engineer in Research Sr.
> Lurie Nanofabrication Laboratory
> University of Michigan
> 1301 Beal Ave.
> Ann Arbor, MI 48109
> 734-320-4470
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
> _______________________________________________
> labnetwork mailing listlabnetwork at mtl.mit.eduhttps://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
> Expert Semiconductor Technology, Inc.
>
> Phone: (831) 439-9300
>
> Fax: (831) 439-8139
>
> This email message is for the sole use of the addressee(s) and may contain
> Expertech confidential and legally privileged information. Access, review,
> use, disclosure or distribution of this email by anyone other than the
> intended addressee is unauthorized and prohibited. If you are not the
> intended recipient, please notify the sender immediately and destroy all
> paper and electronic copies of the original message and any attachments.
>
> mark cooper
>
> Expert Semiconductor Technology, Inc.
>
> Phone: (831) 439-9300
>
> Fax: (831) 439-8139
>
> This email message is for the sole use of the addressee(s) and may contain
> Expertech confidential and legally privileged information. Access, review,
> use, disclosure or distribution of this email by anyone other than the
> intended addressee is unauthorized and prohibited. If you are not the
> intended recipient, please notify the sender immediately and destroy all
> paper and electronic copies of the original message and any attachments.
>


-- 
Terre Briggs
Engineer in Research Sr.
Lurie Nanofabrication Laboratory
University of Michigan
1301 Beal Ave.
Ann Arbor, MI 48109
734-320-4470
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From gilad.raz81 at gmail.com  Thu Aug  5 06:06:22 2021
From: gilad.raz81 at gmail.com (Gilad Raz)
Date: Thu, 5 Aug 2021 13:06:22 +0300
Subject: [labnetwork] XeF2 Cylinder to Israel
Message-ID: <3151B39F-0247-439E-ADFE-64C4C18BDC46@hxcore.ol>

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From tony.olsen at utah.edu  Thu Aug  5 11:12:56 2021
From: tony.olsen at utah.edu (Tony L Olsen)
Date: Thu, 5 Aug 2021 15:12:56 +0000
Subject: [labnetwork] Flash Drip Oxidation
Message-ID: <BYAPR11MB34961D9C484314B7E1A535FCF1F29@BYAPR11MB3496.namprd11.prod.outlook.com>

My facility is not equipped to support Hydrogen, so when we ordered our oxidation furnaces, we had to defer to alternate methods for steam generation.  At the end, our furnace vendor provided a flash drip system.  Unfortunately, it was an absolutely pathetic system.  Even after it was packed with insulation, water pooled in the drip chamber and eventually splashed into the neck of the furnace tube.  It was soon replaced with a bubbler - which is only marginally better.  I've tolerated the bubbler for a few years now and I'd like to revisit the flash drip approach.  I know there are very good systems and, obviously, very bad ones, too.

I'd love to hear from folks that have a decent, simple, minimal cost flash drip system.  How is it configured?  How effective?  etc.  I have a few ideas on what I would like to try, but I'd appreciate some input from anyone that may be using this approach for wet oxidation.

Thanks,
tonyO


Tony Olsen
Nanofab Cleanroom Supervisor/Process Engineer
University of Utah
36 S Wasatch Drive, Suite 2500
Salt Lake City, UT  84112
801-587-0651
www.nanofab.utah.edu


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From bill_flounders at berkeley.edu  Thu Aug  5 12:18:17 2021
From: bill_flounders at berkeley.edu (Albert William (Bill) Flounders)
Date: Thu, 5 Aug 2021 09:18:17 -0700
Subject: [labnetwork] Flash Drip Oxidation
In-Reply-To: <BYAPR11MB34961D9C484314B7E1A535FCF1F29@BYAPR11MB3496.namprd11.prod.outlook.com>
References: <BYAPR11MB34961D9C484314B7E1A535FCF1F29@BYAPR11MB3496.namprd11.prod.outlook.com>
Message-ID: <CAHxjShnxp6W0ygoFTaeCmmZ0Ov=D7avXr-eYZttGZxZ0_1Z7ag@mail.gmail.com>

Tony,
We have used a flash drip oxidation system from Tystar
for 3 generations of equipment (100mm, 150mm, 200mm)
over 30 years. It has worked flawlessly. I encourage you to
reach out to them off network.

Bill Flounders
UC Berkeley

On Thu, Aug 5, 2021 at 9:04 AM Tony L Olsen <tony.olsen at utah.edu> wrote:

> My facility is not equipped to support Hydrogen, so when we ordered our
> oxidation furnaces, we had to defer to alternate methods for steam
> generation.  At the end, our furnace vendor provided a flash drip system.
> Unfortunately, it was an absolutely pathetic system.  Even after it was
> packed with insulation, water pooled in the drip chamber and eventually
> splashed into the neck of the furnace tube.  It was soon replaced with a
> bubbler ? which is only marginally better.  I?ve tolerated the bubbler for
> a few years now and I?d like to revisit the flash drip approach.  I know
> there are very good systems and, obviously, very bad ones, too.
>
>
>
> I?d love to hear from folks that have a decent, simple, minimal cost flash
> drip system.  How is it configured?  How effective?  etc.  I have a few
> ideas on what I would like to try, but I?d appreciate some input from
> anyone that may be using this approach for wet oxidation.
>
>
>
> Thanks,
>
> tonyO
>
>
>
>
>
> Tony Olsen
>
> Nanofab Cleanroom Supervisor/Process Engineer
>
> University of Utah
>
> 36 S Wasatch Drive, Suite 2500
>
> Salt Lake City, UT  84112
>
> 801-587-0651
>
> www.nanofab.utah.edu
>
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From rmorrison at draper.com  Thu Aug  5 15:08:21 2021
From: rmorrison at draper.com (Morrison, Richard H., Jr)
Date: Thu, 5 Aug 2021 19:08:21 +0000
Subject: [labnetwork] Flash Drip Oxidation
In-Reply-To: <BYAPR11MB34961D9C484314B7E1A535FCF1F29@BYAPR11MB3496.namprd11.prod.outlook.com>
References: <BYAPR11MB34961D9C484314B7E1A535FCF1F29@BYAPR11MB3496.namprd11.prod.outlook.com>
Message-ID: <4e4e5e19952a4813b319b99dfe46ba94@draper.com>

HI,

At Draper we have a MRL Oxidation tube with a bubbler and it works great, it also autofill's, check out MRL.

Rick

Richard Morrison
PMTS
Draper Laboratory
555 Technology Square
Cambridge Ma  02139
Office: 617-258-3420
Cell: 508-930-3461



From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Tony L Olsen
Sent: Thursday, August 5, 2021 11:13 AM
To: Fab Network <labnetwork at mtl.mit.edu>
Subject: [labnetwork] Flash Drip Oxidation

My facility is not equipped to support Hydrogen, so when we ordered our oxidation furnaces, we had to defer to alternate methods for steam generation.  At the end, our furnace vendor provided a flash drip system.  Unfortunately, it was an absolutely pathetic system.  Even after it was packed with insulation, water pooled in the drip chamber and eventually splashed into the neck of the furnace tube.  It was soon replaced with a bubbler - which is only marginally better.  I've tolerated the bubbler for a few years now and I'd like to revisit the flash drip approach.  I know there are very good systems and, obviously, very bad ones, too.

I'd love to hear from folks that have a decent, simple, minimal cost flash drip system.  How is it configured?  How effective?  etc.  I have a few ideas on what I would like to try, but I'd appreciate some input from anyone that may be using this approach for wet oxidation.

Thanks,
tonyO


Tony Olsen
Nanofab Cleanroom Supervisor/Process Engineer
University of Utah
36 S Wasatch Drive, Suite 2500
Salt Lake City, UT  84112
801-587-0651
www.nanofab.utah.edu


________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________
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From mhofheins at unm.edu  Fri Aug  6 14:48:52 2021
From: mhofheins at unm.edu (Mark Hofheins)
Date: Fri, 6 Aug 2021 18:48:52 +0000
Subject: [labnetwork] Veeco ION Mill ME 1001
Message-ID: <BY5PR07MB7029C3CF08769AB67F3CB846A3F39@BY5PR07MB7029.namprd07.prod.outlook.com>

Happy Friday,
Does anyone have a Standard Operating Procedure for the ME 1001 ION Mill?
I have the service and install manual; I was hoping someone might have an SOP.

Best regards,

Mark Hofheins

mhofheins at unm.edu<mailto:mhofheins at unm.edu>

Cell  505-259-9278

Office 505-272-7506



Micro Electronics Technician

Manufacturing Engineering/

School of Engineering

University of New Mexico MTTC

800 Bradbury S.E.  Suit 169

Albuquerque, New Mexico

87106-4346

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From djculver at aol.com  Fri Aug  6 16:39:05 2021
From: djculver at aol.com (Dennis Culver)
Date: Fri, 6 Aug 2021 20:39:05 +0000 (UTC)
Subject: [labnetwork] Veeco ION Mill ME 1001
In-Reply-To: <BY5PR07MB7029C3CF08769AB67F3CB846A3F39@BY5PR07MB7029.namprd07.prod.outlook.com>
References: <BY5PR07MB7029C3CF08769AB67F3CB846A3F39@BY5PR07MB7029.namprd07.prod.outlook.com>
Message-ID: <1483677669.439989.1628282345126@mail.yahoo.com>

Hello Mark,If your manual is complete, there's a section entitle "Initial Turn on" ?which would walk you through initiating a beam. ?At the end of the manual, there should be a few sample programs showing ideal etch angles and best power settings for different materials. ?Any SOP you may find would be material and application specific. ?You can incur damage to the system if you are unsure of its operation! ?
I can offer some onsite training for light maintenance and operation of the system. ?Contact me directly if interested.
Dennis J. ?Culver ?Culver Consulting
5960 Valentine RoadUnit 14, Mail box 13Ventura, CA 93003
Ph (805) 648-1184Fx (805) 648-1485
Cell(805)680-7389
dennis at culverequipment.com

-----Original Message-----
From: Mark Hofheins <mhofheins at unm.edu>
To: labnetwork at mtl.mit.edu <labnetwork at mtl.mit.edu>
Sent: Fri, Aug 6, 2021 11:48 am
Subject: [labnetwork] Veeco ION Mill ME 1001

 #yiv8360268894 P {margin-top:0;margin-bottom:0;}Happy Friday,Does anyone have a Standard Operating Procedure for the ME 1001 ION Mill?I have the service and install manual; I was hoping someone might have an SOP.
Best regards,Mark Hofheinsmhofheins at unm.eduCell? 505-259-9278Office 505-272-7506?Micro Electronics Technician?Manufacturing Engineering/?School of EngineeringUniversity of New Mexico MTTC800 Bradbury S.E.??Suit 169Albuquerque, New Mexico87106-4346
_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From armin.baur at plasmatherm.com  Mon Aug  9 14:22:47 2021
From: armin.baur at plasmatherm.com (Baur, Armin (Plasma-Therm LLC))
Date: Mon, 9 Aug 2021 18:22:47 +0000
Subject: [labnetwork] XeF2 Cylinder to Israel
In-Reply-To: <3151B39F-0247-439E-ADFE-64C4C18BDC46@hxcore.ol>
References: <3151B39F-0247-439E-ADFE-64C4C18BDC46@hxcore.ol>
Message-ID: <MN2PR02MB68480B0CA50D20643AAA042882F69@MN2PR02MB6848.namprd02.prod.outlook.com>

Gilad,

I always used Pelchem https://www.pelchem.com/index.php/products-and-industries/electronics/xenon-difluoride-detail

Armin

From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Gilad Raz
Sent: Thursday, August 5, 2021 6:06 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] XeF2 Cylinder to Israel

CAUTION: This email originated from outside of the organization. Do not click links or open attachments unless you recognize the sender and know the content is safe.

