From diadiuk at mit.edu Wed Dec 1 13:18:16 2021 From: diadiuk at mit.edu (Vicky Diadiuk) Date: Wed, 1 Dec 2021 18:18:16 +0000 Subject: [labnetwork] Hot Phosphoric Wet Bench looking for new home References: <2f9fddb75e5948529acad1fdecd79023@oc11expo19.exchange.mit.edu> Message-ID: <99991FF2-4077-4951-97F7-9A256758A7EF@mit.edu> Hi, We have an old but fully functional Wet Bench that we used for Hot Phosphoric. It?s decontaminated, decommissioned & available. Pls answer me directly if you are interested in it. Vicky Diadiuk -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: IMG_0313.JPG Type: image/jpeg Size: 4230799 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: IMG_0314.JPG Type: image/jpeg Size: 4910440 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: IMG_0315.JPG Type: image/jpeg Size: 4573976 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: smime.p7s Type: application/pkcs7-signature Size: 1841 bytes Desc: not available URL: From kpayer at mit.edu Thu Dec 2 08:23:23 2021 From: kpayer at mit.edu (Kristofor Robert Payer) Date: Thu, 2 Dec 2021 13:23:23 +0000 Subject: [labnetwork] Job Opening, Research Specialist, MIT.nano Message-ID: Hello, We have a job opening for a Diffusion and ALD Research Specialist at MIT.nano, details and links below: RESEARCH SPECIALIST, MIT.nano, to be primarily responsible for the operation, training, and maintenance of research equipment within the MIT.nano facility. Will focus on atomic layer deposition (ALD) and diffusion process equipment. Equipment in this area will include thermal and plasma ALD tools, atmospheric and low-pressure chemical vapor deposition (LPCVD) furnaces, and rapid thermal annealing (RTA) tools. Expertise should extend to support equipment including vacuum systems, chillers, gas delivery equipment, and abatement systems associated with that primary tooling. Job Requirements REQUIRED: B.S. in chemical/mechanical/electrical engineering, physics, chemistry, or related discipline; at least five years? experience in semiconductor process facilities; experience with maintenance, operation, and theory of operation of semiconductor diffusion furnaces and atomic-layer deposition equipment and processes; broad knowledge of general laboratory and cleanroom protocols and operation; excellent interpersonal and written and oral communication skills; ability to work independently in a lab environment and regularly interface with colleagues/users in a collaborative manner; interest in training the user community; ability to function effectively in a highly research-oriented yet disciplined environment that requires frequent interaction with faculty, students, and research staff. PREFERRED: PE and HAZWOPER certifications; knowledge of chemical hazards and reactivity; working knowledge of established and emerging research processes and ability to assist researchers with experimental design; experience training in one-on-one interactions or large groups and ability to convey complex ideas to personnel with diverse backgrounds and education experience; experience using computational software (e.g., Mathematica, MATLAB, Maple) and computer-aided design and modeling software (e.g., T-CAD, AutoCAD); and proficiency with document and data management tools (e.g., Microsoft SharePoint sites, Wikis, QuickBase). Job #20471 Link to posting and additional details: https://careers.peopleclick.com/careerscp/client_mit/external/jobDetails/jobDetail.html?jobPostId=22391&localeCode=en-us https://hr.mit.edu/careers Kristofor Payer Assistant Director of Operations MIT.nano Massachusetts Institute of Technology 60 Vassar Street 12-4011 Cambridge, MA 02139 617-324-1469 kpayer at mit.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From manish.keswani01 at gmail.com Fri Dec 3 20:24:00 2021 From: manish.keswani01 at gmail.com (Manish Keswani) Date: Fri, 3 Dec 2021 17:24:00 -0800 Subject: [labnetwork] Liquid nitrogen and argon shortage Message-ID: Hello everyone, We just learned that there is a severe shortage of liquid nitrogen and argon in the US. Our entire lab will be impacted by this and we will need to evaluate consumption of these gases for different tools in our Nano fabrication center and make priority for tools usage based on that. Nitrogen is used as a purge gas for pumps and equipment and we will be looking into tools that consume significant amount of nitrogen and how to minimize their use or use them more efficiently. If you have any thoughts or ideas that will help with this issue, please share them. Thanks, Manish Sent from my iPhone From na2661 at columbia.edu Sat Dec 4 10:12:36 2021 From: na2661 at columbia.edu (Nava Ariel-Sternberg) Date: Sat, 04 Dec 2021 10:12:36 -0500 Subject: [labnetwork] Liquid nitrogen and argon shortage In-Reply-To: Message-ID: <61ab8565.1c69fb81.78f4e.e22c@mx.google.com> Hi Manish,Would you mind sharing how did you learn about the shortage?Thanks,NavaSent from my Galaxy -------- Original message --------From: Manish Keswani Date: 12/4/21 8:20 AM (GMT-05:00) To: labnetwork at mtl.mit.edu Subject: [labnetwork] Liquid nitrogen and argon shortage Hello everyone,We just learned that there is a severe shortage of liquid nitrogen and argon in the US. Our entire lab will be impacted by this and we will need to evaluate consumption of these gases for different tools in our Nano fabrication center and make priority for tools usage based on that. Nitrogen is used as a purge gas for pumps and equipment and we will be looking into tools that consume significant amount of nitrogen and how to minimize their use or use them more efficiently.If you have any thoughts or ideas that will help with this issue, please share them.Thanks,ManishSent from my iPhone_______________________________________________labnetwork mailing listlabnetwork at mtl.mit.eduhttps://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From odc1n08 at soton.ac.uk Sat Dec 4 10:33:20 2021 From: odc1n08 at soton.ac.uk (Owain Clark) Date: Sat, 4 Dec 2021 15:33:20 +0000 Subject: [labnetwork] Liquid nitrogen and argon shortage In-Reply-To: References: Message-ID: First I've heard of it potentially but with the last 2 years in general I am not at all surprised. Probably the best things to do are install N2 saving kits on all dry pumps that use a purge. These only turn on N2 when in process and then shut off after process finish + a timed setpoint. At 25-35slm 2 per typical dry pump for PECD/LPCVD savings it add up quickly. Then I would tune furnace n2 standby purges down, or mothball some furnaces as they are also a big consumer. O. -----Original Message----- From: labnetwork On Behalf Of Manish Keswani Sent: 04 December 2021 01:24 To: labnetwork at mtl.mit.edu Subject: [labnetwork] Liquid nitrogen and argon shortage CAUTION: This e-mail originated outside the University of Southampton. Hello everyone, We just learned that there is a severe shortage of liquid nitrogen and argon in the US. Our entire lab will be impacted by this and we will need to evaluate consumption of these gases for different tools in our Nano fabrication center and make priority for tools usage based on that. Nitrogen is used as a purge gas for pumps and equipment and we will be looking into tools that consume significant amount of nitrogen and how to minimize their use or use them more efficiently. If you have any thoughts or ideas that will help with this issue, please share them. Thanks, Manish Sent from my iPhone _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://eur03.safelinks.protection.outlook.com/?url=https%3A%2F%2Fmtl.mit.edu%2Fmailman%2Flistinfo.cgi%2Flabnetwork&data=04%7C01%7Codc1n08%40soton.ac.uk%7C184a711d7cf340c266e308d9b728fc11%7C4a5378f929f44d3ebe89669d03ada9d8%7C0%7C0%7C637742208916076465%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C3000&sdata=PieD83hftn7iuQrsFoXEo75nXp7JcyZj88%2FYj3uqaRM%3D&reserved=0 From jtmitch5 at ncsu.edu Sat Dec 4 10:50:04 2021 From: jtmitch5 at ncsu.edu (James Mitchell) Date: Sat, 4 Dec 2021 10:50:04 -0500 Subject: [labnetwork] Liquid nitrogen and argon shortage In-Reply-To: References: Message-ID: You could look into an N2 generator. We have 2 systems. They need about 100 psi of CDA. Jim On Sat, Dec 4, 2021, 8:20 AM Manish Keswani wrote: > Hello everyone, > > We just learned that there is a severe shortage of liquid nitrogen and > argon in the US. Our entire lab will be impacted by this and we will need > to evaluate consumption of these gases for different tools in our Nano > fabrication center and make priority for tools usage based on that. > Nitrogen is used as a purge gas for pumps and equipment and we will be > looking into tools that consume significant amount of nitrogen and how to > minimize their use or use them more efficiently. > > If you have any thoughts or ideas that will help with this issue, please > share them. > > Thanks, > Manish > > Sent from my iPhone > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From shimonel at savion.huji.ac.il Sat Dec 4 12:04:54 2021 From: shimonel at savion.huji.ac.il (Shimon Eliav) Date: Sat, 4 Dec 2021 17:04:54 +0000 Subject: [labnetwork] Liquid nitrogen and argon shortage In-Reply-To: References: Message-ID: Hi Manish, Some months ago we introduced a Nitrogen Generator in our system. It didn't replace our original LN2 tank, but complemented it. All the purge gas for pumps is now supplied by this generator. In case of some technical problem happens we still have the N2 from the LN2 tank as backup. Regards, Shimon The Hebrew University of Jerusalem The Unit for Nano Fabrication Jerusalem - ISRAEL -----Original Message----- From: labnetwork [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Manish Keswani Sent: Saturday, 4 December 2021 3:24 To: labnetwork at mtl.mit.edu Subject: [labnetwork] Liquid nitrogen and argon shortage Hello everyone, We just learned that there is a severe shortage of liquid nitrogen and argon in the US. Our entire lab will be impacted by this and we will need to evaluate consumption of these gases for different tools in our Nano fabrication center and make priority for tools usage based on that. Nitrogen is used as a purge gas for pumps and equipment and we will be looking into tools that consume significant amount of nitrogen and how to minimize their use or use them more efficiently. If you have any thoughts or ideas that will help with this issue, please share them. Thanks, Manish Sent from my iPhone _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From mweiler at andrew.cmu.edu Sat Dec 4 19:46:51 2021 From: mweiler at andrew.cmu.edu (Mark Weiler) Date: Sat, 4 Dec 2021 19:46:51 -0500 Subject: [labnetwork] Liquid nitrogen and argon shortage In-Reply-To: References: Message-ID: Hi Manish, It may be more related to a transport issue as described in article linked below... https://spacenews.com/liquid-nitrogen-shortage-delays-landsat-9-launch/ ... we have certainly had our own issues with its delivery, a lack of drivers, and changes to how our supplier operates. Best Regards, Mark ________________________________________________________________ Mark Weiler Manager, Equipment & Facilites Bertucci Nanotechnology Laboratory Eden Hall Cleanroom Carnegie Mellon University P: 412-268-2471 F: 412-268-3497 http://www.nanofab.ece.cmu.edu "Be kind; everyone is on their own journey." Daniel Ek Sent from my iPhone > On Dec 4, 2021, at 3:41 PM, Shimon Eliav wrote: > > ? > Hi Manish, > > Some months ago we introduced a Nitrogen Generator in our system. It didn?t replace our original LN2 tank, but complemented it. All the purge gas for pumps is now supplied by this generator. In case of some technical problem happens we still have the N2 from the LN2 tank as backup. > Regards, > > Shimon > The Hebrew University of Jerusalem > The Unit for Nano Fabrication > Jerusalem - ISRAEL > > -----Original Message----- > From: labnetwork [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Manish Keswani > Sent: Saturday, 4 December 2021 3:24 > To: labnetwork at mtl.mit.edu > Subject: [labnetwork] Liquid nitrogen and argon shortage > > Hello everyone, > > We just learned that there is a severe shortage of liquid nitrogen and argon in the US. Our entire lab will be impacted by this and we will need to evaluate consumption