[labnetwork] wafer bonding and thinning

[Pilar Herrera-Fierro]

Travis,
We do have anodic bonding at LNF and several techniques that will allow you
thinning the Si wafer .. lapping,  RIE, also HNA etch. . Do you need a
polished Si surface?

Pilar


On Fri, Feb 5, 2021 at 4:10 PM Travis Gabel <travisgabel at boisestate.edu>
wrote:

> Hi
>
> We have a project in our lab that requires some wafer to glass bonding.
> Are there any labs that offer this service or any vendors that you have
> used for a similar process? We are looking for anodic bonding.
>
> After bonding we need the silicon thinned to ~50um.  Does anyone offer
> this or have a vendor that they have worked with?
>
> Thanks
> Travis
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-- 
Pilar Herrera-Fierro, Ph.D.
LNF User Services Director
Lurie Nanofabrication Facility
University of Michigan

RM 1239 EECS Building
1301 Beal Ave.
Ann Arbor, MI 48109-2122

*Cell* 734 646 1399

(734) 646 1399

www.lnf.umich.edu
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