I?m looking for the above mentioned gas

Sent from Mail<https://go.microsoft.com/fwlink/?LinkId=550986> for Windows 10

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From thibeault at ece.ucsb.edu  Mon Aug  9 17:58:55 2021
From: thibeault at ece.ucsb.edu (Brian Thibeault)
Date: Mon, 9 Aug 2021 14:58:55 -0700
Subject: [labnetwork] Open Position at UCSB Nanofabrication Facility
Message-ID: <CACJqMoOcxzew_vRkX8B5Lo0DZ8KT85NsGvpyXEKpgiiH=BhsPQ@mail.gmail.com>

Hi Everyone,

We are looking to hire a new full-time engineer at the UCSB Nanofabrication
Facility.  A general job description is below.

Under general supervision, is responsible for the maintenance of facility
equipment and their sub systems including high and low vacuum system
repairs, mechanical system repairs, electrical systems repairs, wet
processing and pumping systems, gas delivery and control systems,
compressor systems, and HVAC systems. Utilizes a broad spectrum of
engineering disciplines to support these facility capabilities to users of
the Nanofabrication Facility which consists of numerous engineers,
postdocs, visiting scholars, graduate students, and other UCSB staff.
Provides user training on various assigned user-operated systems. Under
general supervision designs and implements facility equipment modifications
to enhance equipment capabilities in new and unique ways. In conjunction
with senior level R&D engineers, provides technical advice and guidance to
users and develops appropriate safety measures and lab policy. Interfaces
with equipment vendors, technical staff, and other R&D engineers to develop
engineering solutions to equipment and process problems or requirements,
and implements those solutions.

To get to the UCSB HR job posting use the link below and
Search using Keyword: 15431
https://careerspub.universityofcalifornia.edu/psp/ucsb/EMPLOYEE/HRMS/c/HRS_HRAM.HRS_APP_SCHJOB.GBL?Page=HRS_APP_SCHJOB&Action=U&FOCUS=Applicant&SiteId=31

--
Brian Thibeault, Ph.D.
Technical/Operational Director
UCSB Nanofabrication Facility
www.nanotech.ucsb.edu
(805) 893-2268
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From mhofheins at unm.edu  Mon Aug  9 18:07:40 2021
From: mhofheins at unm.edu (Mark Hofheins)
Date: Mon, 9 Aug 2021 22:07:40 +0000
Subject: [labnetwork] Sputtering Boron Nitride
Message-ID: <BY5PR07MB70294D8F178641217F8587B9A3F69@BY5PR07MB7029.namprd07.prod.outlook.com>

Does anyone know what contaminates might happen sputtering Boron Nitride in main chamber used with other targets?


Mark Hofheins

mhofheins at unm.edu<mailto:mhofheins at unm.edu>

Cell  505-259-9278

Office 505-272-7506



Micro Electronics Technician

Manufacturing Engineering/

School of Engineering

University of New Mexico MTTC

800 Bradbury S.E.  Suit 169

Albuquerque, New Mexico

87106-4346

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From telemann0 at yahoo.com  Wed Aug 11 09:54:31 2021
From: telemann0 at yahoo.com (Joonhyeong Park)
Date: Wed, 11 Aug 2021 13:54:31 +0000 (UTC)
Subject: [labnetwork] Remi Equipment Maintenance Management Program
References: <760650545.875931.1628690071522.ref@mail.yahoo.com>
Message-ID: <760650545.875931.1628690071522@mail.yahoo.com>

Hello,

If you are using Remi Equipment Maintenance Management Program, could you share your experience with?them?
Remi have contacted me and they currently has a statewide program meant to reduce costs on full service maintenance contracts.

Regards,

Joon Hyeong Park
Microfab Research Engineer
Birck Nanotechnology Center
Purdue University


From hathaway at cns.fas.harvard.edu  Wed Aug 11 12:28:15 2021
From: hathaway at cns.fas.harvard.edu (Mac Hathaway)
Date: Wed, 11 Aug 2021 12:28:15 -0400
Subject: [labnetwork] Cleaning up/ reconditioning VCR seals?
In-Reply-To: <760650545.875931.1628690071522@mail.yahoo.com>
References: <760650545.875931.1628690071522.ref@mail.yahoo.com>
 <760650545.875931.1628690071522@mail.yahoo.com>
Message-ID: <c2d63d61-9ac1-8e20-a843-879d49d8a334@cns.fas.harvard.edu>

Hello All,

I'm wondering if anyone has ever developed a scheme for polishing or 
reconditioning VCR sealing surfaces.? Obviously, buying a new one is the 
best approach, but some of our fittings are rather expensive or hard to 
come by, and some technique for cleaning up mild wear or whatnot would 
be handy.? And of course, this would not be applied to toxics.

I leak test these down to 1E-12 torr-liter/sec, so that would be my 
goal.? I imagine coaxial spinning of the fitting surface would be best 
(not hand-held), but what final grit would be needed.? Is 
electropolishing absolutely necessary to get a good seal?? This would be 
very light polishing, not enough to flatten the bead of the seal.

Any trick to keeping the polished particles out of the bore, or just an 
ultrasonic clean at the end?

If it's impossible, that's good to know, as well.

Thanks,


Mac


Mac Hathaway

Senior Process and Systems Engineer

Harvard Center for Nanoscale Systems

11 Oxford St.

Cambridge, MA02138

617-495-9012


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From schweig at umich.edu  Thu Aug 12 06:37:40 2021
From: schweig at umich.edu (Dennis Schweiger)
Date: Thu, 12 Aug 2021 06:37:40 -0400
Subject: [labnetwork] Cleaning up/ reconditioning VCR seals?
In-Reply-To: <c2d63d61-9ac1-8e20-a843-879d49d8a334@cns.fas.harvard.edu>
References: <760650545.875931.1628690071522.ref@mail.yahoo.com>
 <760650545.875931.1628690071522@mail.yahoo.com>
 <c2d63d61-9ac1-8e20-a843-879d49d8a334@cns.fas.harvard.edu>
Message-ID: <CAKzi2_NYdpe=18074ge+COkNFeFQpW0hyr=Q114O1rf0ONkESg@mail.gmail.com>

Mac,

If the problem you're having is a damaged toroid face, I've used both of
these as a fix, with success.

Parker-Veriflo Vacuseal Grooved Gasket (1/2" nominal), with retainer,
stainless steel  8 GVGR-SS

Parker-Veriflo Vacuseal Grooved Gasket (1/4" nominal), with retainer,
stainless steel  4 GVGR-SS

I would expect your Parker rep to be able to provide them for you. They're
not cheap.  When last I purchased them, they were $8, and $7, each, however
it was way cheaper than reworking the gland connection.

Dennis Schweiger
University of Michigan/LNF
Facilities Manager

734.647.2055 Ofc

"People can be divided into 3 groups - those that make things happen, those
that watch things happen, and those that wonder what happened."  Within
which group do you belong?


On Wed, Aug 11, 2021 at 1:05 PM Mac Hathaway <hathaway at cns.fas.harvard.edu>
wrote:

> Hello All,
>
> I'm wondering if anyone has ever developed a scheme for polishing or
> reconditioning VCR sealing surfaces.  Obviously, buying a new one is the
> best approach, but some of our fittings are rather expensive or hard to
> come by, and some technique for cleaning up mild wear or whatnot would be
> handy.  And of course, this would not be applied to toxics.
>
> I leak test these down to 1E-12 torr-liter/sec, so that would be my goal.
> I imagine coaxial spinning of the fitting surface would be best (not
> hand-held), but what final grit would be needed.  Is electropolishing
> absolutely necessary to get a good seal?  This would be very light
> polishing, not enough to flatten the bead of the seal.
>
> Any trick to keeping the polished particles out of the bore, or just an
> ultrasonic clean at the end?
>
> If it's impossible, that's good to know, as well.
>
> Thanks,
>
>
> Mac
>
>
> Mac Hathaway
>
> Senior Process and Systems Engineer
>
> Harvard Center for Nanoscale Systems
>
> 11 Oxford St.
>
> Cambridge, MA  02138
>
> 617-495-9012
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From markjmcc at illinois.edu  Thu Aug 12 18:43:09 2021
From: markjmcc at illinois.edu (McCollum, Mark J)
Date: Thu, 12 Aug 2021 22:43:09 +0000
Subject: [labnetwork] Cleaning up/ reconditioning VCR seals?
In-Reply-To: <c2d63d61-9ac1-8e20-a843-879d49d8a334@cns.fas.harvard.edu>
References: <760650545.875931.1628690071522.ref@mail.yahoo.com>
 <760650545.875931.1628690071522@mail.yahoo.com>
 <c2d63d61-9ac1-8e20-a843-879d49d8a334@cns.fas.harvard.edu>
Message-ID: <BL1PR11MB54625DA096AD0DD38E7F6D7DA9F99@BL1PR11MB5462.namprd11.prod.outlook.com>

Some years back I had some difficult VCR?s seal well with Teflon VCR gaskets.
Dr. Mark J. McCollum
Principal Research Engineer
Nick Holonyak, Jr. Micro and Nanotechnology Laboratory 2260
Grainger College of Engineering
University of Illinois at Urbana-Champaign
208 North Wright Street
Urbana, IL 61801
217-300-5181
email: markjmcc at illinois.edu<mailto:markjmcc at illinois.edu>



From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Mac Hathaway
Sent: Wednesday, August 11, 2021 11:28 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Cleaning up/ reconditioning VCR seals?