of these gases for different tools in our Nano fabrication center and make priority for tools usage based on that. Nitrogen is used as a purge gas for pumps and equipment and we will be looking into tools that consume significant amount of nitrogen and how to minimize their use or use them more efficiently. > > If you have any thoughts or ideas that will help with this issue, please share them. > > Thanks, > Manish > > Sent from my iPhone > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From mhofheins at unm.edu Mon Dec 6 10:06:18 2021 From: mhofheins at unm.edu (Mark Hofheins) Date: Mon, 6 Dec 2021 15:06:18 +0000 Subject: [labnetwork] Liquid nitrogen and argon shortage In-Reply-To: References: Message-ID: We went from Liquid N2 to a generator a little over 5 years ago. Very similar specs as James stated. Paid for its self the first year! | South-Tek Systems, LLC 3700 U.S. Highway 421 North | Wilmington, NC 28401 D: 910.408.5584| F: 910.332.4178 | Cell: 910.358.9775 [cid:image001.png at 01D37403.9F4DDB40] Mark Hofheins mhofheins at unm.edu Cell 505-259-9278 Office 505-272-7506 Micro Electronics Technician Manufacturing Engineering/ School of Engineering University of New Mexico MTTC 800 Bradbury S.E. Suit 169 Albuquerque, New Mexico 87106-4346 ________________________________ From: labnetwork on behalf of Manish Keswani Sent: Friday, December 3, 2021 6:24 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Liquid nitrogen and argon shortage [EXTERNAL] Hello everyone, We just learned that there is a severe shortage of liquid nitrogen and argon in the US. Our entire lab will be impacted by this and we will need to evaluate consumption of these gases for different tools in our Nano fabrication center and make priority for tools usage based on that. Nitrogen is used as a purge gas for pumps and equipment and we will be looking into tools that consume significant amount of nitrogen and how to minimize their use or use them more efficiently. If you have any thoughts or ideas that will help with this issue, please share them. Thanks, Manish Sent from my iPhone _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image.png Type: image/png Size: 14291 bytes Desc: image.png URL: From wjkiethe at ncsu.edu Mon Dec 6 10:58:20 2021 From: wjkiethe at ncsu.edu (Bill Kiether) Date: Mon, 6 Dec 2021 10:58:20 -0500 Subject: [labnetwork] Methods/tools for removing wafers/pieces from hot platen (hot plate or CVD system) Message-ID: Hello, I'm asking for advice on the best tool set for safely removing wafers (2"-6") or pieces (~ 1x1 cm) from the surface of a very hot (250 C- 350 C) surface, eg. a hot plate or CVD platen (say 10" diameter). I have found a vacuum wand tip (Pella) that can handle wafers at 250 C, but the tube is too short (2"). Basically, I'm looking for vacuum wand tips for high temp with at least an 8" tube length, or long pairs of tweezers easily manipulated, or a set of thermal gloves that are dextrous enough to handle tweezers. Bill Kiether -------------- next part -------------- An HTML attachment was scrubbed... URL: From bill_flounders at berkeley.edu Mon Dec 6 14:32:46 2021 From: bill_flounders at berkeley.edu (Albert William (Bill) Flounders) Date: Mon, 6 Dec 2021 11:32:46 -0800 Subject: [labnetwork] Methods/tools for removing wafers/pieces from hot platen (hot plate or CVD system) In-Reply-To: References: Message-ID: Bill Kiether, I recommend you search for "pizza spatula", "pie server"and other SS kitchen tools. Several of these tools have an offset handle that is very helpful. You can sharpen the front end or evaluate purchase of a "bench scraper" or "scaper / chopper" or "rocker cutter" and use the two tools as a pair. In general kitchen supply companies have a wide range of tools that are useful in the lab. They are good quality, non particulating SS, designed for dextrous use etc. Also, our french fry warmer is superior to any lab glassware dryer. Bon appetit Bill Flounders UC Berkeley On Mon, Dec 6, 2021 at 8:53 AM Bill Kiether wrote: > Hello, > > I'm asking for advice on the best tool set for safely removing wafers > (2"-6") or pieces (~ 1x1 cm) from the surface of a very hot (250 C- 350 C) > surface, eg. a hot plate or CVD platen (say 10" diameter). I have > found a vacuum wand tip (Pella) that can handle wafers at 250 C, but the > tube is too short (2"). Basically, I'm looking for vacuum wand tips for > high temp with at least an 8" tube length, or long pairs of tweezers easily > manipulated, or a set of thermal gloves that are dextrous enough to handle > tweezers. > > Bill Kiether > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From manish.keswani01 at gmail.com Mon Dec 6 15:17:36 2021 From: manish.keswani01 at gmail.com (Manish Keswani) Date: Mon, 6 Dec 2021 12:17:36 -0800 Subject: [labnetwork] Liquid nitrogen and argon shortage In-Reply-To: References: Message-ID: Thank you all for your responses and offering great ideas. One of our major nitrogen suppliers indicated on Friday that they will not be able to supply nitrogen at the same capacity as before (delivery being prioritize for hospitals and health services) for the next two months. We will be looking into the following items in the next couple of days to reduce consumption of nitrogen or supplement it through other sources. 1. Determine N2. consumption for various tools and pumps. If you have this information for your facility, please share as we can use it as a starting point for our facility. 2. Make specific tools (that have high N2 consumption) available on certain days in the week for the users and shut them down on other days. 3. Switch to CDA for pump purging, load locks, chamber venting, wet benches, etc wherever possible. Factors be be considered are dew point of CDA, gases used in the tool (flammable, corrosive etc) 4. Install N2 saving kit. Please provide additional information if you already have this installed in your facility. 5. Identify leaks 6. Near term or long term: Look into N2 generators (rental and/or purchase) Thank you all, Manish Sent from my iPhone > On Dec 3, 2021, at 5:24 PM, Manish Keswani wrote: > > ?Hello everyone, > > We just learned that there is a severe shortage of liquid nitrogen and argon in the US. Our entire lab will be impacted by this and we will need to evaluate consumption of these gases for different tools in our Nano fabrication center and make priority for tools usage based on that. Nitrogen is used as a purge gas for pumps and equipment and we will be looking into tools that consume significant amount of nitrogen and how to minimize their use or use them more efficiently. > > If you have any thoughts or ideas that will help with this issue, please share them. > > Thanks, > Manish > > Sent from my iPhone From twangens at mail.usf.edu Mon Dec 6 18:18:53 2021 From: twangens at mail.usf.edu (Ted Wangensteen) Date: Mon, 6 Dec 2021 17:18:53 -0600 Subject: [labnetwork] Methods/tools for removing wafers/pieces from hot platen (hot plate or CVD system) In-Reply-To: References: Message-ID: U can simply use a STD small metal wafer holder that have flat area below and u squeeze down to hold pieces or wafers. The trick is getting the pcs off the hot plate. Again, simply using anything metal to push against one side of the wafer or small piece to get it on edge , while u slip the wafer holder underneath sample on the opposite side. Works for us at Aggiefab. We do this every day on PECVD where Temp 350C. Ted Wangensteen, Research Engineer, Texas A and M On Monday, December 6, 2021, Bill Kiether wrote: > Hello, > > I'm asking for advice on the best tool set for safely removing wafers > (2"-6") or pieces (~ 1x1 cm) from the surface of a very hot (250 C- 350 C) > surface, eg. a hot plate or CVD platen (say 10" diameter). I have > found a vacuum wand tip (Pella) that can handle wafers at 250 C, but the > tube is too short (2"). Basically, I'm looking for vacuum wand tips for > high temp with at least an 8" tube length, or long pairs of tweezers easily > manipulated, or a set of thermal gloves that are dextrous enough to handle > tweezers. > > Bill Kiether > -------------- next part -------------- An HTML attachment was scrubbed... URL: From tbritton at criticalsystemsinc.com Mon Dec 6 20:41:20 2021 From: tbritton at criticalsystemsinc.com (Tom Britton) Date: Tue, 7 Dec 2021 01:41:20 +0000 Subject: [labnetwork] Liquid nitrogen and argon shortage In-Reply-To: References: Message-ID: <91EA6730-01B1-49D4-B6D5-A45049F00FEF@criticalsystemsinc.com> Hi Manish, Critical Systems recently released a facility management software system the besides other things, records gas usage on a day by day basis so you can see if you are trending down and when you have a spike on usage. It could help you get your usage under control. If you want to see Ngoc on it, let me know. Tom Britton Critical Systems, Inc. 208-890-1417 Sent from my iPhone On Dec 5, 2021, at 6:28 AM, Mark Weiler wrote: ? [EXTERNAL EMAIL] This message originated outside of your organization. Remember to always use caution when opening attachments or clicking on links. Hi Manish, It may be more related to a transport issue as described in article linked below... https://spacenews.com/liquid-nitrogen-shortage-delays-landsat-9-launch/ ... we have certainly had our own issues with its delivery, a lack of drivers, and changes to how our supplier operates. Best Regards, Mark ________________________________________________________________ Mark Weiler Manager, Equipment & Facilites Bertucci Nanotechnology Laboratory Eden Hall Cleanroom Carnegie Mellon University P: 412-268-2471 F: 412-268-3497 http://www.nanofab.ece.cmu.edu "Be kind; everyone is on their own journey." Daniel Ek Sent from my iPhone On Dec 4, 2021, at 3:41 PM, Shimon Eliav wrote: ? Hi Manish, Some months ago we introduced a Nitrogen Generator in our system. It didn?t replace our original LN2 tank, but complemented it. All the purge gas for pumps is now supplied by this generator. In case of some technical problem happens we still have the N2 from the LN2 tank as backup. Regards, Shimon The Hebrew University of Jerusalem The Unit for Nano Fabrication Jerusalem - ISRAEL -----Original Message----- From: labnetwork [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Manish Keswani Sent: Saturday, 4 December 2021 3:24 To: labnetwork at mtl.mit.edu Subject: [labnetwork] Liquid nitrogen and argon shortage Hello everyone, We just learned that there is a severe shortage of liquid nitrogen and argon in the US. Our entire lab will be impacted by this and we will need to evaluate consumption of these gases for different tools in our Nano fabrication center and make priority for tools usage based on that. Nitrogen is used as a purge gas for pumps and equipment and we will be looking into tools that consume significant amount of nitrogen and how to minimize their use or use them more efficiently. If you have any thoughts or ideas that will help with this issue, please share them. Thanks, Manish Sent from my iPhone _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://urldefense.proofpoint.com/v2/url?u=https-3A__mtl.mit.edu_mailman_listinfo.cgi_labnetwork&d=DwICAg&c=euGZstcaTDllvimEN8b7jXrwqOf-v5A_CdpgnVfiiMM&r=D1j3aH4gf_B24MHGaru0vse-Gx_NllaIE8kLU3iLsM0&m=BAF2ZvZoXTUhPQ828QZscxbJX6l65ktIUjB9E31n2aM&s=D_-i3-I6AKNZA8au8p2DpYvypPhgcY7_NnEuaH1p_d8&e= This email and any files transmitted with it are confidential and intended solely for the use of the individual or entity to whom they are addressed. If you have received this email in error please notify the system manager. This message contains confidential information and is intended only for the individual named. If you are not the named addressee you should not disseminate, distribute or copy this e-mail. Please notify the sender immediately by e-mail if you have received this e-mail by mistake and delete this e-mail from your system. If you are not the intended recipient you are notified that disclosing, copying, distributing or taking any action in reliance on the contents of this information is strictly prohibited.'. If the disclaimer can't be applied, attach the message to a new disclaimer message. -------------- next part -------------- An HTML attachment was scrubbed... URL: From tracy.richardson at maine.edu Wed Dec 8 14:58:39 2021 From: tracy.richardson at maine.edu (Tracy Richardson) Date: Wed, 8 Dec 2021 14:58:39 -0500 Subject: [labnetwork] Research Positions at the University of Maine Message-ID: Dear Colleagues, We have an opening for a research associate/postdoctoral research associate position at the Frontier Institute for Research in Sensor Technologies (FIRST) at the University of Maine. Please help us recruit for this position. *Purpose: *To support research and development activities related to projects funded at FIRST in the areas of sensor technology. *Essential Duties and Responsibilities:* ? Design, fabricate, and test semiconductor electronic circuitry, devices and communication systems, sensors, wireless sensor systems, wireless surface acoustic wave (SAW) sensor and materials, for detection of temperature, pressure, strain, and/or corrosion in high-temperature harsh-environment conditions. ? Design, fabricate, and test advanced materials and coatings for thermal transport and apply the materials and techniques developed towards energy scavenging electronic devices to operate in harsh environment conditions. ? Plan and conduct assigned and/or original research projects autonomously while working collaboratively with UM faculty, staff, postdocs and students. ? Maintain accurate records of research findings and the analysis of results. ? Prepare manuscripts for publication in collaboration with UM faculty, staff, postdocs, and students. ? Present research findings at professional meetings. ? Mentor graduate and undergraduate students as appropriate. ? Assist with formal teaching in areas of expertise. ? Perform other reasonably related duties as assigned. *Knowledge and Skills Qualifications: * *Required: * ? Advanced degree in Electrical Engineering, Materials Science, Physics, or related field. ? Experience in semiconductor electronic circuitry, RF microwave tools and techniques. *Preferred: * ? PhD or MSc in the respective areas. ? Knowledge and familiarity with semiconductor electronic circuitry, RF microwave devices including network analyzer measurements, impedance matching techniques, microelectronic device design and fabrication (photolithography, thin film deposition, and other clean room procedures), and materials characterization techniques. ? Strong interpersonal and communication skills. ? Ability to work effectively with a wide range of constituencies. ? Ability to develop manuscripts and deliver presentations. To apply, click here . Please let me know if you have any questions. Thank you, Tracy Tracy L. Richardson, Assistant Director Frontier Institute for Research in Sensor Technologies (formerly the Laboratory for Surface Science & Technology) www.umaine.edu/first University of Maine 5708 ESRB-Barrows, Room 269 Orono, ME 04469-5708 Tel: (207) 581-2254 -------------- next part -------------- An HTML attachment was scrubbed... URL: From na2661 at columbia.edu Fri Dec 10 10:22:56 2021 From: na2661 at columbia.edu (Nava Ariel-Sternberg) Date: Fri, 10 Dec 2021 10:22:56 -0500 Subject: [labnetwork] CNI is hiring Message-ID: <00ae01d7edd9$ced6aaa0$6c83ffe0$@columbia.edu> Dear all, CNI labs are now accepting applications for two positions: 1. Shared Materials Characterization Lab Director: http://apply.interfolio.com/98374 2. Cleanroom Engineer: https://apply.interfolio.com/100101 Come and work with us in the (still) greatest city in the world J Happy holidays! Nava Nava Ariel-Sternberg, Ph.D. Director of CNI Shared Labs Columbia University CEPSR/MC 8903 530 west 120th st. NY NY 10027 Office: 212-8549927 Cell: 201-5627600 -------------- next part -------------- An HTML attachment was scrubbed... URL: From savithap at iisc.ac.in Mon Dec 13 00:34:43 2021 From: savithap at iisc.ac.in (Savitha P) Date: Mon, 13 Dec 2021 05:34:43 +0000 Subject: [labnetwork] Crucible damage in e-beam evaporator In-Reply-To: References: Message-ID: Hi, We use a Leybold univex 400 with EV M-8 ferrotec e-gun assembly for out metal coatings. We have been using an optimized recipe for Al deposition in Cu crucibles for long. Power % : Raise 1: 10% (V= 10 KV and I ~ 110 mA), 5 mins, hold 2 mins Raise 2: 22% (V= 10 KV and I ~ 220 mA), 5 mins, hold 2 mins During the deposition Power % goes up to 24% and the current goes up to 240 mA ( V = 10 KV constant) Some spit is seen during raise 2. But recently we got serious concern of Cu crucible melting, mostly towards the gun side. We set the beam as spot pattern (for Ti, beam profile is infinity pattern), but it looks elongated. Beam is centred well. We set the deposition rate to 0.3 nm/sec. Hearth cooling is done at 20 deg C, with water flow rate at 6 litre per minute. Al source fill in crucible is around 70-80%. Beam ramp down is 5 minutes. Chamber venting is set after 25 minutes. We used an infinity beam pattern to deposit a thick Al metal coating sometime back. We changed all our settings back to spot pattern again. This issue started after that. Seems, somehow the beam did not come back to previous focus. We need to know, has anyone came across something like this, and how to overcome this. Any information would be helpful. Thanks. Savitha Dr. Savitha P Chief Operating Officer National Nanofabrication Centre Centre for Nanoscience and Engineering Indian Institute of Science Bangalore - 560012 India. Ph. +91 80 2293 3319 www.cense.iisc.ac.in -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... 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Name: IMG-20211208-WA0010.jpg Type: image/jpeg Size: 49584 bytes Desc: IMG-20211208-WA0010.jpg URL: From manish.keswani01 at gmail.com Mon Dec 13 03:38:35 2021 From: manish.keswani01 at gmail.com (Manish Keswani) Date: Mon, 13 Dec 2021 00:38:35 -0800 Subject: [labnetwork] space planning for cleanroom/dry labs Message-ID: Dear all, We have starting mapping our facility to aid space planning. Our facility (cleanroom and dry labs) is almost full with equipment, wet benches, pumps, storage cabinets, work benches, etc. We certainly need a new facility but it will be another 3-5 years before we can get one. How are other facilities dealing with this? Are there unique ways to conserve space and accommodate more tools with the space we have? Thank you in advance. Manish Keswani LLNL -------------- next part -------------- An HTML attachment was scrubbed... URL: From shimonel at savion.huji.ac.il Mon Dec 13 06:54:06 2021 From: shimonel at savion.huji.ac.il (Shimon Eliav) Date: Mon, 13 Dec 2021 11:54:06 +0000 Subject: [labnetwork] Cleanroom elevated floor Message-ID: Hello Everybody, We are designing a new cleanroom and I think to use an elevated floor to accommodate part of the utilities and serve as air return path to the chase. The air-conditioning designers didn't like the idea: they argue it is expensive and difficult to clean. What is your experience with this? How clean that space below the elevated floor? Thanks in advance for your input. Regards, Shimon The Hebrew University of Jerusalem The Unit for Nano Fabrication - UNF Jerusalem - ISRAEL -------------- next part -------------- An HTML attachment was scrubbed... URL: From schweig at umich.edu Mon Dec 13 07:56:40 2021 From: schweig at umich.edu (Dennis Schweiger) Date: Mon, 13 Dec 2021 07:56:40 -0500 Subject: [labnetwork] Cleanroom elevated floor In-Reply-To: References: Message-ID: Shimon, good morning. Here at UofMichigan we have both a raised floor cleanroom, and low side wall return cleanroom. The raised floor is a catch-all for all kinds of debris/pieces/parts, and unless you make a conscious effort to pull the floor and vacuum under there, it does collect. As the facility guy, I've spent many hours vacuuming that surface whenever we do work in that underfloor plenum space. Even with the amount of stuff it collects and extra work required to keep it clean, I still wouldn't trade it for the low side wall return section. The raised floor provides another level of flexibility in the fit up of tools when you have to route some type of utility up from the subfab. We can talk more if you'd like to further discuss it. Good luck with your design, now is the time to make the correct choices, Dennis Schweiger Facilities Superviser University of Michigan/LNF 734.647.2055 Ofc On Mon, Dec 13, 2021 at 7:48 AM Shimon Eliav wrote: > Hello Everybody, > > > > We are designing a new cleanroom and I think to use an elevated floor to > accommodate part of the utilities and serve as air return path to the > chase. The air-conditioning designers didn?t like the idea: they argue it > is expensive and difficult to clean. > > What is your experience with this? How clean that space below the elevated > floor? > > > > Thanks in advance for your input. > > > > Regards, > > > > Shimon > > The Hebrew University of Jerusalem > > The Unit for Nano Fabrication - UNF > > Jerusalem - ISRAEL > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From jtmitch5 at ncsu.edu Mon Dec 13 07:59:37 2021 From: jtmitch5 at ncsu.edu (James Mitchell) Date: Mon, 13 Dec 2021 07:59:37 -0500 Subject: [labnetwork] Cleanroom elevated floor In-Reply-To: References: Message-ID: Raised perforated flooring can be expensive. I have seen fabs that had anywhere from 30 inches to 30 feet. You will need to go under the flooring periodically to clean the lower floor. Also it will need to be sturdy enough for equipment. Some fabs put the heavier equipment on pedestals. You will also need lifts and ramps to install equipment to the higher flooring. Jim On Mon, Dec 13, 2021 at 7:46 AM Shimon Eliav wrote: > Hello Everybody, > > > > We are designing a new cleanroom and I think to use an elevated floor to > accommodate part of the utilities and serve as air return path to the > chase. The air-conditioning designers didn?t like the idea: they argue it > is expensive and difficult to clean. > > What is your experience with this? How clean that space below the elevated > floor? > > > > Thanks in advance for your input. > > > > Regards, > > > > Shimon > > The Hebrew University of Jerusalem > > The Unit for Nano Fabrication - UNF > > Jerusalem - ISRAEL > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -- *James Mitchell* *Specialty Trades Technician* *Dept. of Electrical and Computer Engineering* *NCSU Nanofabrication Facility* *MRC RM243A **Box 7911* *2410 Campus Shore Dr., Raleigh, NC 27606* *jtmitch5 at ncsu.edu* *Desk: 919-515-5394* *Cell: 919-717-7325* -------------- next part -------------- An HTML attachment was scrubbed... URL: From rmorrison at draper.com Mon Dec 13 08:07:28 2021 From: rmorrison at draper.com (Morrison, Richard H., Jr) Date: Mon, 13 Dec 2021 13:07:28 +0000 Subject: [labnetwork] Cleanroom elevated floor In-Reply-To: References: Message-ID: <497371afd3424a9a990a566cc5a06164@draper.com> I would say that all the 200mm and 300mm fab in the world use a raised floor. While under construction the space should be cleaned every day and since it is clean room construction every going into the space is wiped down so it is fairly clean. The raised floor allows a clutter free cleanroom, from piping and wires because all the services run in the floor space, very eye pleasing space. Then once per qtr you lift up the floor tiles and send in a person to vacuum and cleanup. All the debris collects on the floor and any flat surfaces, very easy to pickup and clean. Another benefit is that the air moves straight down from the ceiling reducing eddy currents and providing almost laminar air flow. Rick Richard Morrison PMTS Draper Laboratory 555 Technology Square Cambridge Ma 02139 Office: 617-258-3420 Cell: 508-930-3461 From: labnetwork On Behalf Of Shimon Eliav Sent: Monday, December 13, 2021 6:54 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Cleanroom elevated floor Hello Everybody, We are designing a new cleanroom and I think to use an elevated floor to accommodate part of the utilities and serve as air return path to the chase. The air-conditioning designers didn?t like the idea: they argue it is expensive and difficult to clean. What is your experience with this? How clean that space below the elevated floor? Thanks in advance for your input. Regards, Shimon The Hebrew University of Jerusalem The Unit for Nano