Hello All,

I'm wondering if anyone has ever developed a scheme for polishing or reconditioning VCR sealing surfaces.  Obviously, buying a new one is the best approach, but some of our fittings are rather expensive or hard to come by, and some technique for cleaning up mild wear or whatnot would be handy.  And of course, this would not be applied to toxics.

I leak test these down to 1E-12 torr-liter/sec, so that would be my goal.  I imagine coaxial spinning of the fitting surface would be best (not hand-held), but what final grit would be needed.  Is electropolishing absolutely necessary to get a good seal?  This would be very light polishing, not enough to flatten the bead of the seal.

Any trick to keeping the polished particles out of the bore, or just an ultrasonic clean at the end?

If it's impossible, that's good to know, as well.

Thanks,


Mac

Mac Hathaway
Senior Process and Systems Engineer
Harvard Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA  02138
617-495-9012


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From mmoneck at andrew.cmu.edu  Thu Aug 12 19:03:43 2021
From: mmoneck at andrew.cmu.edu (Matthew Moneck)
Date: Thu, 12 Aug 2021 23:03:43 +0000
Subject: [labnetwork] Opening for Nanofab Process Engineer at Carnegie Mellon
Message-ID: <473d51f54bd7414aa123a0d9f0ee7069@andrew.cmu.edu>

Hello All,

We have an immediate opening for a Process Engineer in the Claire and John Bertucci Nanotechnology Laboratory at Carnegie Mellon University's Pittsburgh campus.  Interested candidates are encouraged to apply at the Careers @ Carnegie Mellon Website<https://cmu.wd5.myworkdayjobs.com/en-US/CMU/job/Pittsburgh-PA/Nanofabrication-Process-Engineer---Claire---John-Bertucci-Nanotechnology-Laboratory---College-of-Engineering_2016620>.

Ideal candidates will have a breadth of experience with micro/nano-fabrication process techniques and equipment, examples of which include lithography (electron-beam and photo), thin-film deposition (sputtering, evaporation, ALD, CVD, PECVD, etc.), wet and dry etching (especially plasma and ion beam etching), annealing, and metrology.

Core responsibilities include:

  *   Training of researchers on lab procedures, lab safety, chemical handling, fabrication processes, and equipment operation.
  *   Conduct fee-for-service process requests from customers and to assist researchers and other staff members in process related troubleshooting, development of new processes, equipment and process calibration, qualification of new equipment, documentation of processes and tool performance, documentation of lab procedures, and ongoing management of a process database.
  *   Basic administrative work is also required and includes, but is not limited to billing and invoicing; ordering of chemicals, materials, parts, and supplies; and creation, distribution, and processing of lab forms and log sheets.
  *   In some circumstances, the Process Engineer may be required to work with the lab Equipment Manager and Technicians on repair, maintenance, modification, and/or the upgrade or development of various tools in the lab.

Flexibility, excellence, and passion are vital qualities within Carnegie Mellon. Inclusion, collaboration and cultural sensitivity are valued proficiencies at CMU. Therefore, we are in search of a team member who is able to optimally interact with a varied population of internal and external partners at a high level of integrity. We are looking for someone who shares our values and who will support the mission of the university through their work.

More details can be found at https://cmu.wd5.myworkdayjobs.com/en-US/CMU/job/Pittsburgh-PA/Nanofabrication-Process-Engineer---Claire---John-Bertucci-Nanotechnology-Laboratory---College-of-Engineering_2016620.

--
Matthew T. Moneck, Ph.D
Executive Director, Claire & John Bertucci Nanotechnology Laboratory
Electrical & Computer Engineering | Carnegie Mellon University
5000 Forbes Avenue, Pittsburgh, PA 15213-3890
Phone:  412-268-5430
ece.cmu.edu<http://www.ece.cmu.edu/>
nanofab.ece.cmu.edu<http://www.nanofab.ece.cmu.edu/>

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From loik.gence at fis.puc.cl  Thu Aug 12 21:50:57 2021
From: loik.gence at fis.puc.cl (=?UTF-8?B?RHIuIExvw69rIEdlbmNl?=)
Date: Thu, 12 Aug 2021 21:50:57 -0400
Subject: [labnetwork] Speciality Gas Importation
In-Reply-To: <473d51f54bd7414aa123a0d9f0ee7069@andrew.cmu.edu>
References: <473d51f54bd7414aa123a0d9f0ee7069@andrew.cmu.edu>
Message-ID: <d5d1c61e-3b7a-2ba9-7b35-11fa0acc7671@fis.puc.cl>

Dear All,


we are looking for buying speciality gases for a RIE equipment used for 
fluorine and Chlorine chemistries (SF6, CHF3,CF4, Cl2, BCl3).

We are trying to import these cylinders through the main local 
providers, but it seems they are not capable (or interested) of 
providing these gases in small quantities...

My question is : do you know any company that could help with the 
importation of these gases to Chile, Santiago?

Thanks in advance for any comment/suggestions!


Best,

Lo?k



From Aju.Jugessur at Colorado.EDU  Fri Aug 13 11:13:03 2021
From: Aju.Jugessur at Colorado.EDU (Aju Jugessur)
Date: Fri, 13 Aug 2021 15:13:03 +0000
Subject: [labnetwork] Fume hoods and wet benches
Message-ID: <8BC990CF-5AFA-40B7-B3D2-BB6B10E2F18A@colorado.edu>

Hi all,

We are purchasing some solvent wet benches for our litho. area for our new ISO 5 cleanroom.
The vendors that I have worked with in the past are JST and Terra Universal.

It appears that Labconco also has a cleanroom line but I am not able to get the information whether they are ISO 5 cleanroom compatible.
Has anyone in the network used Labconco wet benches in their ISO 5 cleanroom?

Any advice and feedback will be much appreciated.

Thanks
Aju


Aju Jugessur Ph.D. IEEE Sr. Member
Director, Colorado Shared Instrumentation
in Nanofabrication and Characterization (COSINC) Facility
Member of Engineering Staff Council (ESC)
University of Colorado Boulder | College of Engineering & Applied Science
4001 Discovery Drive, N360G SEEL | Boulder, CO 80303| P: 303.735.5019| F: 303.492.2199
E-mail: aju.jugessur at colorado.edu<mailto:aju.jugessur at colorado.edu>
Personal Zoom link: https://cuboulder.zoom.us/my/ajugessur
www.colorado.edu/facility/cosinc<http://www.colorado.edu/facility/cosinc>

[signature_675360396]

Signature-Strengths: Focus, Activator, Futuristic, Strategic, Achiever
(CliftonStrengths)


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From logshappill at gmail.com  Fri Aug 13 14:05:22 2021
From: logshappill at gmail.com (Leslie O. George)
Date: Fri, 13 Aug 2021 11:05:22 -0700
Subject: [labnetwork] Fume hoods and wet benches
In-Reply-To: <8BC990CF-5AFA-40B7-B3D2-BB6B10E2F18A@colorado.edu>
References: <8BC990CF-5AFA-40B7-B3D2-BB6B10E2F18A@colorado.edu>
Message-ID: <CANGqB_qSmdc5sp9WMd_5+3DmRhxkJyMGZZ31LjJ7WVGRPpmkCg@mail.gmail.com>

Hi Aju,

I would recommend you talk to Reynolds Tech in Syracuse, NY as well. They
are well known and make good products.

-Leslie.

On Fri, Aug 13, 2021 at 8:46 AM Aju Jugessur <Aju.Jugessur at colorado.edu>
wrote:

> Hi all,
>
>
>
> We are purchasing some solvent wet benches for our litho. area for our new
> ISO 5 cleanroom.
>
> The vendors that I have worked with in the past are JST and Terra
> Universal.
>
>
>
> It appears that Labconco also has a cleanroom line but I am not able to
> get the information whether they are ISO 5 cleanroom compatible.
>
> Has anyone in the network used Labconco wet benches in their ISO 5
> cleanroom?
>
>
>
> Any advice and feedback will be much appreciated.
>
>
>
> Thanks
>
> Aju
>
>
>
>
>
> Aju Jugessur Ph.D. IEEE Sr. Member
>
> Director, Colorado Shared Instrumentation
>
> in Nanofabrication and Characterization (COSINC) Facility
>
> Member of Engineering Staff Council (ESC)
>
> *University of Colorado Boulder | **College of Engineering & Applied
> Science*
>
> 4001 Discovery Drive, N360G SEEL *|* Boulder, CO 80303*|* *P:*
>  303.735.5019*| F:* 303.492.2199
>
> E-mail: aju.jugessur at colorado.edu
>
> Personal Zoom link: https://cuboulder.zoom.us/my/*ajugessur*
> <https://cuboulder.zoom.us/my/ajugessur>
>
> www.colorado.edu/facility/cosinc
>
>
>
> [image: signature_675360396]
>
>
>
>
> *Signature-Strengths: Focus, Activator, Futuristic, Strategic, Achiever
> (CliftonStrengths)*
>
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From vk409 at soe.rutgers.edu  Fri Aug 20 13:49:29 2021
From: vk409 at soe.rutgers.edu (Vibhor Kumar)
Date: Fri, 20 Aug 2021 17:49:29 +0000
Subject: [labnetwork] Spot issue in Unaxis-750 PECVD
Message-ID: <BYAPR14MB3221500E2F445EB0F14975CBA7C19@BYAPR14MB3221.namprd14.prod.outlook.com>

Hello Everyone,

During nitride/oxide deposition with Unaxis-750 PECVD, we are getting a mirror image of shower head on the wafer, i.e., spots. We cleaned the chamber with CF4 for 2 consecutive days, each day 4:30 hrs. The conditions were

CF4 = 100 sccm, Temp = 250 C, chamber pressure = 600 mT, time = 4:30 hrs

We also evacuated the silane gas line, but there is no leakage.

After completing the cleaning, when we conditioned the chamber and deposited nitride, the spots were lightened. But on the second day, the spots look enlarging again.

Can anyone please suggest solution to this issue?

Thanks,
-Vibhor Kumar-
Postdoctoral Associate
Rutgers, The State University of New Jersey.