Fabrication - UNF Jerusalem - ISRAEL ________________________________ Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email. ________________________________ -------------- next part -------------- An HTML attachment was scrubbed... URL: From jtmitch5 at ncsu.edu Mon Dec 13 08:11:07 2021 From: jtmitch5 at ncsu.edu (James Mitchell) Date: Mon, 13 Dec 2021 08:11:07 -0500 Subject: [labnetwork] Crucible damage in e-beam evaporator In-Reply-To: References: Message-ID: I would check your beam steering. You made need to adjust where it is dropping. Also check the wiring to beam steering magnets on the e-gun. If a wire is broken it could cause misdirection. Next, you may need to clean or replace the hearth assembly. You may be losing conductivity under the crucible due to buildup. Jim On Mon, Dec 13, 2021 at 7:51 AM Savitha P wrote: > > > Hi, > > We use a Leybold univex 400 with EV M-8 ferrotec e-gun assembly for out > metal coatings. We have been using an optimized recipe for Al deposition in > Cu crucibles for long. > > Power % : Raise 1: 10% (V= 10 KV and I ~ 110 mA), 5 mins, hold 2 mins > Raise 2: 22% (V= 10 KV and I ~ 220 mA), 5 mins, hold 2 mins > During the deposition Power % goes up to 24% and the current > goes up to 240 mA ( V = 10 KV constant) > > Some spit is seen during raise 2. > > But recently we got serious concern of Cu crucible melting, mostly towards > the gun side. We set the beam as spot pattern (for Ti, beam profile is > infinity pattern), but it looks elongated. Beam is centred well. We set > the deposition rate to 0.3 nm/sec. Hearth cooling is done at 20 deg C, with > water flow rate at 6 litre per minute. Al source fill in crucible is around > 70-80%. Beam ramp down is 5 minutes. Chamber venting is set after 25 > minutes. > > We used an infinity beam pattern to deposit a thick Al metal coating > sometime back. We changed all our settings back to spot pattern again. This > issue started after that. Seems, somehow the beam did not come back to > previous focus. > > We need to know, has anyone came across something like this, and how to > overcome this. Any information would be helpful. > > Thanks. > > Savitha > > Dr. Savitha P > Chief Operating Officer > National Nanofabrication Centre > Centre for Nanoscience and Engineering > Indian Institute of Science > Bangalore - 560012 > India. > Ph. +91 80 2293 3319 > www.cense.iisc.ac.in > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -- *James Mitchell* *Specialty Trades Technician* *Dept. of Electrical and Computer Engineering* *NCSU Nanofabrication Facility* *MRC RM243A **Box 7911* *2410 Campus Shore Dr., Raleigh, NC 27606* *jtmitch5 at ncsu.edu* *Desk: 919-515-5394* *Cell: 919-717-7325* -------------- next part -------------- An HTML attachment was scrubbed... URL: From michael.rooks at yale.edu Mon Dec 13 08:39:25 2021 From: michael.rooks at yale.edu (Michael Rooks) Date: Mon, 13 Dec 2021 08:39:25 -0500 Subject: [labnetwork] Cleanroom elevated floor In-Reply-To: References: Message-ID: I agree with your designers, but cleanliness is not the issue. Raised floors make it very difficult to move and to position heavy equipment. You can expect a lot of movement of machines over the life of the cleanroom, and the raised floor will make every single one an expensive trauma. Also, many states (around here in the US) require all sub-floor wiring to be in conduits or plenums. ALL of them! Of course you are not going to follow the rules, and then the Safety Department will demand that all the machines be shut down while certified contractors take your money. You could have simply put a plastic wire through on the floor, but no - you had to have raised floor. On the other hand, a subfloor is a handy place to hide contraband. -------------------------------- Michael Rooks nano.yale.edu On Mon, Dec 13, 2021 at 7:49 AM Shimon Eliav wrote: > Hello Everybody, > > > > We are designing a new cleanroom and I think to use an elevated floor to > accommodate part of the utilities and serve as air return path to the > chase. The air-conditioning designers didn?t like the idea: they argue it > is expensive and difficult to clean. > > What is your experience with this? How clean that space below the elevated > floor? > > > > Thanks in advance for your input. > > > > Regards, > > > > Shimon > > The Hebrew University of Jerusalem > > The Unit for Nano Fabrication - UNF > > Jerusalem - ISRAEL > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From christophe.clement at polymtl.ca Mon Dec 13 11:49:03 2021 From: christophe.clement at polymtl.ca (=?iso-8859-1?Q?Christophe_Cl=E9ment?=) Date: Mon, 13 Dec 2021 11:49:03 -0500 (EST) Subject: [labnetwork] Resin blade Message-ID: <007401d7f041$55e39e40$01aadac0$@polymtl.ca> Hello community I tried to purchase blades from ADT today and the lead time for having resin blades (75 micron grit, 8 mil thick, 2.25 inch OD) is 6 month .It used to be less than a month last year. Can you please share your supplier's contact information where you purchase similar blades? Thank you ! Christophe Christophe Cl?ment Technicien laboratoire Laboratoire de microfabrication (LMF) Groupe des Couches Minces (GCM) www.gcmlab.ca Ecole Polytechnique de Montr?al www.polymtl.ca D?partement de g?nie physique * 2900 Boulevard Edouard Monpetit Pavillon JAB Campus de l'Universit? de Montr?al Montr?al (Qu?bec) H3T 1J4 8 christophe.clement at polymtl.ca ( 514 340 4711 #2417 Fax : 514 340 5195 -------------- next part -------------- An HTML attachment was scrubbed... URL: From robert.macdonald at ge.com Mon Dec 13 13:31:35 2021 From: robert.macdonald at ge.com (Macdonald, Robert (GE Research, US)) Date: Mon, 13 Dec 2021 18:31:35 +0000 Subject: [labnetwork] Resin blade In-Reply-To: <007401d7f041$55e39e40$01aadac0$@polymtl.ca> References: <007401d7f041$55e39e40$01aadac0$@polymtl.ca> Message-ID: <073c7602ee684fd7a6eb8956d2dcac01@ge.com> Disco or Thermocarbon would be my next try.. Thermocarbon: dicing.com Disco: https://technology.discousa.com/index.html From: labnetwork On Behalf Of Christophe Cl?ment Sent: Monday, December 13, 2021 11:49 AM To: labnetwork at mtl.mit.edu Subject: EXT: [labnetwork] Resin blade WARNING: This email originated from outside of GE. Please validate the sender's email address before clicking on links or attachments as they may not be safe. Hello community I tried to purchase blades from ADT today and the lead time for having resin blades (75 micron grit, 8 mil thick, 2.25 inch OD) is 6 month....It used to be less than a month last year. Can you please share your supplier's contact information where you purchase similar blades? Thank you ! Christophe Christophe Cl?ment Technicien laboratoire Laboratoire de microfabrication (LMF) Groupe des Couches Minces (GCM) www.gcmlab.ca Ecole Polytechnique de Montr?al www.polymtl.ca D?partement de g?nie physique * 2900 Boulevard Edouard Monpetit Pavillon JAB Campus de l'Universit? de Montr?al Montr?al (Qu?bec) H3T 1J4 * christophe.clement at polymtl.ca * 514 340 4711 #2417 Fax : 514 340 5195 -------------- next part -------------- An HTML attachment was scrubbed... URL: From odc1n08 at soton.ac.uk Mon Dec 13 14:55:58 2021 From: odc1n08 at soton.ac.uk (Owain Clark) Date: Mon, 13 Dec 2021 19:55:58 +0000 Subject: [labnetwork] Cleanroom elevated floor In-Reply-To: <497371afd3424a9a990a566cc5a06164@draper.com> References: <497371afd3424a9a990a566cc5a06164@draper.com> Message-ID: We run a raised floor. So far we have not had many problems moving tools. For the heaviest we have sometimes reinforced with steel sheets during movement and then when in place we use some small steel plates to spread load per contact point. The Nikon scanner install did require improved structural engineering for its floor area, which was not cheap. This was not part of the original build. Yes it does get filthy down there, I wish I could say we cleaned every 3 months but that would not strictly be true. It can help with the odd cooling water flood by routing it straight to drain. Touch wood we have not had that problem for a long time. Nearly all of our services run in it and there is no great issue there, apart from sometimes the requirement for confined space training can be an irritation, especially for any gas line welding. I prefer not to hide things there, they have a habit of becoming forgotten and staying there too long. We used to have some backing pumps down there, but the hassle of lifting them out for servicing was not worth the space/vibration savings. Owain. From: labnetwork On Behalf Of Morrison, Richard H., Jr Sent: 13 December 2021 13:07 To: shimonel at savion.huji.ac.il; labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Cleanroom elevated floor CAUTION: This e-mail originated outside the University of Southampton. I would say that all the 200mm and 300mm fab in the world use a raised floor. While under construction the space should be cleaned every day and since it is clean room construction every going into the space is wiped down so it is fairly clean. The raised floor allows a clutter free cleanroom, from piping and wires because all the services run in the floor space, very eye pleasing space. Then once per qtr you lift up the floor tiles and send in a person to vacuum and cleanup. All the debris collects on the floor and any flat surfaces, very easy to pickup and clean. Another benefit is that the air moves straight down from the ceiling reducing eddy currents and providing almost laminar air flow. Rick Richard Morrison PMTS Draper Laboratory 555 Technology Square Cambridge Ma 02139 Office: 617-258-3420 Cell: 508-930-3461 From: labnetwork > On Behalf Of Shimon Eliav Sent: Monday, December 13, 2021 6:54 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Cleanroom elevated floor Hello Everybody, We are designing a new cleanroom and I think to use an elevated floor to accommodate part of the utilities and serve as air return path to the chase. The air-conditioning designers didn't like the idea: they argue it is expensive and difficult to clean. What is your experience with this? How clean that space below the elevated floor? Thanks in advance for your input. Regards, Shimon The Hebrew University of Jerusalem The Unit for Nano Fabrication - UNF Jerusalem - ISRAEL ________________________________ Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email. ________________________________ -------------- next part -------------- An HTML attachment was scrubbed... URL: From sb86922 at usc.edu Mon Dec 13 18:21:25 2021 From: sb86922 at usc.edu (Shivakumar Bhaskaran) Date: Mon, 13 Dec 2021 23:21:25 +0000 Subject: [labnetwork] Wedge Bonders In-Reply-To: References: Message-ID: Hi All, We are planning to purchase a wedge bonder. I used K&S (now MPP) and West Bond manual wedge bonder. But in my experience, users have difficulty threading the wires, and most of the time, it never works, and this tool requires many hours of staff support to help users and keep the tool running. I would like to know which Wedge bonder you have in your facility and any recommendations that I can buy. Thanks Shiva Shivakumar Bhaskaran, Ph.D., Associate Director, John D. O'Brien Nanofabrication Laboratory Michelson Hall, 1002 Childs Way, MCB LL121, Los Angeles, California 90089, 213 821 2374 [Sign] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.jpg Type: image/jpeg Size: 2931 bytes Desc: image001.jpg URL: From admueller84 at gmail.com Mon Dec 13 21:33:30 2021 From: admueller84 at gmail.com (Aaron Mueller) Date: Tue, 14 Dec 2021 10:33:30 +0800 Subject: [labnetwork] Super / Ultra low stress LPCVD nitride deposition Message-ID: Dear all, My group, among other activities, makes MEMS chips with nitride membranes. Ideally, because I think it would be more economical, I am wondering if anyone knows a facility that can deposit super or ultra low stress LPCVD silicon nitride (180nm) on 300/400um thick 4"silicon wafers. Or perhaps this is not a good idea as the achievable membrane performance may depend on the bow/warp/etc. of the silicon wafers. Alternatively, I would like to find a wafer vendor that can target such a low stress nitride coating at a reasonable price. I'm looking for something less than 50MPa tensile stress, maybe closer to zero. I've used