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From spaolini at cns.fas.harvard.edu  Fri Aug 20 16:02:27 2021
From: spaolini at cns.fas.harvard.edu (Paolini, Steven)
Date: Fri, 20 Aug 2021 20:02:27 +0000
Subject: [labnetwork] Spot issue in Unaxis-750 PECVD
In-Reply-To: <BYAPR14MB3221500E2F445EB0F14975CBA7C19@BYAPR14MB3221.namprd14.prod.outlook.com>
References: <BYAPR14MB3221500E2F445EB0F14975CBA7C19@BYAPR14MB3221.namprd14.prod.outlook.com>
Message-ID: <BL0PR07MB40502C948BC2B08A3A303395DFC19@BL0PR07MB4050.namprd07.prod.outlook.com>

Vibhor,
  You are most likely seeing the effect of the showerhead being in need of cleaning, particularly the backside. The Deposition of dielectric films creates a powdery substance just outside of the intended plasma concentrate. This debris, over time, will allow small reactions to happen under the showerhead and show up as spots on your wafer, most likely in the pattern of the holes in the showerhead. I would suggest removing the showerhead and diffuser plate and performing a very thorough clean on all the parts. In my experience, and depending on the usage, this should be performed routinely at an interval that keeps the effect at bay.
  Hope this helps,
    Steve Paolini
   Equipment Dood

Steve Paolini
Principal Equipment Engineer
Harvard University Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA 02138
617- 496- 9816
spaolini at cns.fas.harvard.edu
www.cns.fas.harvard.edu

From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Vibhor Kumar
Sent: Friday, August 20, 2021 1:49 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Spot issue in Unaxis-750 PECVD

Hello Everyone,

During nitride/oxide deposition with Unaxis-750 PECVD, we are getting a mirror image of shower head on the wafer, i.e., spots. We cleaned the chamber with CF4 for 2 consecutive days, each day 4:30 hrs. The conditions were

CF4 = 100 sccm, Temp = 250 C, chamber pressure = 600 mT, time = 4:30 hrs

We also evacuated the silane gas line, but there is no leakage.

After completing the cleaning, when we conditioned the chamber and deposited nitride, the spots were lightened. But on the second day, the spots look enlarging again.

Can anyone please suggest solution to this issue?

Thanks,
-Vibhor Kumar-
Postdoctoral Associate
Rutgers, The State University of New Jersey.

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From mapril at draper.com  Mon Aug 23 06:48:16 2021
From: mapril at draper.com (April, Mark R.)
Date: Mon, 23 Aug 2021 10:48:16 +0000
Subject: [labnetwork] Spot issue in Unaxis-750 PECVD
In-Reply-To: <BL0PR07MB40502C948BC2B08A3A303395DFC19@BL0PR07MB4050.namprd07.prod.outlook.com>
References: <BYAPR14MB3221500E2F445EB0F14975CBA7C19@BYAPR14MB3221.namprd14.prod.outlook.com>
 <BL0PR07MB40502C948BC2B08A3A303395DFC19@BL0PR07MB4050.namprd07.prod.outlook.com>
Message-ID: <8a5f7379227b4885a0c8e578030bdf8b@draper.com>

Good Morning Vibhor,
I concur with Mr. Paolini.  I had a similar issue on a PECVD tool.  After a thorough shower head clean, including the diffuser plate, the shower head pattern was eliminated.  This routinely gets done each year now, during a major PM.  You may need to perform more due to your usage.
Hope this helps.

Mark R. April
Senior  Equipment Engineer
Microfabrication Laboratory
[color_logo_small4]
555 Technology Square
Cambridge, MA  02139
mapril at draper.com<mailto:mapril at draper.com>
O # 617-258-1613 C # 617-455-1596
www.draper.com<http://www.draper.com/>



From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Paolini, Steven
Sent: Friday, August 20, 2021 4:02 PM
To: Vibhor Kumar <vk409 at soe.rutgers.edu>; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Spot issue in Unaxis-750 PECVD

Vibhor,
  You are most likely seeing the effect of the showerhead being in need of cleaning, particularly the backside. The Deposition of dielectric films creates a powdery substance just outside of the intended plasma concentrate. This debris, over time, will allow small reactions to happen under the showerhead and show up as spots on your wafer, most likely in the pattern of the holes in the showerhead. I would suggest removing the showerhead and diffuser plate and performing a very thorough clean on all the parts. In my experience, and depending on the usage, this should be performed routinely at an interval that keeps the effect at bay.
  Hope this helps,
    Steve Paolini
   Equipment Dood

Steve Paolini
Principal Equipment Engineer
Harvard University Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA 02138
617- 496- 9816
spaolini at cns.fas.harvard.edu<mailto:spaolini at cns.fas.harvard.edu>
www.cns.fas.harvard.edu<http://www.cns.fas.harvard.edu>

From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Vibhor Kumar
Sent: Friday, August 20, 2021 1:49 PM
To: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: [labnetwork] Spot issue in Unaxis-750 PECVD

Hello Everyone,

During nitride/oxide deposition with Unaxis-750 PECVD, we are getting a mirror image of shower head on the wafer, i.e., spots. We cleaned the chamber with CF4 for 2 consecutive days, each day 4:30 hrs. The conditions were

CF4 = 100 sccm, Temp = 250 C, chamber pressure = 600 mT, time = 4:30 hrs

We also evacuated the silane gas line, but there is no leakage.

After completing the cleaning, when we conditioned the chamber and deposited nitride, the spots were lightened. But on the second day, the spots look enlarging again.

Can anyone please suggest solution to this issue?

Thanks,
-Vibhor Kumar-
Postdoctoral Associate
Rutgers, The State University of New Jersey.

________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________
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From david.lishan at plasmatherm.com  Mon Aug 23 09:29:02 2021
From: david.lishan at plasmatherm.com (Lishan, David (Plasma-Therm LLC))
Date: Mon, 23 Aug 2021 13:29:02 +0000
Subject: [labnetwork] Spot issue in Unaxis-750 PECVD
In-Reply-To: <8a5f7379227b4885a0c8e578030bdf8b@draper.com>
References: <BYAPR14MB3221500E2F445EB0F14975CBA7C19@BYAPR14MB3221.namprd14.prod.outlook.com>
 <BL0PR07MB40502C948BC2B08A3A303395DFC19@BL0PR07MB4050.namprd07.prod.outlook.com>
 <8a5f7379227b4885a0c8e578030bdf8b@draper.com>
Message-ID: <BN8PR02MB5972F322B379B78C4185290A90C49@BN8PR02MB5972.namprd02.prod.outlook.com>

Hi Vibhor,
The imprint of the showerhead hole pattern is often an indication that silane is reacting with residual oxygen somewhere behind the showerhead.  The source of the oxygen could be a leak anywhere from behind the showerhead all the back to the main valves of the gas bottles.  If the CF4 clean gas is a premix of CF4/O2, it is possible that the oxygen is coming from there.  If there is small leak and the system has been left idle overnight, it is generally the first run of the day that shows the most pronounced imprint pattern.  Subsequent runs can show a less pronounced pattern.  Perhaps this is what has been described in the original problem statement.

Has anything been recently changed on the system e.g. silane gas bottle, mass flow controller or gas line?

Suggest contacting Plasma Therm Tech Support if the problem persists.

BR,
David

David Lishan, Ph.D., Sr. Member IEEE
Principal Scientist, Director - Technical Marketing

[cid:image002.png at 01D79801.4E3A45B0]

mobile +1.727.251.9056
David.Lishan at plasmatherm.com<mailto:David.Lishan at plasmatherm.com> | plasmatherm.com<http://plasmatherm.com/>
10050 16th St. North | St. Petersburg, FL 33716 USA

From: labnetwork [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of April, Mark R.
Sent: Monday, August 23, 2021 6:48 AM
To: Paolini, Steven <spaolini at cns.fas.harvard.edu>; Vibhor Kumar <vk409 at soe.rutgers.edu>; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Spot issue in Unaxis-750 PECVD

CAUTION: This email originated from outside of the organization. Do not click links or open attachments unless you recognize the sender and know the content is safe.

Good Morning Vibhor,
I concur with Mr. Paolini.  I had a similar issue on a PECVD tool.  After a thorough shower head clean, including the diffuser plate, the shower head pattern was eliminated.  This routinely gets done each year now, during a major PM.  You may need to perform more due to your usage.
Hope this helps.

Mark R. April
Senior  Equipment Engineer
Microfabrication Laboratory
[color_logo_small4]
555 Technology Square
Cambridge, MA  02139
mapril at draper.com<mailto:mapril at draper.com>
O # 617-258-1613 C # 617-455-1596
www.draper.com<http://www.draper.com/>



From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Paolini, Steven
Sent: Friday, August 20, 2021 4:02 PM
To: Vibhor Kumar <vk409 at soe.rutgers.edu<mailto:vk409 at soe.rutgers.edu>>; labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] Spot issue in Unaxis-750 PECVD

Vibhor,
  You are most likely seeing the effect of the showerhead being in need of cleaning, particularly the backside. The Deposition of dielectric films creates a powdery substance just outside of the intended plasma concentrate. This debris, over time, will allow small reactions to happen under the showerhead and show up as spots on your wafer, most likely in the pattern of the holes in the showerhead. I would suggest removing the showerhead and diffuser plate and performing a very thorough clean on all the parts. In my experience, and depending on the usage, this should be performed routinely at an interval that keeps the effect at bay.
  Hope this helps,
    Steve Paolini
   Equipment Dood

Steve Paolini
Principal Equipment Engineer
Harvard University Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA 02138
617- 496- 9816
spaolini at cns.fas.harvard.edu<mailto:spaolini at cns.fas.harvard.edu>
www.cns.fas.harvard.edu<http://www.cns.fas.harvard.edu>

From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Vibhor Kumar
Sent: Friday, August 20, 2021 1:49 PM
To: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: [labnetwork] Spot issue in Unaxis-750 PECVD

Hello Everyone,

During nitride/oxide deposition with Unaxis-750 PECVD, we are getting a mirror image of shower head on the wafer, i.e., spots. We cleaned the chamber with CF4 for 2 consecutive days, each day 4:30 hrs. The conditions were

CF4 = 100 sccm, Temp = 250 C, chamber pressure = 600 mT, time = 4:30 hrs

We also evacuated the silane gas line, but there is no leakage.