low stress ( nominally <250MPa) and now super low stress (nominally <100MPa, paid about 100USD per wafer for 25 wafers, would be willing to pay a bit more), but my nitride membranes are still breaking more than is acceptable. I am aware that our application is demanding, as the membranes are quite large (440um x 440um), and we often make holes through them, either with RIE (before the membranes are suspended) or FIB (after). I would be very grateful for any suggestions. Thanks! Best Regards, Aaron Aaron Mueller, PhD Research Fellow School of Materials Science and Engineering Nanyang Technological University Singapore -------------- next part -------------- An HTML attachment was scrubbed... URL: From info at fabsurplus.com Tue Dec 14 05:17:31 2021 From: info at fabsurplus.com (Stephen Howe) Date: Tue, 14 Dec 2021 11:17:31 +0100 Subject: [labnetwork] Cleanroom elevated floor In-Reply-To: References: <497371afd3424a9a990a566cc5a06164@draper.com> Message-ID: FYI If you are moving tools over a raised floor, it's much easier to use thick plastic sheets rather than steel ones. They are not so heavy to be carrying around. On Mon, 2021-12-13 at 19:55 +0000, Owain Clark wrote: > > > We run a raised floor. So far we have not had many problems moving > tools. For the heaviest we have sometimes reinforced with steel > sheets during movement and then when in place we use some small > steel plates to spread load per contact point. The Nikon scanner > install did require improved structural engineering for its floor > area, which was not cheap. This was not part of the original build. > > Yes it does get filthy down there, I wish I could say we cleaned > every 3 months but that would not strictly be true. It can help with > the odd cooling water flood by routing it straight to drain. > Touch wood we have not had that problem for a long time. Nearly all > of our services run in it and there is no great issue there, apart > from sometimes the requirement for confined space training can be an > irritation, especially for any gas line welding. > > > I prefer not to hide things there, they have a habit of becoming > forgotten and staying there too long. We used to have some backing > pumps down there, but the hassle of lifting them out for servicing > was not worth the space/vibration savings. > > Owain. > > > > From: labnetwork > On Behalf Of Morrison, Richard H., Jr > > Sent: 13 December 2021 13:07 > > To: shimonel at savion.huji.ac.il; labnetwork at mtl.mit.edu > > Subject: Re: [labnetwork] Cleanroom elevated floor > > > > > > CAUTION: This e-mail > originated outside the University of Southampton. > > > > I would say that all the 200mm and 300mm fab in the world use a > raised floor. While under construction the space should be cleaned > every day and since it is clean room construction every going into > the space is wiped down so it is fairly clean. > > The raised floor allows a clutter free cleanroom, from piping and > wires because all the services run in the floor space, very eye > pleasing space. Then once per qtr you lift up the floor tiles and > send in a person to vacuum and cleanup. All the debris collects on > the floor and any flat surfaces, very easy to pickup and clean. > Another benefit is that the air moves straight down from the ceiling > reducing eddy currents and providing almost laminar air > flow. > > Rick > > > Richard Morrison > PMTS > Draper Laboratory > 555 Technology Square > Cambridge Ma 02139 > Office: 617-258-3420 > Cell: 508-930-3461 > > > > > > > > From: labnetwork > On Behalf Of Shimon Eliav > > Sent: Monday, December 13, 2021 6:54 AM > > To: labnetwork at mtl.mit.edu > > Subject: [labnetwork] Cleanroom elevated floor > > > > Hello Everybody, > > We are designing a new cleanroom and I think to use an elevated floor > to accommodate part of the utilities and serve as air return path to > the chase. The air-conditioning designers didn?t like the idea: they > argue it > is expensive and difficult to clean. > What is your experience with this? How clean that space below the > elevated floor? > > Thanks in advance for your input. > > Regards, > > Shimon > The Hebrew University of Jerusalem > The Unit for Nano Fabrication - UNF > Jerusalem - ISRAEL > > > > Notice: This email and any attachments may contain proprietary > (Draper non-public) and/or export-controlled information of Draper. > If you are not the intended recipient of this email, please > immediately notify the sender > by replying to this email and immediately destroy all copies of this > email. > > > > > > > > > > _______________________________________________labnetwork mailing > listlabnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From rmorrison at draper.com Tue Dec 14 07:58:36 2021 From: rmorrison at draper.com (Morrison, Richard H., Jr) Date: Tue, 14 Dec 2021 12:58:36 +0000 Subject: [labnetwork] Super / Ultra low stress LPCVD nitride deposition In-Reply-To: References: Message-ID: Try Rogue Valley Micro I have used them before they are very good. https://roguevalleymicrodevices.com/ Richard Morrison PMTS Draper Laboratory 555 Technology Square Cambridge Ma 02139 Office: 617-258-3420 Cell: 508-930-3461 From: labnetwork On Behalf Of Aaron Mueller Sent: Monday, December 13, 2021 9:34 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Super / Ultra low stress LPCVD nitride deposition Dear all, My group, among other activities, makes MEMS chips with nitride membranes. Ideally, because I think it would be more economical, I am wondering if anyone knows a facility that can deposit super or ultra low stress LPCVD silicon nitride (180nm) on 300/400um thick 4"silicon wafers. Or perhaps this is not a good idea as the achievable membrane performance may depend on the bow/warp/etc. of the silicon wafers. Alternatively, I would like to find a wafer vendor that can target such a low stress nitride coating at a reasonable price. I'm looking for something less than 50MPa tensile stress, maybe closer to zero. I've used low stress ( nominally <250MPa) and now super low stress (nominally <100MPa, paid about 100USD per wafer for 25 wafers, would be willing to pay a bit more), but my nitride membranes are still breaking more than is acceptable. I am aware that our application is demanding, as the membranes are quite large (440um x 440um), and we often make holes through them, either with RIE (before the membranes are suspended) or FIB (after). I would be very grateful for any suggestions. Thanks! Best Regards, Aaron Aaron Mueller, PhD Research Fellow School of Materials Science and Engineering Nanyang Technological University Singapore ________________________________ Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email. ________________________________ -------------- next part -------------- An HTML attachment was scrubbed... URL: From diadiuk at mit.edu Tue Dec 14 09:11:01 2021 From: diadiuk at mit.edu (Vicky Diadiuk) Date: Tue, 14 Dec 2021 14:11:01 +0000 Subject: [labnetwork] Capacitance-Voltage measurement system available References: Message-ID: <7F496326-EE46-4CD0-A246-C76B3C86576F@mit.edu> HI, We have a functional CV measurement system that is looking for a new home. Wafers & table not going w it :) Pls send me a note directly if you are interested. Thx, Vicky > > > > -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: IMG_2714.jpg Type: image/jpeg Size: 2619487 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: smime.p7s Type: application/pkcs7-signature Size: 1841 bytes Desc: not available URL: From julia.aebersold at louisville.edu Tue Dec 14 10:04:15 2021 From: julia.aebersold at louisville.edu (Aebersold,Julia W.) Date: Tue, 14 Dec 2021 15:04:15 +0000 Subject: [labnetwork] Wedge Bonders In-Reply-To: References: Message-ID: I don't dispute that wedge bonders are more difficult to thread and can be frustrating, but I don't believe it is impossible. It takes patience and technique. If the staff can thread then users can be trained. It's vital to have straight thread when starting for crimped or mangled thread is impossible to get started. Or have the users switch to gold ball bonding if possible. Cheers! Julia Aebersold, Ph.D. Manager, Micro/Nano Technology Center University of Louisville 2210 South Brook Street Shumaker Research Building, Room 233 Louisville, KY 40292 (502) 852-1572 http://louisville.edu/micronano/ ________________________________ From: labnetwork on behalf of Shivakumar Bhaskaran Sent: Monday, December 13, 2021 6:21 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Wedge Bonders CAUTION: This email originated from outside of our organization. Do not click links, open attachments, or respond unless you recognize the sender's email address and know the contents are safe. Hi All, We are planning to purchase a wedge bonder. I used K&S (now MPP) and West Bond manual wedge bonder. But in my experience, users have difficulty threading the wires, and most of the time, it never works, and this tool requires many hours of staff support to help users and keep the tool running. I would like to know which Wedge bonder you have in your facility and any recommendations that I can buy. Thanks Shiva Shivakumar Bhaskaran, Ph.D., Associate Director, John D. O?Brien Nanofabrication Laboratory Michelson Hall, 1002 Childs Way, MCB LL121, Los Angeles, California 90089, 213 821 2374 [Sign] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.jpg Type: image/jpeg Size: 2931 bytes Desc: image001.jpg URL: From sandra.malhotra at tamu.edu Tue Dec 14 10:17:05 2021 From: sandra.malhotra at tamu.edu (Malhotra, Sandra Guy) Date: Tue, 14 Dec 2021 15:17:05 +0000 Subject: [labnetwork] Wedge Bonders In-Reply-To: References: Message-ID: Howdy Shivakumar, We have this K&S wire bonder (https://aggiefab.tamu.edu/equipment/ks-wire-bonder/) and were very unhappy with it because it was so difficult to use. We recently had field service engineer Greg Delasandro come out and discovered so many things that needed to be repaired. He also trained us on the best methods of threading and making bonds. What a difference! We now have happy users. If your wire bonders haven't had a PM for a while, I would recommend it because that may be one reason your bonders are so difficult to use. Here's Greg's contact info: http://www.grdtec.com/ GRDTech Index Services provided by Greg Delasandro, a former employee of ESEC Industries with over 20 years experience as a Field Service Engineer. Greg has been certified to service the above equipment and Golbal Semiconductor is fully insured., 3006, 3006fx, 3018, 3088, 3088ip, ESEC. www.grdtec.com Best, Sandra G. Malhotra, Ph.D. | Technical Lab Manager AggieFab Nanofabrication Facility Department of Electrical & Computer Engineering, College of Engineering | Texas A&M University 3253 TAMU | College Station, TX 77843 ph: 979.845.3199 | sandra.malhotra at tamu.edu - - - - - - - - - - - - - - - - - - - - - - - - TEXAS A&M UNIVERSITY | FEARLESS on Every Front ________________________________ From: labnetwork on behalf of Shivakumar Bhaskaran Sent: Monday, December 13, 2021 5:21 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Wedge Bonders Hi All, We are planning to purchase a wedge bonder. I used K&S (now MPP) and West Bond manual wedge bonder. But in my experience, users have difficulty threading the wires, and most of the time, it never works, and this tool requires many ZjQcmQRYFpfptBannerStart This Message Is From an External Sender This message came from outside your organization. ZjQcmQRYFpfptBannerEnd Hi All, We are planning to purchase a wedge bonder. I used K&S (now MPP) and West Bond manual wedge bonder. But in my experience, users have difficulty threading the wires, and most of the time, it never works, and this tool requires many hours of staff support to help users and keep the tool running. I would like to know which Wedge bonder you have in your facility and any recommendations that I can buy. Thanks Shiva Shivakumar Bhaskaran, Ph.D., Associate Director, John D. O?Brien Nanofabrication Laboratory Michelson Hall, 1002 Childs Way, MCB LL121, Los Angeles, California 90089, 213 821 2374 [Sign] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.jpg Type: image/jpeg Size: 2931 bytes Desc: image001.jpg URL: From Jeffrey.Salzmann at integer.net Tue Dec 14 13:02:56 2021 From: Jeffrey.Salzmann at integer.net (Salzmann, Jeffrey) Date: Tue, 14 Dec 2021 18:02:56 +0000 Subject: [labnetwork] Super / Ultra low stress LPCVD nitride deposition In-Reply-To: References: Message-ID: I?ll second the vote for Rogue Valley. Jeff Salzmann Senior Research Engineer Advanced Materials Technology Group Integer* 10000 Wehrle Drive Clarence, NY, 14031 Tel +1 716.759.5796 Cell +1 716.867.1302 Jeffrey.Salzmann at integer.net www.integer.net * Integer comprises the following companies: Greatbatch Medical -? Lake Region Medical -? Electrochem From: labnetwork On Behalf Of Morrison, Richard H., Jr Sent: Tuesday, December 14, 2021 7:59 AM To: admueller84 at gmail.com; labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Super / Ultra low stress LPCVD nitride deposition CAUTION: This email originated from outside of the organization. Do not click links or open attachments unless you recognize the sender and know the content is safe. Try Rogue Valley Micro I have used them before they are very good. https://roguevalleymicrodevices.com/ Richard Morrison PMTS Draper Laboratory 555 Technology Square Cambridge Ma 02139 Office: 617-258-3420 Cell: 508-930-3461 From: labnetwork > On Behalf Of Aaron Mueller Sent: Monday, December 13, 2021 9:34 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Super / Ultra low stress LPCVD nitride deposition Dear all, My group, among other activities, makes MEMS chips with nitride membranes. Ideally, because I think it would be more economical, I am wondering if anyone knows a facility that can deposit super or ultra low stress LPCVD silicon nitride (180nm) on 300/400um thick 4"silicon wafers. Or perhaps this is not a good idea as the achievable membrane performance may depend on the bow/warp/etc. of the silicon wafers. Alternatively, I would like to find a wafer vendor that can target such a low stress nitride coating at a reasonable price. I'm looking for something less than 50MPa tensile stress, maybe closer to zero. I've used low stress ( nominally <250MPa) and now super low stress (nominally <100MPa, paid about 100USD per wafer for 25 wafers, would be willing to pay a bit more), but my nitride membranes are still breaking more than is acceptable. I am aware that our application is demanding, as the membranes are quite large (440um x 440um), and we often make holes through them, either with RIE (before the membranes are suspended) or FIB (after). I would be very grateful for any suggestions. Thanks! Best Regards, Aaron Aaron Mueller, PhD Research Fellow School of Materials Science and Engineering Nanyang Technological University Singapore ________________________________ Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email. ________________________________ ________________________________ Integer Confidentiality Notice: This electronic mail transmission is intended for the use of the individual or entity to which it is addressed and may contain confidential or proprietary information belonging to the sender. If you are not the intended recipient, you are hereby notified that any disclosure, copying, distribution, or the taking of any action in reliance on the contents of this information is strictly prohibited. If you have received this transmission in error, please notify the sender immediately by e-mail and delete the original message. Thank you for your cooperation. -------------- next part -------------- An HTML attachment was scrubbed... URL: From odc1n08 at soton.ac.uk Tue Dec 14 13:20:36 2021 From: odc1n08 at soton.ac.uk (Owain Clark) Date: Tue, 14 Dec 2021 18:20:36 +0000 Subject: [labnetwork] Wedge Bonders In-Reply-To: References: Message-ID: We don't have too many problems with an old Delvotek wedge bonder. Takes practice yes but after a few goes users usually get it. If they really get stuck they call a tool owner to sort it out. We have more problems with people running the z-height to its travel limit and getting it stuck. From: labnetwork On Behalf Of Aebersold,Julia W. Sent: 14 December 2021 15:04 To: Shivakumar Bhaskaran ; labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Wedge Bonders CAUTION: This e-mail originated outside the University of Southampton. I don't dispute that wedge bonders are more difficult to thread and can be frustrating, but I don't believe it is impossible. It takes patience and technique. If the staff can thread then users can be trained. It's vital to have straight thread when starting for crimped or mangled thread is impossible to get started. Or have the users switch to gold ball bonding if possible. Cheers! Julia Aebersold, Ph.D. Manager, Micro/Nano Technology Center University of Louisville 2210 South Brook Street Shumaker Research Building, Room 233 Louisville, KY 40292 (502) 852-1572 http://louisville.edu/micronano/ ________________________________ From: labnetwork > on behalf of Shivakumar Bhaskaran > Sent: Monday, December 13, 2021 6:21 PM To: labnetwork at mtl.mit.edu > Subject: [labnetwork] Wedge Bonders CAUTION: This email originated from outside of our organization. Do not click links, open attachments, or respond unless you recognize the sender's email address and know the contents are safe. Hi All, We are planning to purchase a wedge bonder. I used K&S (now MPP) and West Bond manual wedge bonder. But in my experience, users have difficulty threading the wires, and most of the time, it never works, and this tool requires many hours of staff support to help users and keep the tool running. I would like to know which Wedge bonder you have in your facility and any recommendations that I can buy. Thanks Shiva Shivakumar Bhaskaran, Ph.D., Associate Director, John D. O'Brien Nanofabrication Laboratory Michelson Hall, 1002 Childs Way, MCB LL121, Los Angeles, California 90089, 213 821 2374 [Sign] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image002.jpg Type: image/jpeg Size: 2116 bytes Desc: image002.jpg URL: From sb86922 at usc.edu Wed Dec 15 02:00:22 2021 From: sb86922 at usc.edu (Shivakumar Bhaskaran) Date: Wed, 15 Dec 2021 07:00:22 +0000 Subject: [labnetwork] Wedge Bonders In-Reply-To: References: Message-ID: Hi All, Each of your Bond tool has different capability, now I have plenty of options. Thanks for your valuable feedback. -Regards -Shiva From: Owain Clark Sent: Tuesday, December 14, 2021 10:21 AM To: Aebersold,Julia W. ; Shivakumar Bhaskaran ; labnetwork at mtl.mit.edu Subject: RE: Wedge Bonders We don't have too many problems with an old Delvotek wedge bonder. Takes practice yes but after a few goes users usually get it. If they really get stuck they call a tool owner to sort it out. We have more problems with people running the z-height to its travel limit and getting it stuck. From: labnetwork > On Behalf Of Aebersold,Julia W. Sent: 14 December 2021 15:04 To: Shivakumar Bhaskaran >; labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Wedge Bonders CAUTION: This e-mail originated outside the University of Southampton. I don't dispute that wedge bonders are more difficult to thread and can be frustrating, but I don't believe it is impossible. It takes patience and technique. If the staff can thread then users can be trained. It's vital to have straight thread when starting for crimped or mangled thread is impossible to get started. Or have the users switch to gold ball bonding if possible. Cheers! Julia Aebersold, Ph.D. Manager, Micro/Nano Technology Center University of Louisville 2210 South Brook Street Shumaker Research Building, Room 233 Louisville, KY 40292 (502) 852-1572 http://louisville.edu/micronano/ ________________________________ From: labnetwork > on behalf of Shivakumar Bhaskaran > Sent: Monday, December 13, 2021 6:21 PM To: labnetwork at mtl.mit.edu > Subject: [labnetwork] Wedge Bonders CAUTION: This email originated from outside of our organization. Do not click links, open attachments, or respond unless you recognize the sender's email address and know the contents are safe. Hi All, We are planning to purchase a wedge bonder. I used K&S (now MPP) and West Bond manual wedge bonder. But in my experience, users have difficulty threading the wires, and most of the time, it never works, and this tool requires many hours of staff support to help users and keep the tool running. I would like to know which Wedge bonder you have in your facility and any recommendations that I can buy. Thanks Shiva Shivakumar Bhaskaran, Ph.D., Associate Director, John D. O'Brien Nanofabrication Laboratory Michelson Hall, 1002 Childs Way, MCB LL121, Los Angeles, California 90089, 213 821 2374 [Sign] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.jpg Type: image/jpeg Size: 2116 bytes Desc: image001.jpg URL: From shimonel at savion.huji.ac.il Wed Dec 15 09:43:47 2021 From: shimonel at savion.huji.ac.il (Shimon Eliav) Date: Wed, 15 Dec 2021 14:43:47 +0000 Subject: [labnetwork] Raised Floor Survey Message-ID: Thanks to everybody collaborated on this small survey. Please find attached a summary with all inputs. Really appreciated!!! Shimon -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Raised Floor Survey.xlsx Type: application/vnd.openxmlformats-officedocument.spreadsheetml.sheet Size: 212461 bytes Desc: Raised Floor Survey.xlsx URL: From julia.aebersold at louisville.edu Wed Dec 15 12:53:06 2021 From: julia.aebersold at louisville.edu (Aebersold,Julia W.) Date: Wed, 15 Dec 2021 17:53:06 +0000 Subject: [labnetwork] University of Louisville Searching for a new Faculty Director of the MNTC Message-ID: The University of Louisville invites applications for the Faculty Director of our NSF NNCI Micro Nano Technology Center (MNTC). The Faculty Director is expected to lead our nationally-recognized MNTC core facility, perform cutting-edge research, create a high-profile research center that leverages the expertise of the faculty and facilities, and educate students from the undergraduate to graduate level. The Faculty Director will also serve as associate director of our NSF KY Multiscale NNCI site (www.kymultiscale.net) with the expectation to lead the University's proposal for renewal in 2025. More details are at the following link. https://www.higheredjobs.com/institution/details.cfm?JobCode=177729509&Title=Professor%20%28Open%20Rank%29%20ECE%20%28Micro%2FNano%20Technology%20Center%20Director%29%20%28Job%20Id%3A%2042589%29&aID=7137 Cheers! Julia Aebersold, Ph.D. Manager, Micro/Nano Technology Center University of Louisville Shumaker Research Building, Room 233 2210 South Brook Street Louisville, KY 40292 (502) 852-1572 http://louisville.edu/micronano/ -------------- next part -------------- An HTML attachment was scrubbed... URL: From mtang at stanford.edu Thu Dec 16 09:46:05 2021 From: mtang at stanford.edu (Mary Tang) Date: Thu, 16 Dec 2021 06:46:05 -0800 Subject: [labnetwork] Open position at SNF: Process Engineering Program Manager Message-ID: <9e17c321-be39-e956-84c5-0c17ce00f56b@stanford.edu> Dear Lab Network - We 'd like to invite a friendly, creative fab engineer to who's interested in building process module for our lab community, as well as manage the NNCI and other forward-looking programs.? The ideal candidate, as is generally the case in our business, is a jack-or-jill of all trades, who is resourceful, team-oriented, and with excellent communication and presentation skills.? This position might be best described as a process integration engineer, tasked with the responsibility of democratizing device design, fab, test and characterization technologies, making them accessible to everyone. Please share this link with anyone you think might be interested: https://careersearch.stanford.edu/jobs/process-engineering-program-manager-15289 Thanks for your attention! Mary -- Mary X. Tang, Ph.D. Managing Director Stanford Nanofabrication Facility Paul G. Allen Building 420 Via Palou Mall Stanford, CA 94305 https://snf.stanford.edu mtang at stanford.edu From mokhodada at gmail.com Sat Dec 18 12:51:43 2021 From: mokhodada at gmail.com (Mo Khodadadi) Date: Sat, 18 Dec 2021 12:51:43 -0500 Subject: [labnetwork] Job Opening, EnaChip Microfabrication Process Engineer Job opportunity Message-ID: Hello, We have a Job opening for Microfabrication Process Engineering in EnaChip Inc