After completing the cleaning, when we conditioned the chamber and deposited nitride, the spots were lightened. But on the second day, the spots look enlarging again.

Can anyone please suggest solution to this issue?

Thanks,
-Vibhor Kumar-
Postdoctoral Associate
Rutgers, The State University of New Jersey.

________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________
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From vk409 at soe.rutgers.edu  Mon Aug 23 09:29:07 2021
From: vk409 at soe.rutgers.edu (Vibhor Kumar)
Date: Mon, 23 Aug 2021 13:29:07 +0000
Subject: [labnetwork] Spot issue in Unaxis-750 PECVD
In-Reply-To: <8a5f7379227b4885a0c8e578030bdf8b@draper.com>
References: <BYAPR14MB3221500E2F445EB0F14975CBA7C19@BYAPR14MB3221.namprd14.prod.outlook.com>
 <BL0PR07MB40502C948BC2B08A3A303395DFC19@BL0PR07MB4050.namprd07.prod.outlook.com>
 <8a5f7379227b4885a0c8e578030bdf8b@draper.com>
Message-ID: <BYAPR14MB32213647E69F697D00A4599EA7C49@BYAPR14MB3221.namprd14.prod.outlook.com>

Thank you everyone for sharing your experience!
Let me long purge the silane line to eliminate any dust and clean the shower head thoroughly.

Sincerely,
-Vibhor-

________________________________
From: April, Mark R. <mapril at draper.com>
Sent: Monday, August 23, 2021 5:48 AM
To: Paolini, Steven <spaolini at cns.fas.harvard.edu>; Vibhor Kumar <vk409 at soe.rutgers.edu>; labnetwork at mtl.mit.edu <labnetwork at mtl.mit.edu>
Subject: RE: Spot issue in Unaxis-750 PECVD


Good Morning Vibhor,

I concur with Mr. Paolini.  I had a similar issue on a PECVD tool.  After a thorough shower head clean, including the diffuser plate, the shower head pattern was eliminated.  This routinely gets done each year now, during a major PM.  You may need to perform more due to your usage.

Hope this helps.



Mark R. April
Senior  Equipment Engineer

Microfabrication Laboratory
[color_logo_small4]
555 Technology Square

Cambridge, MA  02139

mapril at draper.com<mailto:mapril at draper.com>

O # 617-258-1613 C # 617-455-1596

www.draper.com<https://nam02.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.draper.com%2F&data=04%7C01%7Cvk409%40soe.rutgers.edu%7Cd551b8506f35475f600808d96623847a%7Cb92d2b234d35447093ff69aca6632ffe%7C1%7C0%7C637653125005759886%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C1000&sdata=5sCFwHi8ivNfFMN5p2LK292njEgNwMJ9TSnpJ8g19Sk%3D&reserved=0>







From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Paolini, Steven
Sent: Friday, August 20, 2021 4:02 PM
To: Vibhor Kumar <vk409 at soe.rutgers.edu>; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Spot issue in Unaxis-750 PECVD



Vibhor,

  You are most likely seeing the effect of the showerhead being in need of cleaning, particularly the backside. The Deposition of dielectric films creates a powdery substance just outside of the intended plasma concentrate. This debris, over time, will allow small reactions to happen under the showerhead and show up as spots on your wafer, most likely in the pattern of the holes in the showerhead. I would suggest removing the showerhead and diffuser plate and performing a very thorough clean on all the parts. In my experience, and depending on the usage, this should be performed routinely at an interval that keeps the effect at bay.

  Hope this helps,

    Steve Paolini

   Equipment Dood



Steve Paolini

Principal Equipment Engineer

Harvard University Center for Nanoscale Systems

11 Oxford St.

Cambridge, MA 02138

617- 496- 9816

spaolini at cns.fas.harvard.edu<mailto:spaolini at cns.fas.harvard.edu>

www.cns.fas.harvard.edu<https://nam02.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.cns.fas.harvard.edu%2F&data=04%7C01%7Cvk409%40soe.rutgers.edu%7Cd551b8506f35475f600808d96623847a%7Cb92d2b234d35447093ff69aca6632ffe%7C1%7C0%7C637653125005769879%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C1000&sdata=gm9U%2BrOy3WNP7b5et0hNpJaadqxOR1nFlhi%2B5YvUU5Y%3D&reserved=0>



From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Vibhor Kumar
Sent: Friday, August 20, 2021 1:49 PM
To: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: [labnetwork] Spot issue in Unaxis-750 PECVD



Hello Everyone,



During nitride/oxide deposition with Unaxis-750 PECVD, we are getting a mirror image of shower head on the wafer, i.e., spots. We cleaned the chamber with CF4 for 2 consecutive days, each day 4:30 hrs. The conditions were



CF4 = 100 sccm, Temp = 250 C, chamber pressure = 600 mT, time = 4:30 hrs



We also evacuated the silane gas line, but there is no leakage.



After completing the cleaning, when we conditioned the chamber and deposited nitride, the spots were lightened. But on the second day, the spots look enlarging again.



Can anyone please suggest solution to this issue?



Thanks,

-Vibhor Kumar-

Postdoctoral Associate

Rutgers, The State University of New Jersey.



________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________
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From vk409 at soe.rutgers.edu  Mon Aug 23 09:40:43 2021
From: vk409 at soe.rutgers.edu (Vibhor Kumar)
Date: Mon, 23 Aug 2021 13:40:43 +0000
Subject: [labnetwork] Spot issue in Unaxis-750 PECVD
In-Reply-To: <BN8PR02MB5972F322B379B78C4185290A90C49@BN8PR02MB5972.namprd02.prod.outlook.com>
References: <BYAPR14MB3221500E2F445EB0F14975CBA7C19@BYAPR14MB3221.namprd14.prod.outlook.com>
 <BL0PR07MB40502C948BC2B08A3A303395DFC19@BL0PR07MB4050.namprd07.prod.outlook.com>
 <8a5f7379227b4885a0c8e578030bdf8b@draper.com>
 <BN8PR02MB5972F322B379B78C4185290A90C49@BN8PR02MB5972.namprd02.prod.outlook.com>
Message-ID: <BYAPR14MB322182C6938D4DAE0FCBF7CCA7C49@BYAPR14MB3221.namprd14.prod.outlook.com>

Hi David,
Nothing is changed recently.
We are using ULSI grade CF4.
For leak check, I have evacuated the silane gas line and found no leak. Is there any other method you would like to suggest?
Sure, I will discuss with my superiors and contact Plasma-Therm.

Thanks,
-Vibhor-




________________________________
From: Lishan, David (Plasma-Therm LLC) <david.lishan at plasmatherm.com>
Sent: Monday, August 23, 2021 8:29 AM
To: April, Mark R. <mapril at draper.com>; Paolini, Steven <spaolini at cns.fas.harvard.edu>; Vibhor Kumar <vk409 at soe.rutgers.edu>; labnetwork at mtl.mit.edu <labnetwork at mtl.mit.edu>
Subject: RE: Spot issue in Unaxis-750 PECVD


Hi Vibhor,

The imprint of the showerhead hole pattern is often an indication that silane is reacting with residual oxygen somewhere behind the showerhead.  The source of the oxygen could be a leak anywhere from behind the showerhead all the back to the main valves of the gas bottles.  If the CF4 clean gas is a premix of CF4/O2, it is possible that the oxygen is coming from there.  If there is small leak and the system has been left idle overnight, it is generally the first run of the day that shows the most pronounced imprint pattern.  Subsequent runs can show a less pronounced pattern.  Perhaps this is what has been described in the original problem statement.



Has anything been recently changed on the system e.g. silane gas bottle, mass flow controller or gas line?



Suggest contacting Plasma Therm Tech Support if the problem persists.



BR,

David



David Lishan, Ph.D., Sr. Member IEEE

Principal Scientist, Director ? Technical Marketing



[cid:image002.png at 01D79801.4E3A45B0]


mobile +1.727.251.9056

David.Lishan at plasmatherm.com<mailto:David.Lishan at plasmatherm.com> | plasmatherm.com<https://nam02.safelinks.protection.outlook.com/?url=http%3A%2F%2Fplasmatherm.com%2F&data=04%7C01%7Cvk409%40soe.rutgers.edu%7Cab24b92e084247df089f08d96639faaa%7Cb92d2b234d35447093ff69aca6632ffe%7C1%7C1%7C637653221471771066%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C1000&sdata=ZyT19HNNtR6kCAzQx7eEVule86p%2F5%2FcpsqqPTFrz4JU%3D&reserved=0>

10050 16th St. North | St. Petersburg, FL 33716 USA



From: labnetwork [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of April, Mark R.
Sent: Monday, August 23, 2021 6:48 AM
To: Paolini, Steven <spaolini at cns.fas.harvard.edu>; Vibhor Kumar <vk409 at soe.rutgers.edu>; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Spot issue in Unaxis-750 PECVD



CAUTION: This email originated from outside of the organization. Do not click links or open attachments unless you recognize the sender and know the content is safe.



Good Morning Vibhor,

I concur with Mr. Paolini.  I had a similar issue on a PECVD tool.  After a thorough shower head clean, including the diffuser plate, the shower head pattern was eliminated.  This routinely gets done each year now, during a major PM.  You may need to perform more due to your usage.

Hope this helps.



Mark R. April
Senior  Equipment Engineer

Microfabrication Laboratory
[color_logo_small4]
555 Technology Square

Cambridge, MA  02139

mapril at draper.com<mailto:mapril at draper.com>

O # 617-258-1613 C # 617-455-1596

www.draper.com<https://nam02.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.draper.com%2F&data=04%7C01%7Cvk409%40soe.rutgers.edu%7Cab24b92e084247df089f08d96639faaa%7Cb92d2b234d35447093ff69aca6632ffe%7C1%7C1%7C637653221471771066%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C1000&sdata=JcRSxo2MK3Sj0oWrgg0VeJsuoHX21OZEZxHkL4BERh0%3D&reserved=0>







From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Paolini, Steven
Sent: Friday, August 20, 2021 4:02 PM
To: Vibhor Kumar <vk409 at soe.rutgers.edu<mailto:vk409 at soe.rutgers.edu>>; labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] Spot issue in Unaxis-750 PECVD



Vibhor,

  You are most likely seeing the effect of the showerhead being in need of cleaning, particularly the backside. The Deposition of dielectric films creates a powdery substance just outside of the intended plasma concentrate. This debris, over time, will allow small reactions to happen under the showerhead and show up as spots on your wafer, most likely in the pattern of the holes in the showerhead. I would suggest removing the showerhead and diffuser plate and performing a very thorough clean on all the parts. In my experience, and depending on the usage, this should be performed routinely at an interval that keeps the effect at bay.

  Hope this helps,

    Steve Paolini

   Equipment Dood



Steve Paolini

Principal Equipment Engineer

Harvard University Center for Nanoscale Systems

11 Oxford St.

Cambridge, MA 02138

617- 496- 9816

spaolini at cns.fas.harvard.edu<mailto:spaolini at cns.fas.harvard.edu>

www.cns.fas.harvard.edu<https://nam02.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.cns.fas.harvard.edu%2F&data=04%7C01%7Cvk409%40soe.rutgers.edu%7Cab24b92e084247df089f08d96639faaa%7Cb92d2b234d35447093ff69aca6632ffe%7C1%7C1%7C637653221471781060%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C1000&sdata=8TusfKGQs7itySqAbVBk3CxvdM7sOSb5Aj7irbPrKDM%3D&reserved=0>



From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Vibhor Kumar
Sent: Friday, August 20, 2021 1:49 PM
To: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: [labnetwork] Spot issue in Unaxis-750 PECVD



Hello Everyone,



During nitride/oxide deposition with Unaxis-750 PECVD, we are getting a mirror image of shower head on the wafer, i.e., spots. We cleaned the chamber with CF4 for 2 consecutive days, each day 4:30 hrs. The conditions were



CF4 = 100 sccm, Temp = 250 C, chamber pressure = 600 mT, time = 4:30 hrs



We also evacuated the silane gas line, but there is no leakage.



After completing the cleaning, when we conditioned the chamber and deposited nitride, the spots were lightened. But on the second day, the spots look enlarging again.



Can anyone please suggest solution to this issue?



Thanks,

-Vibhor Kumar-

Postdoctoral Associate

Rutgers, The State University of New Jersey.



________________________________

Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.

________________________________
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From vamsinittala at gmail.com  Mon Aug 23 11:55:20 2021
From: vamsinittala at gmail.com (N P Vamsi Krishna)
Date: Mon, 23 Aug 2021 10:55:20 -0500
Subject: [labnetwork] Spot issue in Unaxis-750 PECVD
In-Reply-To: <8a5f7379227b4885a0c8e578030bdf8b@draper.com>
References: <BYAPR14MB3221500E2F445EB0F14975CBA7C19@BYAPR14MB3221.namprd14.prod.outlook.com>
 <BL0PR07MB40502C948BC2B08A3A303395DFC19@BL0PR07MB4050.namprd07.prod.outlook.com>
 <8a5f7379227b4885a0c8e578030bdf8b@draper.com>
Message-ID: <CA+SWD1WDtkbNAc7osOMubZ4jF-NACxgPc5-pNgvq3_WoUnweQQ@mail.gmail.com>

Hi Vibhor,
I agree with the previous responses, I also saw very similar probleam. Sand
blasting the shower head and its pores will resolve your issue.


Thanks & Regards,
vamsi


On Mon, Aug 23, 2021 at 6:38 AM April, Mark R. <mapril at draper.com> wrote:

> Good Morning Vibhor,
>
> I concur with Mr. Paolini.  I had a similar issue on a PECVD tool.  After
> a thorough shower head clean, including the diffuser plate, the shower head
> pattern was eliminated.  This routinely gets done each year now, during a
> major PM.  You may need to perform more due to your usage.
>
> Hope this helps.
>
>
>
> *Mark R. April*
> Senior  Equipment Engineer
>
> Microfabrication Laboratory
> [image: color_logo_small4]
> * 555 Technology Square*
>
> *Cambridge, MA  02139*
>
> *mapril at draper.com <mapril at draper.com>   *
>
> *O # 617-258-1613 C # 617-455-1596*
>
> *www.draper.com <http://www.draper.com/>*
>
>
>
>
>
>
>
> *From:* labnetwork <labnetwork-bounces at mtl.mit.edu> * On Behalf Of *Paolini,
> Steven
> *Sent:* Friday, August 20, 2021 4:02 PM
> *To:* Vibhor Kumar <vk409 at soe.rutgers.edu>; labnetwork at mtl.mit.edu
> *Subject:* Re: [labnetwork] Spot issue in Unaxis-750 PECVD
>
>
>
> Vibhor,
>
>   You are most likely seeing the effect of the showerhead being in need of
> cleaning, particularly the backside. The Deposition of dielectric films
> creates a powdery substance just outside of the intended plasma
> concentrate. This debris, over time, will allow small reactions to happen
> under the showerhead and show up as spots on your wafer, most likely in the
> pattern of the holes in the showerhead. I would suggest removing the
> showerhead and diffuser plate and performing a very thorough clean on all
> the parts. In my experience, and depending on the usage, this should be
> performed routinely at an interval that keeps the effect at bay.
>
>   Hope this helps,
>
>     Steve Paolini
>
>    Equipment Dood
>
>
>
> Steve Paolini
>
> Principal Equipment Engineer
>
> Harvard University Center for Nanoscale Systems
>
> 11 Oxford St.
>
> Cambridge, MA 02138
>
> 617- 496- 9816
>
> spaolini at cns.fas.harvard.edu
>
> www.cns.fas.harvard.edu
>
>
>
> *From:* labnetwork <labnetwork-bounces at mtl.mit.edu> *On Behalf Of *Vibhor
> Kumar
> *Sent:* Friday, August 20, 2021 1:49 PM
> *To:* labnetwork at mtl.mit.edu
> *Subject:* [labnetwork] Spot issue in Unaxis-750 PECVD
>
>
>
> Hello Everyone,
>
>
>
> During nitride/oxide deposition with *Unaxis-750 PECVD*, we are getting a
> mirror image of shower head on the wafer, i.e., spots. We cleaned the
> chamber with CF4 for 2 consecutive days, each day 4:30 hrs. The conditions
> were
>
>
>
> CF4 = 100 sccm, Temp = 250 C, chamber pressure = 600 mT, time = 4:30 hrs
>
>
>
> We also evacuated the silane gas line, but there is no leakage.
>
>
>
> After completing the cleaning, when we conditioned the chamber and
> deposited nitride, the spots were lightened. But on the second day, the
> spots look enlarging again.
>
>
>
> Can anyone please suggest solution to this issue?
>
>
>
> Thanks,
>
> -Vibhor Kumar-
>
> Postdoctoral Associate
>
> Rutgers, The State University of New Jersey.
>
>
> ------------------------------
> Notice: This email and any attachments may contain proprietary (Draper
> non-public) and/or export-controlled information of Draper. If you are not
> the intended recipient of this email, please immediately notify the sender
> by replying to this email and immediately destroy all copies of this email.
> ------------------------------
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>


-- 

___________________________________________________

N.P.  Vamsi Krishna, PhD

*Staff Scientist*

Pritzker School of Molecular Engineering, *The University of Chicago *

*Resident **Associate*

Center for Nanoscale Materials, *Argonne National Laboratory *

Phone: 1 (331) 757-8565
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From lavathedon at gmail.com  Mon Aug 23 12:32:47 2021
From: lavathedon at gmail.com (Lavendra)
Date: Mon, 23 Aug 2021 11:32:47 -0500
Subject: [labnetwork] Spot issue in Unaxis-750 PECVD
In-Reply-To: <BYAPR14MB32213647E69F697D00A4599EA7C49@BYAPR14MB3221.namprd14.prod.outlook.com>
References: <BYAPR14MB3221500E2F445EB0F14975CBA7C19@BYAPR14MB3221.namprd14.prod.outlook.com>
 <BL0PR07MB40502C948BC2B08A3A303395DFC19@BL0PR07MB4050.namprd07.prod.outlook.com>
 <8a5f7379227b4885a0c8e578030bdf8b@draper.com>
 <BYAPR14MB32213647E69F697D00A4599EA7C49@BYAPR14MB3221.namprd14.prod.outlook.com>
Message-ID: <CA+2eZC4r30bKb-Ce6ts3svXER_w8v2x=qGUGThw+jp-jBy+mxg@mail.gmail.com>

Hi Vibhor,

Adding one more possibility to the previous comments,
showerhead holes get etched and expand in the long run, even the tiniest
changes in these holes can cause these patterned spots (usually in the
center area). By changing the showerhead can solve this issue, if not you
can change the process (without change in RI) with DOE in reducing Silane
flow and reducing RF power.
Goodluck

Best,

*Lavendra Mandyam*

*Research Engineer*

*Nick Holonyak, Jr. Micro and Nanotechnology Laboratory*

University of Illinois at Urbana-Champaign

Rm 2300, MC-249

208 North Wright Street *|* Urbana, IL 61801

Phone (217)300-4639 *| *fax: 217 244 6375

Email  Lavendra at illinois.edu

Web: http://mntl.illinois.edu/


On Mon, Aug 23, 2021 at 11:14 AM Vibhor Kumar <vk409 at soe.rutgers.edu> wrote:

> Thank you everyone for sharing your experience!
> Let me long purge the silane line to eliminate any dust and clean the
> shower head thoroughly.
>
> Sincerely,
> -Vibhor-
>
> ------------------------------
> *From:* April, Mark R. <mapril at draper.com>
> *Sent:* Monday, August 23, 2021 5:48 AM
> *To:* Paolini, Steven <spaolini at cns.fas.harvard.edu>; Vibhor Kumar <
> vk409 at soe.rutgers.edu>; labnetwork at mtl.mit.edu <labnetwork at mtl.mit.edu>
> *Subject:* RE: Spot issue in Unaxis-750 PECVD
>
>
> Good Morning Vibhor,
>
> I concur with Mr. Paolini.  I had a similar issue on a PECVD tool.  After
> a thorough shower head clean, including the diffuser plate, the shower head
> pattern was eliminated.  This routinely gets done each year now, during a
> major PM.  You may need to perform more due to your usage.
>
> Hope this helps.
>
>
>
> *Mark R. April*
> Senior  Equipment Engineer
>
> Microfabrication Laboratory
> [image: color_logo_small4]
> * 555 Technology Square*
>
> *Cambridge, MA  02139*
>
> *mapril at draper.com <mapril at draper.com>   *
>
> *O # 617-258-1613 C # 617-455-1596*
>
> *www.draper.com
> <https://nam02.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.draper.com%2F&data=04%7C01%7Cvk409%40soe.rutgers.edu%7Cd551b8506f35475f600808d96623847a%7Cb92d2b234d35447093ff69aca6632ffe%7C1%7C0%7C637653125005759886%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C1000&sdata=5sCFwHi8ivNfFMN5p2LK292njEgNwMJ9TSnpJ8g19Sk%3D&reserved=0>*
>
>
>
>
>
>
>
> *From:* labnetwork <labnetwork-bounces at mtl.mit.edu> * On Behalf Of *Paolini,
> Steven
> *Sent:* Friday, August 20, 2021 4:02 PM
> *To:* Vibhor Kumar <vk409 at soe.rutgers.edu>; labnetwork at mtl.mit.edu
> *Subject:* Re: [labnetwork] Spot issue in Unaxis-750 PECVD
>
>
>
> Vibhor,
>
>   You are most likely seeing the effect of the showerhead being in need of
> cleaning, particularly the backside. The Deposition of dielectric films
> creates a powdery substance just outside of the intended plasma
> concentrate. This debris, over time, will allow small reactions to happen
> under the showerhead and show up as spots on your wafer, most likely in the
> pattern of the holes in the showerhead. I would suggest removing the
> showerhead and diffuser plate and performing a very thorough clean on all
> the parts. In my experience, and depending on the usage, this should be
> performed routinely at an interval that keeps the effect at bay.
>
>   Hope this helps,
>
>     Steve Paolini
>
>    Equipment Dood
>
>
>
> Steve Paolini
>
> Principal Equipment Engineer
>
> Harvard University Center for Nanoscale Systems
>
> 11 Oxford St.
>
> Cambridge, MA 02138
>
> 617- 496- 9816
>
> spaolini at cns.fas.harvard.edu
>
> www.cns.fas.harvard.edu
> <https://nam02.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.cns.fas.harvard.edu%2F&data=04%7C01%7Cvk409%40soe.rutgers.edu%7Cd551b8506f35475f600808d96623847a%7Cb92d2b234d35447093ff69aca6632ffe%7C1%7C0%7C637653125005769879%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C1000&sdata=gm9U%2BrOy3WNP7b5et0hNpJaadqxOR1nFlhi%2B5YvUU5Y%3D&reserved=0>
>
>
>
> *From:* labnetwork <labnetwork-bounces at mtl.mit.edu> *On Behalf Of *Vibhor
> Kumar
> *Sent:* Friday, August 20, 2021 1:49 PM
> *To:* labnetwork at mtl.mit.edu
> *Subject:* [labnetwork] Spot issue in Unaxis-750 PECVD
>
>
>
> Hello Everyone,
>
>
>
> During nitride/oxide deposition with *Unaxis-750 PECVD*, we are getting a
> mirror image of shower head on the wafer, i.e., spots. We cleaned the
> chamber with CF4 for 2 consecutive days, each day 4:30 hrs. The conditions
> were
>
>
>
> CF4 = 100 sccm, Temp = 250 C, chamber pressure = 600 mT, time = 4:30 hrs
>
>
>
> We also evacuated the silane gas line, but there is no leakage.
>
>
>
> After completing the cleaning, when we conditioned the chamber and
> deposited nitride, the spots were lightened. But on the second day, the
> spots look enlarging again.
>
>
>
> Can anyone please suggest solution to this issue?
>
>
>
> Thanks,
>
> -Vibhor Kumar-
>
> Postdoctoral Associate
>
> Rutgers, The State University of New Jersey.
>
>
> ------------------------------
> Notice: This email and any attachments may contain proprietary (Draper
> non-public) and/or export-controlled information of Draper. If you are not
> the intended recipient of this email, please immediately notify the sender
> by replying to this email and immediately destroy all copies of this email.
> ------------------------------
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From vk409 at soe.rutgers.edu  Tue Aug 24 11:18:04 2021
From: vk409 at soe.rutgers.edu (Vibhor Kumar)
Date: Tue, 24 Aug 2021 15:18:04 +0000
Subject: [labnetwork] Spot issue in Unaxis-750 PECVD
In-Reply-To: <CA+2eZC4r30bKb-Ce6ts3svXER_w8v2x=qGUGThw+jp-jBy+mxg@mail.gmail.com>
References: <BYAPR14MB3221500E2F445EB0F14975CBA7C19@BYAPR14MB3221.namprd14.prod.outlook.com>
 <BL0PR07MB40502C948BC2B08A3A303395DFC19@BL0PR07MB4050.namprd07.prod.outlook.com>
 <8a5f7379227b4885a0c8e578030bdf8b@draper.com>
 <BYAPR14MB32213647E69F697D00A4599EA7C49@BYAPR14MB3221.namprd14.prod.outlook.com>
 <CA+2eZC4r30bKb-Ce6ts3svXER_w8v2x=qGUGThw+jp-jBy+mxg@mail.gmail.com>
Message-ID: <BYAPR14MB3221E6FD5368873D5DD58327A7C59@BYAPR14MB3221.namprd14.prod.outlook.com>

Thanks again, Everyone!
Glad to have such unmatched support from Labnetwork community.

Sincerely,
-Vibhor-

________________________________
From: Lavendra <lavathedon at gmail.com>
Sent: Monday, August 23, 2021 11:32 AM
To: Vibhor Kumar <vk409 at soe.rutgers.edu>
Cc: labnetwork at mtl.mit.edu <labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] Spot issue in Unaxis-750 PECVD

Hi Vibhor,

Adding one more possibility to the previous comments,
showerhead holes get etched and expand in the long run, even the tiniest changes in these holes can cause these patterned spots (usually in the center area). By changing the showerhead can solve this issue, if not you can change the process (without change in RI) with DOE in reducing Silane flow and reducing RF power.
Goodluck

Best,

Lavendra Mandyam

Research Engineer

Nick Holonyak, Jr. Micro and Nanotechnology Laboratory

University of Illinois at Urbana-Champaign

Rm 2300, MC-249

208 North Wright Street | Urbana, IL 61801

Phone (217)300-4639 | fax: 217 244 6375

Email  Lavendra at illinois.edu<mailto:Lavendra at illinois.edu>

Web: http://mntl.illinois.edu/<https://nam02.safelinks.protection.outlook.com/?url=http%3A%2F%2Fmntl.illinois.edu%2F&data=04%7C01%7Cvk409%40soe.rutgers.edu%7Cae84f0c1a1704b4571c408d96653abe5%7Cb92d2b234d35447093ff69aca6632ffe%7C1%7C0%7C637653331821309026%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C1000&sdata=4oZesxrGH4C%2BXYj5qTF7hC31uqLvdisjYevCvcBTaMg%3D&reserved=0>

[X]

On Mon, Aug 23, 2021 at 11:14 AM Vibhor Kumar <vk409 at soe.rutgers.edu<mailto:vk409 at soe.rutgers.edu>> wrote:
Thank you everyone for sharing your experience!
Let me long purge the silane line to eliminate any dust and clean the shower head thoroughly.

Sincerely,
-Vibhor-

________________________________
From: April, Mark R. <mapril at draper.com<mailto:mapril at draper.com>>
Sent: Monday, August 23, 2021 5:48 AM
To: Paolini, Steven <spaolini at cns.fas.harvard.edu<mailto:spaolini at cns.fas.harvard.edu>>; Vibhor Kumar <vk409 at soe.rutgers.edu<mailto:vk409 at soe.rutgers.edu>>; labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu> <labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>>
Subject: RE: Spot issue in Unaxis-750 PECVD


Good Morning Vibhor,

I concur with Mr. Paolini.  I had a similar issue on a PECVD tool.  After a thorough shower head clean, including the diffuser plate, the shower head pattern was eliminated.  This routinely gets done each year now, during a major PM.  You may need to perform more due to your usage.

Hope this helps.



Mark R. April
Senior  Equipment Engineer

Microfabrication Laboratory
[color_logo_small4]
555 Technology Square

Cambridge, MA  02139

mapril at draper.com<mailto:mapril at draper.com>

O # 617-258-1613 C # 617-455-1596

www.draper.com<https://nam02.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.draper.com%2F&data=04%7C01%7Cvk409%40soe.rutgers.edu%7Cae84f0c1a1704b4571c408d96653abe5%7Cb92d2b234d35447093ff69aca6632ffe%7C1%7C0%7C637653331821319018%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C1000&sdata=MhDlzcY6d6Qz1vLzHIR3PnSWQLzHkTYSgo1l3nLpPq4%3D&reserved=0>







From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Paolini, Steven
Sent: Friday, August 20, 2021 4:02 PM
To: Vibhor Kumar <vk409 at soe.rutgers.edu<mailto:vk409 at soe.rutgers.edu>>; labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] Spot issue in Unaxis-750 PECVD



Vibhor,

  You are most likely seeing the effect of the showerhead being in need of cleaning, particularly the backside. The Deposition of dielectric films creates a powdery substance just outside of the intended plasma concentrate. This debris, over time, will allow small reactions to happen under the showerhead and show up as spots on your wafer, most likely in the pattern of the holes in the showerhead. I would suggest removing the showerhead and diffuser plate and performing a very thorough clean on all the parts. In my experience, and depending on the usage, this should be performed routinely at an interval that keeps the effect at bay.

  Hope this helps,

    Steve Paolini

   Equipment Dood



Steve Paolini

Principal Equipment Engineer

Harvard University Center for Nanoscale Systems

11 Oxford St.

Cambridge, MA 02138

617- 496- 9816

spaolini at cns.fas.harvard.edu<mailto:spaolini at cns.fas.harvard.edu>

www.cns.fas.harvard.edu<https://nam02.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.cns.fas.harvard.edu%2F&data=04%7C01%7Cvk409%40soe.rutgers.edu%7Cae84f0c1a1704b4571c408d96653abe5%7Cb92d2b234d35447093ff69aca6632ffe%7C1%7C0%7C637653331821319018%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C1000&sdata=QJLeIOjDp82%2Fpjid2SBMPODOykEK76r96fW5MzIqn2o%3D&reserved=0>



From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Vibhor Kumar
Sent: Friday, August 20, 2021 1:49 PM
To: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: [labnetwork] Spot issue in Unaxis-750 PECVD



Hello Everyone,



During nitride/oxide deposition with Unaxis-750 PECVD, we are getting a mirror image of shower head on the wafer, i.e., spots. We cleaned the chamber with CF4 for 2 consecutive days, each day 4:30 hrs. The conditions were



CF4 = 100 sccm, Temp = 250 C, chamber pressure = 600 mT, time = 4:30 hrs



We also evacuated the silane gas line, but there is no leakage.