Located in Rocky Hill, New Jersey. Please email me for further information. mokhodada at gmail.com Attached, you can find the Job description. Job description Company and Job Description Enachip is a fast-growing VC-funded startup company in the semiconductor microfabrication space. Our highly technical team is developing and commercializing unique proprietary magnetic materials and groundbreaking microfabrication processes that enable integrated power management solutions and positively impact the way to power future electronic devices. Enachip seeks a motivated and creative individual to work in a fast-paced, market-oriented R&D team environment, applying MEMS process technologies to fabricate Wafer Level Magnetics for power management applications and other market verticals. A strong preference will be given to individuals with experience in thick photolithography and electrodeposition/electroplating techniques, process integration/process transfer and characterization of devices, DOE setup, and failure predictions. The candidate will be expected to offer creative insights and solutions for R&D and production problems, develop and characterize process modules that will be part of a standard fabrication platform, help execute and analyze device design and fabrication experiments, and carry out written and oral reporting. The Process Engineer is responsible for - Process flow and integration towards the fabrication of micro-magnetic devices - Work with engineering and cross-functional teams to design and develop new devices and fabrication processes compatible with volume manufacturing. - Develop new techniques to support the processing needs and improve the current capabilities - Create and analyze statistically designed experiments to effectively evaluate process corners to identify significant risks and ensure margin for high volume applications - Interpret and analyze data from magnetic device characterization procedures and contribute to the development of new characterization methods and procedures - Work independently and collaboratively; assist with other engineers and cleanroom operators as needed. - Collect, analyze, document, and report data - Contribute ideas for new fabrication processes and refinements to current and upcoming process flow - Participate in root cause analysis, corrective actions, and help the team in process improvements - Follow instructions, safety regulations, and compliance requirements Required Skills: - Statistical analysis software experience such as JMP, SAS, Minitab - A strong background in communication, negotiation, DOE setup, data analysis, and reporting - MEMS process integration and process transfer expertise, particularly in polysilicon/nitride systems - Characterization experience and metrology in optical microscopy, profilometer, SEM, FIB, surface science analysis, interferometry, electrical testing, etc. - Vacuum metallic and dielectric thin film deposition (sputtering, evaporation) - Photo-resist spinning, contact, non-contact, and stepper photolithography - Wet and reactive ion-etching and thin film deposition techniques - The ability of multitasking in a team or as an individual contributor - Detail-orientation and having the initiative to improve current standard - Effective oral and written communication and computer skills - Good laboratory hygiene and organization skills - Experience in 2D and 3D CAD design and lithography mask layout Education and Experiences: - Masters or Doctorate degree in Engineering or similar field (e.g. Electrical Engineering, Chemical Engineering, Materials Science, Mechanical Engineering, Physics or related discipline) with a focus on microfabrication and MEMS - 1-5 years of MEMS or semiconductor process experience in volume applications - Must be authorized to work in the U.S. Other: - Enachip offers a great work environment, professional development, challenging careers, and competitive compensation. - EnaChip is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national or ethnic origin, sex, sexual orientation, gender identity or expression, age, disability, protected veteran status, or other characteristics protected by law. - EnaChip is NOT accepting unsolicited assistance from search firms. All resumes submitted by search firms to any employee of EnaChip in any fashion without a valid written search agreement in place will be deemed the sole property of EnaChip. No fee will be paid if a candidate is hired by WTS based upon an unsolicited referral. Job Type: Full-time COVID-19 considerations: EnaChip Inc. is complying with CDC recommendations regarding COVID-19. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: EnaChip- Microfabrication Process Engineer.pdf Type: application/pdf Size: 54183 bytes Desc: not available URL: From ahryciw at ualberta.ca Tue Dec 21 15:15:52 2021 From: ahryciw at ualberta.ca (Aaron Hryciw) Date: Tue, 21 Dec 2021 13:15:52 -0700 Subject: [labnetwork] Metered chemical dispensing? Message-ID: Hi all, In our open-access cleanroom, we provide common chemicals "free of charge", in the sense that there is no additional charge to use them apart from the tool time (e.g., hourly rate for wet deck login). This includes such chemicals as acetone, IPA, photoresist developers, standard metal wet etchants, KOH, etc.; the cost of supplying the chemical is (at least in principle) wrapped up into the tool rate. I believe that this is a fairly standard approach among cleanrooms in academic settings. A shortcoming of this approach is that high-volume chemical users are being charged the same as low-volume chemical users; there is also no (financial) incentive for users to limit their chemical usage to just the volume they need. We are therefore looking into ways in which we can capture the actual volume of chemicals used by each user, at least for some high-value and/or high-volume chemicals, such that billing for chemical usage can be applied more fairly. As global supply chain issues have increased the cost of chemicals, this is becoming even more important. Ideally, the method of capturing usage should be largely automated (e.g., not just a physical chemical use logbook at each wet deck), such that it does not take a lot of staff bandwidth to administrate, and should not rely on the honour system only (e.g., logging usage of a material in our lab management software), to ensure compliance. One approach we have been considering is having some kind of metered chemical dispensing. For instance, the piranha wet deck would be plumbed with dispensers (e.g., chemical-compatible metering pumps) for sulfuric acid and hydrogen peroxide, perhaps drawing from large drums of the stock chemicals housed remotely (e.g., in a subfab or service chase). A qualified user would login to the dispenser (via our lab management software), dispense the required volumes of the chemicals, logout, and the volume used would be tracked and automatically logged to their account. I expect that such a scheme is not as simple as it seems, and that there are probably a host of engineering, software, and other logistical problems that would need to be solved to implement this safely and effectively, at least if a turnkey solution for this does not already exist. Has anyone implemented anything like this in their own cleanroom? Or is this a horribly over-engineered solution to a relatively minor problem? I'd be very interested in hearing how others have dealt with the problem of charging users fairly for chemical usage. Cheers, ? Aaron Aaron Hryciw, PhD, PEng Fabrication Group Manager University of Alberta - nanoFAB W1-060 ECERF Building 9107 - 116 Street Edmonton, Alberta Canada T6G 2V4 Ph: 780-940-7938 www.nanofab.ualberta.ca -------------- next part -------------- An HTML attachment was scrubbed... URL: From jtmitch5 at ncsu.edu Tue Dec 21 16:50:09 2021 From: jtmitch5 at ncsu.edu (James Mitchell) Date: Tue, 21 Dec 2021 16:50:09 -0500 Subject: [labnetwork] Metered chemical dispensing? In-Reply-To: References: Message-ID: Why not charge by process the user is doing. Standardized processes would include how much chemical would be used in a SOP. If a user abuses the process limits they would pay a surcharge for the extra chemical they used. If the excessive chemical usage continues the user would no longer be welcomed. Jim On Tue, Dec 21, 2021, 4:14 PM Aaron Hryciw wrote: > Hi all, > > In our open-access cleanroom, we provide common chemicals "free of > charge", in the sense that there is no additional charge to use them apart > from the tool time (e.g., hourly rate for wet deck login). This includes > such chemicals as acetone, IPA, photoresist developers, standard metal wet > etchants, KOH, etc.; the cost of supplying the chemical is (at least in > principle) wrapped up into the tool rate. I believe that this is a fairly > standard approach among cleanrooms in academic settings. > > A shortcoming of this approach is that high-volume chemical users are > being charged the same as low-volume chemical users; there is also no > (financial) incentive for users to limit their chemical usage to just the > volume they need. We are therefore looking into ways in which we can > capture the actual volume of chemicals used by each user, at least for some > high-value and/or high-volume chemicals, such that billing for > chemical usage can be applied more fairly. As global supply chain issues > have increased the cost of chemicals, this is becoming even more important. > > Ideally, the method of capturing usage should be largely automated (e.g., > not just a physical chemical use logbook at each wet deck), such that it > does not take a lot of staff bandwidth to administrate, and should not rely > on the honour system only (e.g., logging usage of a material in our lab > management software), to ensure compliance. > > One approach we have been considering is having some kind of metered > chemical dispensing. For instance, the piranha wet deck would be plumbed > with dispensers (e.g., chemical-compatible metering pumps) for sulfuric > acid and hydrogen peroxide, perhaps drawing from large drums of the stock > chemicals housed remotely (e.g., in a subfab or service chase). A > qualified user would login to the dispenser (via our lab > management software), dispense the required volumes of the chemicals, > logout, and the volume used would be tracked and automatically logged to > their account. > > I expect that such a scheme is not as simple as it seems, and that there > are probably a host of engineering, software, and other logistical problems > that would need to be solved to implement this safely and effectively, at > least if a turnkey solution for this does not already exist. Has anyone > implemented anything like this in their own cleanroom? Or is this a > horribly over-engineered solution to a relatively minor problem? I'd be > very interested in hearing how others have dealt with the problem of > charging users fairly for chemical usage. > > Cheers, > > ? Aaron > > > > > Aaron Hryciw, PhD, PEng > > Fabrication Group Manager > > University of Alberta - nanoFAB > > W1-060 ECERF Building > > 9107 - 116 Street > > Edmonton, Alberta > > Canada T6G 2V4 Ph: 780-940-7938 > www.nanofab.ualberta.ca > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From bill_flounders at berkeley.edu Tue Dec 21 16:55:40 2021 From: bill_flounders at berkeley.edu (Albert William (Bill) Flounders) Date: Tue, 21 Dec 2021 13:55:40 -0800 Subject: [labnetwork] Metered chemical dispensing? In-Reply-To: References: Message-ID: Aaron, We have implemented consumption monitoring and billing on several tools.. They are not simple - but they are increasingly necessary. Efforts from both equipment engineering team and computer team required. We have only implemented for most expensive items e.g., DUV resist (>$4K/gallon), germane (>$13K/cylinder), and Pt ALD precursor. For gases - mfc is tied to monitoring system. Voltage to mfc is related to flow setting, time that voltage is >0 defines how long to integrate. For ALD - pulse counter added to ALD pulsing valve; charge per pulse defined on estimated delivery volume. For photoresist dispense, pulse counter added to resist flow control valve; volume of resist