After completing the cleaning, when we conditioned the chamber and deposited nitride, the spots were lightened. But on the second day, the spots look enlarging again.



Can anyone please suggest solution to this issue?



Thanks,

-Vibhor Kumar-

Postdoctoral Associate

Rutgers, The State University of New Jersey.



________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________
_______________________________________________
labnetwork mailing list
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From msinani at purdue.edu  Tue Aug 24 12:30:30 2021
From: msinani at purdue.edu (Michael Dimitri Sinanis)
Date: Tue, 24 Aug 2021 16:30:30 +0000
Subject: [labnetwork] Micromachining rutile TiO2
In-Reply-To: <CH2PR22MB20073722607283013FA673FCDCC59@CH2PR22MB2007.namprd22.prod.outlook.com>
References: <CH2PR22MB20073722607283013FA673FCDCC59@CH2PR22MB2007.namprd22.prod.outlook.com>
Message-ID: <CH2PR22MB2007305EE889AEDA7F5D486DDCC59@CH2PR22MB2007.namprd22.prod.outlook.com>


Colleagues,

Does anyone have experience etching thick substrates (up to 500 microns) of Rutile TiO2?
Micromachining in general? If possible to point out any work done out there?

Best,

Michael Sinanis
Purdue University

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From savithap at iisc.ac.in  Thu Aug 26 03:05:27 2021
From: savithap at iisc.ac.in (Savitha P)
Date: Thu, 26 Aug 2021 07:05:27 +0000
Subject: [labnetwork] Open Position at National Nanofabrication Centre, IISc,
 India
In-Reply-To: <MA1PR01MB39958FB965C1283A10693DE4EFC59@MA1PR01MB3995.INDPRD01.PROD.OUTLOOK.COM>
References: <MA1PR01MB39958FB965C1283A10693DE4EFC59@MA1PR01MB3995.INDPRD01.PROD.OUTLOOK.COM>
Message-ID: <MA1PR01MB399561DABDEA4A413135F33DEFC79@MA1PR01MB3995.INDPRD01.PROD.OUTLOOK.COM>

Dear Colleagues:



We have an open position of  a Technology Manager for Dry and Wet etch bays at National Nanofabrication Centre, Centre for Nanoscience and Engineering,  Indian Institute of Science, India. Further details regarding the job posting could be found here.

http://www.cense.iisc.ac.in/content/careers



Please feel free to contact me if anyone needs more details regarding the opening.



Regards,



Savitha



Dr.Savitha P

Chief Operating Officer

National Nanofabrication Centre

Centre for Nanoscience and Engineering

Indian Institute of Science

India ? 560012

www.cense.iisc.ac.in<http://www.cense.iisc.ac.in>

www.nnfc.cense.iisc.ac.in





Sent from Mail<https://go.microsoft.com/fwlink/?LinkId=550986> for Windows


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From na2661 at columbia.edu  Thu Aug 26 09:49:03 2021
From: na2661 at columbia.edu (Nava Ariel-Sternberg)
Date: Thu, 26 Aug 2021 09:49:03 -0400
Subject: [labnetwork] CH2F2 detection
Message-ID: <009a01d79a81$21fdd160$65f97420$@columbia.edu>

Dear all, 

I hope that you had a good summer and returning to a certain level of
normalcy in your corner of the world. 

I'm writing to ask about CH2F2 detection. Which sensor are you using for
CH2F2 detection? We get false alarms whenever someone is using IPA in a
certain proximity of the sensor (e.g. during a PM chamber cleaning). If you
have any recommendations to reduce false alarms related to CH2F2 detection
that would be highly appreciated!

Stay safe,

Nava

 

 

Nava Ariel-Sternberg, Ph.D.

Director of CNI Shared Labs

Columbia University

CEPSR/MC 8903 

530 west 120th st. NY

NY 10027

Office: 212-8549927

Cell: 201-5627600

 

 

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From price.798 at osu.edu  Thu Aug 26 11:04:05 2021
From: price.798 at osu.edu (Price, Aimee)
Date: Thu, 26 Aug 2021 15:04:05 +0000
Subject: [labnetwork] Job Opportunity - Fab Engineer at SK Infrared
Message-ID: <CH0PR01MB71392CBF779D3AA8BEEF596EBCC79@CH0PR01MB7139.prod.exchangelabs.com>

Good morning Lab Network,
Please share with your networks.  SK Infrared has a job opening for an experienced fabrication/product engineer for a US Citizen or Permanent Resident.  See attached for details and contact information.

Best,
Aimee Bross Price

Manager, Nanofabrication
The Ohio State University
Nanotech West Lab
Institute for Materials Research
1381 Kinnear Road
Suite 100
Columbus, OH 43212
614-292-2753

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From cschnitzer at stonehill.edu  Thu Aug 26 13:10:26 2021
From: cschnitzer at stonehill.edu (Schnitzer, Cheryl)
Date: Thu, 26 Aug 2021 17:10:26 +0000
Subject: [labnetwork] Job opening: Full-time Photonics Lab Manager
Message-ID: <PAXPR01MB8202A7843114FFEBF7D475F2C7C79@PAXPR01MB8202.eurprd01.prod.exchangelabs.com>

Hi,

Please share this in your networks.

Job opening for immediate employment as a full-time Photonics Lab in a state-of-the art lab at Stonehill College in Easton, MA,
Stonehill College Employment Site | Photonics Lab Manager<https://jobs.stonehill.edu/postings/21576>.

Please let me know if you have any questions.

Thanks,
Cheryl
__________________________
Cheryl Schnitzer, Ph.D.
* Professor, Department of Chemistry, Stonehill College
* co-PI, LEAP, Advanced Manufacturing & Integrated Photonics (AMIP) Technician Certificate Program
* Chair, Environmental Stewardship Council
Pronouns: she/her/hers
Good chemistry requires all of our elements. The Department of Chemistry and the Biochemistry Program value the perspectives, experiences, and identities of each and every individual.


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From deonc69 at illinois.edu  Fri Aug 27 11:03:12 2021
From: deonc69 at illinois.edu (Collins, Deon)
Date: Fri, 27 Aug 2021 15:03:12 +0000
Subject: [labnetwork] CH2F2 detection
In-Reply-To: <009a01d79a81$21fdd160$65f97420$@columbia.edu>
References: <009a01d79a81$21fdd160$65f97420$@columbia.edu>
Message-ID: <SN6PR11MB316816FA700C1BFB0906ED42D7C89@SN6PR11MB3168.namprd11.prod.outlook.com>

The problem is occurring due to the detection equipment cross referencing chemicals. We use a DOD PS-7 detection system. The system has the same shortcoming.

My suggestion would be to do a complete shakedown of the area with a mobile detection system before opening the chamber.  Once you have determined the levels in the surrounding area are clear I would put that channel in standby. You can rely on the remote unit for toxicity levels during the cleaning procedure.

From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Nava Ariel-Sternberg
Sent: Thursday, August 26, 2021 8:49 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] CH2F2 detection

Dear all,
I hope that you had a good summer and returning to a certain level of normalcy in your corner of the world.
I'm writing to ask about CH2F2 detection. Which sensor are you using for CH2F2 detection? We get false alarms whenever someone is using IPA in a certain proximity of the sensor (e.g. during a PM chamber cleaning). If you have any recommendations to reduce false alarms related to CH2F2 detection that would be highly appreciated!
Stay safe,
Nava


Nava Ariel-Sternberg, Ph.D.
Director of CNI Shared Labs
Columbia University
CEPSR/MC 8903
530 west 120th st. NY
NY 10027
Office: 212-8549927
Cell: 201-5627600


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From betemc at rit.edu  Tue Aug 31 08:24:29 2021
From: betemc at rit.edu (Bruce Tolleson)
Date: Tue, 31 Aug 2021 12:24:29 +0000
Subject: [labnetwork] LPCVD for college lab
Message-ID: <675453aaa186400eb879b396f97448ca@ex04mail01a.ad.rit.edu>

Dear Labnetwork,
  We are looking at replacing our older LPCVD system with a new system.  We have looked at several systems but most are production units. We are a research and undergraduate lab.  Footprint, cost and ease of operation are more of a priority than throughput.
Does anyone recommend a new system that would fit better?
Thank you,

Bruce E. Tolleson
Rochester Institute of Technology
82  Lomb Memorial Drive, Bldg 17-2627
Rochester, NY 14623-5604
(585) 478-3836
[http://www.rit.edu/~962www/logos/tiger_walking_rit_color.jpg]

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From rmorrison at draper.com  Tue Aug 31 13:03:33 2021
From: rmorrison at draper.com (Morrison, Richard H., Jr)
Date: Tue, 31 Aug 2021 17:03:33 +0000
Subject: [labnetwork] LPCVD for college lab
In-Reply-To: <675453aaa186400eb879b396f97448ca@ex04mail01a.ad.rit.edu>
References: <675453aaa186400eb879b396f97448ca@ex04mail01a.ad.rit.edu>
Message-ID: <333419bc23524ec789c8aecef24d0214@draper.com>

How many tubes are you looking to replace?

Back in 2014 we researched LPCVD/Diffusion.

Expertech , makes single tube that you can stack good option
Centrotherm
Sandvik/MRL
Tempress
Thermco
Tylan

We chose Sandvik/MRL due to the fact that we had MRL tubes and had a good relationship with local sales/service. We bought a 3 stack for Oxide anneal and a 3 stack LPCVD both stacks has loaders, it was north of a $1M ,but right now prices are sky high and lead times are really out there so be prepared.

Rick


Richard Morrison
PMTS
Draper Laboratory
555 Technology Square
Cambridge Ma  02139
Office: 617-258-3420
Cell: 508-930-3461



From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Bruce Tolleson
Sent: Tuesday, August 31, 2021 8:24 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] LPCVD for college lab

Dear Labnetwork,
  We are looking at replacing our older LPCVD system with a new system.  We have looked at several systems but most are production units. We are a research and undergraduate lab.  Footprint, cost and ease of operation are more of a priority than throughput.
Does anyone recommend a new system that would fit better?
Thank you,

Bruce E. Tolleson
Rochester Institute of Technology
82  Lomb Memorial Drive, Bldg 17-2627
Rochester, NY 14623-5604
(585) 478-3836
[http://www.rit.edu/~962www/logos/tiger_walking_rit_color.jpg]

________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________
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