dispensed per actuation is estimated and charge per pulse defined. Integrating these with the Laboratory Management System (LMS) was non trivial. Linkage of the monitoring system to the LMS is what enables the tracked consumption to be associated with the researcher who had the tool enabled for that run - and provides automated billing. Equipment and Facilities Manager may discuss with you offline. He presented summary of system at UGIM 2014 or 2016. Bill Flounders UC Berkeley On Tue, Dec 21, 2021 at 1:14 PM Aaron Hryciw wrote: > Hi all, > > In our open-access cleanroom, we provide common chemicals "free of > charge", in the sense that there is no additional charge to use them apart > from the tool time (e.g., hourly rate for wet deck login). This includes > such chemicals as acetone, IPA, photoresist developers, standard metal wet > etchants, KOH, etc.; the cost of supplying the chemical is (at least in > principle) wrapped up into the tool rate. I believe that this is a fairly > standard approach among cleanrooms in academic settings. > > A shortcoming of this approach is that high-volume chemical users are > being charged the same as low-volume chemical users; there is also no > (financial) incentive for users to limit their chemical usage to just the > volume they need. We are therefore looking into ways in which we can > capture the actual volume of chemicals used by each user, at least for some > high-value and/or high-volume chemicals, such that billing for > chemical usage can be applied more fairly. As global supply chain issues > have increased the cost of chemicals, this is becoming even more important. > > Ideally, the method of capturing usage should be largely automated (e.g., > not just a physical chemical use logbook at each wet deck), such that it > does not take a lot of staff bandwidth to administrate, and should not rely > on the honour system only (e.g., logging usage of a material in our lab > management software), to ensure compliance. > > One approach we have been considering is having some kind of metered > chemical dispensing. For instance, the piranha wet deck would be plumbed > with dispensers (e.g., chemical-compatible metering pumps) for sulfuric > acid and hydrogen peroxide, perhaps drawing from large drums of the stock > chemicals housed remotely (e.g., in a subfab or service chase). A > qualified user would login to the dispenser (via our lab > management software), dispense the required volumes of the chemicals, > logout, and the volume used would be tracked and automatically logged to > their account. > > I expect that such a scheme is not as simple as it seems, and that there > are probably a host of engineering, software, and other logistical problems > that would need to be solved to implement this safely and effectively, at > least if a turnkey solution for this does not already exist. Has anyone > implemented anything like this in their own cleanroom? Or is this a > horribly over-engineered solution to a relatively minor problem? I'd be > very interested in hearing how others have dealt with the problem of > charging users fairly for chemical usage. > > Cheers, > > ? Aaron > > > > > Aaron Hryciw, PhD, PEng > > Fabrication Group Manager > > University of Alberta - nanoFAB > > W1-060 ECERF Building > > 9107 - 116 Street > > Edmonton, Alberta > > Canada T6G 2V4 Ph: 780-940-7938 > www.nanofab.ualberta.ca > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From odc1n08 at soton.ac.uk Wed Dec 22 05:39:15 2021 From: odc1n08 at soton.ac.uk (Owain Clark) Date: Wed, 22 Dec 2021 10:39:15 +0000 Subject: [labnetwork] Metered chemical dispensing? In-Reply-To: References: Message-ID: Another vote that unless you have the spare resources to dedicate to implementing and maintaining a non-trivial technical solution your most efficient first pass solution would likely be to tighten up on SOPs, and identify the users that are using unusual quantities of chemicals - find out why and then try to improve/substitute the process in question or re-educate them in correct use as needed. We only charge for gold use in evaporators (per g, crucible weighed before/after) and e-beam lith. chemicals issued to users (ZEP/E-spacer by ml issued). Other expensive consumables are purchased privately per research group. The method is quite old school, users fill in a log book as needed, a spreadsheet is summarised, and finance make the transactions between project codes once per month. Other than that charges for common consumables (IPA/acetone/NMP/caustics/gases etc) are averaged into the yearly rate setting process and so far that seems to work fine. Regards, Owain From: labnetwork On Behalf Of James Mitchell Sent: 21 December 2021 21:50 To: Aaron Hryciw Cc: Fab Network Subject: Re: [labnetwork] Metered chemical dispensing? CAUTION: This e-mail originated outside the University of Southampton. Why not charge by process the user is doing. Standardized processes would include how much chemical would be used in a SOP. If a user abuses the process limits they would pay a surcharge for the extra chemical they used. If the excessive chemical usage continues the user would no longer be welcomed. Jim On Tue, Dec 21, 2021, 4:14 PM Aaron Hryciw > wrote: Hi all, In our open-access cleanroom, we provide common chemicals "free of charge", in the sense that there is no additional charge to use them apart from the tool time (e.g., hourly rate for wet deck login). This includes such chemicals as acetone, IPA, photoresist developers, standard metal wet etchants, KOH, etc.; the cost of supplying the chemical is (at least in principle) wrapped up into the tool rate. I believe that this is a fairly standard approach among cleanrooms in academic settings. A shortcoming of this approach is that high-volume chemical users are being charged the same as low-volume chemical users; there is also no (financial) incentive for users to limit their chemical usage to just the volume they need. We are therefore looking into ways in which we can capture the actual volume of chemicals used by each user, at least for some high-value and/or high-volume chemicals, such that billing for chemical usage can be applied more fairly. As global supply chain issues have increased the cost of chemicals, this is becoming even more important. Ideally, the method of capturing usage should be largely automated (e.g., not just a physical chemical use logbook at each wet deck), such that it does not take a lot of staff bandwidth to administrate, and should not rely on the honour system only (e.g., logging usage of a material in our lab management software), to ensure compliance. One approach we have been considering is having some kind of metered chemical dispensing. For instance, the piranha wet deck would be plumbed with dispensers (e.g., chemical-compatible metering pumps) for sulfuric acid and hydrogen peroxide, perhaps drawing from large drums of the stock chemicals housed remotely (e.g., in a subfab or service chase). A qualified user would login to the dispenser (via our lab management software), dispense the required volumes of the chemicals, logout, and the volume used would be tracked and automatically logged to their account. I expect that such a scheme is not as simple as it seems, and that there are probably a host of engineering, software, and other logistical problems that would need to be solved to implement this safely and effectively, at least if a turnkey solution for this does not already exist. Has anyone implemented anything like this in their own cleanroom? Or is this a horribly over-engineered solution to a relatively minor problem? I'd be very interested in hearing how others have dealt with the problem of charging users fairly for chemical usage. Cheers, - Aaron Aaron Hryciw, PhD, PEng Fabrication Group Manager University of Alberta - nanoFAB W1-060 ECERF Building 9107 - 116 Street Edmonton, Alberta Canada T6G 2V4 Ph: 780-940-7938 www.nanofab.ualberta.ca _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From rlc12 at cornell.edu Wed Dec 22 12:55:30 2021 From: rlc12 at cornell.edu (Rebecca Lee Vliet) Date: Wed, 22 Dec 2021 17:55:30 +0000 Subject: [labnetwork] REMINDER: January 2022 CNF TCN VIRTUAL Short Course - REGISTRATION OPEN! Message-ID: Please post & share the announcement with other members of the scientific communities. Thank you! CNF Technology & Characterization at the Nanoscale (CNF TCN) VIRTUAL Short Course January 19, 2022 - January 21, 2022 The CNF TCN is going virtual for January 2022! The virtual shorts course will be held Wednesday, January 19, 2022 - Friday, January 21, 2022, daily from 11:00am to 4:00pm (EDT). Each day offers lectures and laboratory demonstrations designed to impart a broad understanding of the science and technology required to undertake research in nanoscience. TCN is an ideal way for faculty, students, post docs and staff members to rapidly come up to speed in many of the technologies that users of the CNF need to employ. Members of the high tech business community will also find it an effective way to learn best practices for success in a nanofab environment. Attendance is open to the general scientific community. Note: The short course does not replace the three part training required to become a user of our facility. To become a CNF user, please visit the "Getting Started" link (https:cnf.cornell.edu/howto) on the CNF website. For more information and to register visit: https://cnf.cornell.edu/education/tcn (Registration deadline, January 10, 2022) -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Announcement_January2022_EMAIL.jpg Type: image/jpeg Size: 205208 bytes Desc: Announcement_January2022_EMAIL.jpg URL: From neil.zimmerman at nist.gov Wed Dec 29 17:31:24 2021 From: neil.zimmerman at nist.gov (Zimmerman, Neil M. (Fed)) Date: Wed, 29 Dec 2021 22:31:24 +0000 Subject: [labnetwork] Please post to listserve (job opening) Message-ID: Job opening at NIST for BS/MS and familiarity with flip-chip solder bump processing Dear Colleague: A group of us here at NIST Gaithersburg, MD, USA would like to improve our packaging capabilities. In particular, we would like to improve the quality of our high-frequency transmission onto dies. For this purpose, we are hoping to set up a process for researchers using equipment at NIST to perform flip-chip solder bump packaging. We are not looking for a high-volume production capability, but rather the simple procedure that could be used by researchers working with small numbers of dies. In order to accomplish this, we hope to procure the services of a limited-term (1 - 2 years initially) employee who will develop this new capability for us. If this succeeds, there would be a possibility of making this a longer-term position. We would greatly appreciate i) passing this onto qualified candidates and ii) suggestions as to other places we could advertise this. Appended please find a job description; if you think there are other disciplines or areas of expertise that would be helpful to us, please let us know. Thank you in advance for your assistance. Job Description: Electrical or Mechanical Engineer Duties: Support the Nanoscale Device Characterization Division program by further developing solder bumping processes as well as the complementary flip-chip packaging procedure for chip to printed circuit board bonding. This includes development of procedures to use existing pick-and-place tools and/or develop custom stamps for solder ball-chip attachment. There will be an emphasis on developing indium solder ball attachment procedures. This also includes development of procedures to accomplish chip-to-printed circuit board bonding using reflow ovens and the subsequent tests to verify good bonding. There is also an expectation that the candidate will be required to interact with other division researchers with multidisciplinary backgrounds including physicists, electrical engineers, and mechanical engineers. Requirements: * Undergraduate or Graduate degree in mechanical engineering, electrical engineering, physics, or related field with significant experience in development of flip-chip bonding procedures. -------------- next part -------------- An HTML attachment was scrubbed... URL: