From wjkiethe at ncsu.edu  Wed Jun  2 16:00:59 2021
From: wjkiethe at ncsu.edu (Bill Kiether)
Date: Wed, 2 Jun 2021 16:00:59 -0400
Subject: [labnetwork] Service manual or schematics for March PM-600
Message-ID: <CAN1vintzYJvz=cidBASKPWoqVOShp-s6ZJ2y-y4Ou06nf1iAVA@mail.gmail.com>

Hi,

Does anyone have a service manual or schematics for a March PM-600 Asher -
trying to fix an MFC issue and want to identify what the various switches
control?

Bill Kiether
NCSU NAnofabrication Facility
wjkiethe at ncsu.edu
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From karlb at uw.edu  Thu Jun  3 00:13:08 2021
From: karlb at uw.edu (Karl F. Bohringer)
Date: Thu, 3 Jun 2021 04:13:08 +0000
Subject: [labnetwork] Fabrication / Equipment Service Engineer at the
 University of Washington, Seattle
Message-ID: <MWHPR08MB33271CFA2399C0C5AE0E57DFD43C9@MWHPR08MB3327.namprd08.prod.outlook.com>

The Washington Nanofabrication Facility (https://www.wnf.washington.edu/), an NSF NNCI facility and the largest publicly accessible cleanroom in the Pacific Northwest, has an outstanding opportunity for a Fabrication/Equipment Service Engineer. The Fabrication/Equipment Service Engineer will be responsible for equipment troubleshooting, facilities infrastructure monitoring and support, baseline process monitoring, tool ownership, and executing contract manufacturing efforts. More information can be found at
https://uwhires.admin.washington.edu/eng/candidates/default.cfm?szCategory=jobprofile&szOrderID=190830&szCandidateID=0&szSearchWords=&szReturnToSearch=1

Karl F. B?hringer, Ph.D.
Professor of Electrical & Computer Engineering and Bioengineering
Director, Nano-engineered Systems Institute (NanoES)
Site Director, National Nanotechnology Coordinated Infrastructure (NNCI)
University of Washington
Campus Box 352500
Seattle, WA 98195-2500, USA
karlb at uw.edu<mailto:karlb at uw.edu>
nano.uw.edu<http://www.nano.uw.edu/>


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From wjkiethe at ncsu.edu  Thu Jun  3 13:51:15 2021
From: wjkiethe at ncsu.edu (Bill Kiether)
Date: Thu, 3 Jun 2021 13:51:15 -0400
Subject: [labnetwork] Service manual or schematics for March PM-600
In-Reply-To: <CAN1vintzYJvz=cidBASKPWoqVOShp-s6ZJ2y-y4Ou06nf1iAVA@mail.gmail.com>
References: <CAN1vintzYJvz=cidBASKPWoqVOShp-s6ZJ2y-y4Ou06nf1iAVA@mail.gmail.com>
Message-ID: <CAN1vinvvzG-WW_f=00YhacK45HkUabigV4T6ThNuEQ2oLJZgAw@mail.gmail.com>

Thanks everybody for the help. We are back online with the Asher.

Bill

On Wed, Jun 2, 2021 at 4:00 PM Bill Kiether <wjkiethe at ncsu.edu> wrote:

> Hi,
>
> Does anyone have a service manual or schematics for a March PM-600 Asher -
> trying to fix an MFC issue and want to identify what the various switches
> control?
>
> Bill Kiether
> NCSU NAnofabrication Facility
> wjkiethe at ncsu.edu
>
>
>
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From rmorrison at draper.com  Thu Jun  3 14:37:29 2021
From: rmorrison at draper.com (Morrison, Richard H., Jr)
Date: Thu, 3 Jun 2021 18:37:29 +0000
Subject: [labnetwork] Furnace tube PM question
Message-ID: <53dc4a7b7a55424abf693cf919cca9d2@draper.com>

HI Everyone,

We have a MRL poly dep tube for 150mm wafers, the tube has a load paddle and a tube liner. We are having issues with the liner sticking to the tube when we try to change out the TC we need to shift the liner. My question is how often to change the liner.

When I worked at Kopin back in the 1985-92 we used to run Poly at 1um thick and replace the liner every 10-15um which for us was every 10-15 weeks. At Draper we have a via fill process and the runs are 4um, any ideas on liner change or any ideas we can use to not make it stick?

Rick


Richard Morrison
PMTS
Draper Laboratory
555 Technology Square
Cambridge Ma  02139
Office: 617-258-3420
Cell: 508-930-3461

________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________
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From Edward.Gonzales at colorado.edu  Thu Jun  3 17:53:48 2021
From: Edward.Gonzales at colorado.edu (Edward Gonzales)
Date: Thu, 3 Jun 2021 21:53:48 +0000
Subject: [labnetwork] Power Supply for thermal evaporator
Message-ID: <DM5PR03MB2972CAC4447467E9C87835739F3C9@DM5PR03MB2972.namprd03.prod.outlook.com>

Does anyone have a spare power supply for a thermal evaporator that they are looking to unload?

Thanks,

Edward Gonzales
Research Facilities Manager
COSINC
University of Colorado Boulder
505-450-3338 (cell)
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From m.rampant at prometheuscomputing.com  Fri Jun  4 07:39:06 2021
From: m.rampant at prometheuscomputing.com (Mathieu Rampant)
Date: Fri, 4 Jun 2021 07:39:06 -0400
Subject: [labnetwork] NEMO Virtual Conference Registration - June 8th
 1PM to 5PM Eastern
In-Reply-To: <CALW5w0217nc4DHpBaxB_PtObhYE=FVZrHxN1iO25h-VuewuWFw@mail.gmail.com>
References: <CALW5w0217nc4DHpBaxB_PtObhYE=FVZrHxN1iO25h-VuewuWFw@mail.gmail.com>
Message-ID: <CALW5w03dxahD5JoaDzsNKsWMZET0HgrG+dHdi+yKq7NGgB7m9w@mail.gmail.com>

Good morning,
This is the last reminder that the NEMO virtual conference will take place
next week on Tuesday, June 8th from 1-5PM Eastern on Zoom.

You* must register *to attend.
If you haven't already, head over to
https://nemo.prometheuscomputing.com/nemo-virtual-conference and click on
the registration link.

Looking forward to seeing you there.

Thank you!

On Thu, May 13, 2021 at 9:32 AM Mathieu Rampant <
m.rampant at prometheuscomputing.com> wrote:

> Good morning,
> For those who haven't registered already for the virtual conference and
> wish to attend, please go to the following website and click on the
> registration link (registration is required to attend):
>
> https://nemo.prometheuscomputing.com/nemo-virtual-conference
>
> The web page will also provide the current program for the event.
>
> Thank you!
> --
> Mathieu Rampant
> Software Architect
> NEMO Project Lead
> Prometheus Computing LLC
>


-- 
Mathieu Rampant
Software Architect
NEMO Project Lead
Prometheus Computing LLC
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From thejohnnicholson at gmail.com  Mon Jun  7 13:33:21 2021
From: thejohnnicholson at gmail.com (John Nicholson)
Date: Mon, 7 Jun 2021 13:33:21 -0400
Subject: [labnetwork] Hydrogen Bromide Seal Compatibility
Message-ID: <CAK5TLM3GEjz5D+3RuKhagMhqW8Vb=cULYNG0bZJYJzFmzuVg-A@mail.gmail.com>

I'm retiring this month after minding the UMass/Amherst clean rooms solo
since 2008 and have a few last minute equipment configuration issues to
complete.

HBr has been added to our RIE system and the line fitting is a CGA 330
while the tank ordered by a professor is a 634 fitting (nickel seals). I
have a 634 to 330 tank adapter but am unsure whether the Teflon seals used
with the 330 end would be compatible with HBr. Any advice would be
appreciated.

Best regards and thanks for the assistance over the years,

-- 
John Nicholson
Nanofabrication Laboratory Manager
Silvio O. Conte Center for Polymer Research, Rm. B111
University of Massachusetts Amherst
120 Governor's Drive
Amherst,MA 01003-9305
Phone: 413-545-2772
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From tbritton at criticalsystemsinc.com  Mon Jun  7 16:32:32 2021
From: tbritton at criticalsystemsinc.com (Tom Britton)
Date: Mon, 7 Jun 2021 20:32:32 +0000
Subject: [labnetwork] Hydrogen Bromide Seal Compatibility
In-Reply-To: <CAK5TLM3GEjz5D+3RuKhagMhqW8Vb=cULYNG0bZJYJzFmzuVg-A@mail.gmail.com>
References: <CAK5TLM3GEjz5D+3RuKhagMhqW8Vb=cULYNG0bZJYJzFmzuVg-A@mail.gmail.com>
Message-ID: <CO1PR08MB6673646D8406DC203690C593A0389@CO1PR08MB6673.namprd08.prod.outlook.com>

Hi John,

Looks like the professor wants to upgrade to a high purity cylinder connection. For this type of gas (corrosives) I would strongly advise not using the adapter, but rather making a new pigtail with just the DISS connection, and avoid elastomeric seals totally. HBr loves water and really makes a mess if it sees any, even if it's just trace amounts.

We see many people replacing their regulators and/or gas panels due to the interaction of moisture with HBr, either during cylinder changes, or through the use of low purity purge gas. For our gas systems, we use all metal seals, DISS cylinder connections, and if the customer cannot absolutely guarantee 5-9s on their purge gas, a purge gas purifier. Set up this way, the interior of the process line, the panel, regulator, etc. will last a long time in service.

If I can help in any way, just ask.

All the best,

Tom

Tom Britton
Director of Sales
Critical Systems, Inc.
Direct: 208.890.1417
Office: 877.572.5515
Skype: tombrittoncsi
www.CriticalSystemsInc.com<http://www.criticalsystemsinc.com/>

[logo for email signature png]

Note: 7 days per week Technical Support
Phone: 1-888-218-6308
Email: Fieldservices at criticalsystemsinc.com<mailto:Fieldservices at criticalsystemsinc.com>



From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of John Nicholson
Sent: Monday, June 7, 2021 11:33 AM
To: Labnetwork <labnetwork at mtl.mit.edu>
Subject: [labnetwork] Hydrogen Bromide Seal Compatibility

[https://s3.amazonaws.com/staticmediafiles/media/sights/iron-icon-color.png]
IRONSCALES couldn't recognize this email as this is the first time you received an email from this sender thejohnnicholson at gmail.com<mailto:thejohnnicholson at gmail.com>


[EXTERNAL EMAIL] This message originated outside of your organization. Remember to always use caution when opening attachments or clicking on links.
I'm retiring this month after minding the UMass/Amherst clean rooms solo since 2008 and have a few last minute equipment configuration issues to complete.

HBr has been added to our RIE system and the line fitting is a CGA 330 while the tank ordered by a professor is a 634 fitting (nickel seals). I have a 634 to 330 tank adapter but am unsure whether the Teflon seals used with the 330 end would be compatible with HBr. Any advice would be appreciated.

Best regards and thanks for the assistance over the years,

--
John Nicholson
Nanofabrication Laboratory Manager
Silvio O. Conte Center for Polymer Research, Rm. B111
University of Massachusetts Amherst
120 Governor's Drive
Amherst,MA 01003-9305
Phone: 413-545-2772
This email and any files transmitted with it are confidential and intended solely for the use of the individual or entity to whom they are addressed. If you have received this email in error please notify the system manager. This message contains confidential information and is intended only for the individual named. If you are not the named addressee you should not disseminate, distribute or copy this e-mail. Please notify the sender immediately by e-mail if you have received this e-mail by mistake and delete this e-mail from your system. If you are not the intended recipient you are notified that disclosing, copying, distributing or taking any action in reliance on the contents of this information is strictly prohibited.'. If the disclaimer can't be applied, attach the message to a new disclaimer message.
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From mapril at draper.com  Tue Jun  8 05:41:03 2021
From: mapril at draper.com (April, Mark R.)
Date: Tue, 8 Jun 2021 09:41:03 +0000
Subject: [labnetwork] Hydrogen Bromide Seal Compatibility
In-Reply-To: <CO1PR08MB6673646D8406DC203690C593A0389@CO1PR08MB6673.namprd08.prod.outlook.com>
References: <CAK5TLM3GEjz5D+3RuKhagMhqW8Vb=cULYNG0bZJYJzFmzuVg-A@mail.gmail.com>
 <CO1PR08MB6673646D8406DC203690C593A0389@CO1PR08MB6673.namprd08.prod.outlook.com>
Message-ID: <e4eb46e207ad46a9956d0153201e92a3@draper.com>

Hi John,
I agree with Tom from Critical systems.  I would not use an adaptor, but replace the 330 with a 634 on the pigtail.  We use GMP process piping here at Draper for these types of welds.  Their prices are good and they perform great work
Good Luck and happy retirement!!

Mark R. April
Senior  Equipment Engineer
Microfabrication Laboratory
[color_logo_small4]
555 Technology Square
Cambridge, MA  02139
mapril at draper.com<mailto:mapril at draper.com>
O # 617-258-1613 C # 617-455-1596
www.draper.com<http://www.draper.com/>



From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Tom Britton
Sent: Monday, June 7, 2021 4:33 PM
To: John Nicholson <thejohnnicholson at gmail.com>; Labnetwork <labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] Hydrogen Bromide Seal Compatibility

Hi John,

Looks like the professor wants to upgrade to a high purity cylinder connection. For this type of gas (corrosives) I would strongly advise not using the adapter, but rather making a new pigtail with just the DISS connection, and avoid elastomeric seals totally. HBr loves water and really makes a mess if it sees any, even if it's just trace amounts.

We see many people replacing their regulators and/or gas panels due to the interaction of moisture with HBr, either during cylinder changes, or through the use of low purity purge gas. For our gas systems, we use all metal seals, DISS cylinder connections, and if the customer cannot absolutely guarantee 5-9s on their purge gas, a purge gas purifier. Set up this way, the interior of the process line, the panel, regulator, etc. will last a long time in service.

If I can help in any way, just ask.

All the best,

Tom

Tom Britton
Director of Sales
Critical Systems, Inc.
Direct: 208.890.1417
Office: 877.572.5515
Skype: tombrittoncsi
www.CriticalSystemsInc.com<http://www.criticalsystemsinc.com/>

[logo for email signature png]

Note: 7 days per week Technical Support
Phone: 1-888-218-6308
Email: Fieldservices at criticalsystemsinc.com<mailto:Fieldservices at criticalsystemsinc.com>



From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of John Nicholson
Sent: Monday, June 7, 2021 11:33 AM
To: Labnetwork <labnetwork at mtl.mit.edu>
Subject: [labnetwork] Hydrogen Bromide Seal Compatibility

[Image removed by sender.]

IRONSCALES couldn't recognize this email as this is the first time you received an email from this sender thejohnnicholson at gmail.com<mailto:thejohnnicholson at gmail.com>



[EXTERNAL EMAIL] This message originated outside of your organization. Remember to always use caution when opening attachments or clicking on links.
I'm retiring this month after minding the UMass/Amherst clean rooms solo since 2008 and have a few last minute equipment configuration issues to complete.

HBr has been added to our RIE system and the line fitting is a CGA 330 while the tank ordered by a professor is a 634 fitting (nickel seals). I have a 634 to 330 tank adapter but am unsure whether the Teflon seals used with the 330 end would be compatible with HBr. Any advice would be appreciated.

Best regards and thanks for the assistance over the years,

--
John Nicholson
Nanofabrication Laboratory Manager
Silvio O. Conte Center for Polymer Research, Rm. B111
University of Massachusetts Amherst
120 Governor's Drive
Amherst,MA 01003-9305
Phone: 413-545-2772
This email and any files transmitted with it are confidential and intended solely for the use of the individual or entity to whom they are addressed. If you have received this email in error please notify the system manager. This message contains confidential information and is intended only for the individual named. If you are not the named addressee you should not disseminate, distribute or copy this e-mail. Please notify the sender immediately by e-mail if you have received this e-mail by mistake and delete this e-mail from your system. If you are not the intended recipient you are notified that disclosing, copying, distributing or taking any action in reliance on the contents of this information is strictly prohibited.'. If the disclaimer can't be applied, attach the message to a new disclaimer message.
________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________
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From schweig at umich.edu  Tue Jun  8 05:57:11 2021
From: schweig at umich.edu (Dennis Schweiger)
Date: Tue, 8 Jun 2021 05:57:11 -0400
Subject: [labnetwork] Hydrogen Bromide Seal Compatibility
In-Reply-To: <CO1PR08MB6673646D8406DC203690C593A0389@CO1PR08MB6673.namprd08.prod.outlook.com>
References: <CAK5TLM3GEjz5D+3RuKhagMhqW8Vb=cULYNG0bZJYJzFmzuVg-A@mail.gmail.com>
 <CO1PR08MB6673646D8406DC203690C593A0389@CO1PR08MB6673.namprd08.prod.outlook.com>
Message-ID: <CAKzi2_PHURC_5qYTMEjS+nokHZL_sM+2WC5YRU_drQiX0YzYbw@mail.gmail.com>

John,

Good morning.  I agree with Tom, wherever we've tried to use a CGA for a
HPM we've run into long term issues.  That's why all of our HPM gases
(except for Hydrogen, Methane, and Acetylene) are now DISS cylinder
connections.  They just work, each and every time.

Thanks,

Dennis Schweiger
University of Michigan/LNF
Facilities Manager

734.647.2055 Ofc


On Mon, Jun 7, 2021 at 8:03 PM Tom Britton <tbritton at criticalsystemsinc.com>
wrote:

> Hi John,
>
>
>
> Looks like the professor wants to upgrade to a high purity cylinder
> connection. For this type of gas (corrosives) I would strongly advise not
> using the adapter, but rather making a new pigtail with just the DISS
> connection, and avoid elastomeric seals totally. HBr loves water and really
> makes a mess if it sees any, even if it?s just trace amounts.
>
>
>
> We see many people replacing their regulators and/or gas panels due to the
> interaction of moisture with HBr, either during cylinder changes, or
> through the use of low purity purge gas. For our gas systems, we use all
> metal seals, DISS cylinder connections, and if the customer cannot
> absolutely guarantee 5-9s on their purge gas, a purge gas purifier. Set up
> this way, the interior of the process line, the panel, regulator, etc. will
> last a long time in service.
>
>
>
> If I can help in any way, just ask.
>
>
>
> All the best,
>
>
>
> Tom
>
>
>
> Tom Britton
>
> Director of Sales
>
> *Critical Systems, Inc.*
>
> Direct: 208.890.1417
>
> Office: 877.572.5515
>
> Skype: tombrittoncsi
>
> *www.CriticalSystemsInc.com <http://www.criticalsystemsinc.com/>*
>
>
>
> [image: logo for email signature png]
>
>
>
> *Note: 7 days per week Technical Support *
>
> *Phone: 1-888-218-6308*
>
> *Email: Fieldservices at criticalsystemsinc.com
> <Fieldservices at criticalsystemsinc.com>*
>
>
>
>
>
>
>
> *From:* labnetwork <labnetwork-bounces at mtl.mit.edu> * On Behalf Of *John
> Nicholson
> *Sent:* Monday, June 7, 2021 11:33 AM
> *To:* Labnetwork <labnetwork at mtl.mit.edu>
> *Subject:* [labnetwork] Hydrogen Bromide Seal Compatibility
>
>
>
> *IRONSCALES couldn't recognize this email as this is the first time you
> received an email from this sender thejohnnicholson at gmail.com
> <thejohnnicholson at gmail.com>*
>
>
>
> *[EXTERNAL EMAIL]* This message originated outside of your organization.
> Remember to always use caution when opening attachments or clicking on
> links.
>
> I'm retiring this month after minding the UMass/Amherst clean rooms solo
> since 2008 and have a few last minute equipment configuration issues to
> complete.
>
>
>
> HBr has been added to our RIE system and the line fitting is a CGA 330
> while the tank ordered by a professor is a 634 fitting (nickel seals). I
> have a 634 to 330 tank adapter but am unsure whether the Teflon seals used
> with the 330 end would be compatible with HBr. Any advice would be
> appreciated.
>
>
>
> Best regards and thanks for the assistance over the years,
>
>
>
> --
> John Nicholson
> Nanofabrication Laboratory Manager
> Silvio O. Conte Center for Polymer Research, Rm. B111
> University of Massachusetts Amherst
> 120 Governor's Drive
> Amherst,MA 01003-9305
> Phone: 413-545-2772
> This email and any files transmitted with it are confidential and intended
> solely for the use of the individual or entity to whom they are addressed.
> If you have received this email in error please notify the system manager.
> This message contains confidential information and is intended only for the
> individual named. If you are not the named addressee you should not
> disseminate, distribute or copy this e-mail. Please notify the sender
> immediately by e-mail if you have received this e-mail by mistake and
> delete this e-mail from your system. If you are not the intended recipient
> you are notified that disclosing, copying, distributing or taking any
> action in reliance on the contents of this information is strictly
> prohibited.'. If the disclaimer can't be applied, attach the message to a
> new disclaimer message.
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From stieg at cnsi.ucla.edu  Wed Jun  9 13:33:59 2021
From: stieg at cnsi.ucla.edu (Stieg, Adam)
Date: Wed, 9 Jun 2021 17:33:59 +0000
Subject: [labnetwork] Hiring: Research Development Engineer at the UCLA
 NanoLab
Message-ID: <08E1ABA5-989A-4054-9575-E99E68CF2155@ad.ucla.edu>

Dear Colleagues,
The UCLA Nanofabrication Laboratory (NanoLab) is hiring a Research Development Engineer 1 to support cleanroom operations. Duties for this position include chemical management, housekeeping, routine lab maintenance and inventory management as well as equipment testing/calibration and user training.
For full details, applicants should refer to and apply through UCLA?s CHR website:
https://hr.mycareer.ucla.edu/applicants/Central?quickFind=80639
Please contact the UCLA NanoLab director Wilson Lin (yousheng at seas.ucla.edu<mailto:yousheng at seas.ucla.edu>) if you have any questions regarding this position.
All the best,
Adam



Adam Stieg, Ph.D.
Associate Director - California NanoSystems Institute<http://cnsi.ucla.edu/>
Executive Director ? BioPACIFIC Materials Innovation Platform<http://biopacificmip.org/>
Director ? Nano and Pico Characterization Laboratory<https://npc.cnsi.ucla.edu/>
University of California, Los Angeles
(p) 310.206.2902
(e) stieg at cnsi.ucla.edu<mailto:stieg at cnsi.ucla.edu>




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From lan.zhang at baesystems.com  Wed Jun  9 16:33:45 2021
From: lan.zhang at baesystems.com (Zhang, Lan (US))
Date: Wed, 9 Jun 2021 20:33:45 +0000
Subject: [labnetwork] Photo engineer position at BAE Systems (Lexington, MA)
Message-ID: <mailman.0.1623282632.3547.labnetwork@mtl.mit.edu>

Hello all,
BAE Systems Microelectronic Engineering unit is seeking a Principal Semiconductor Process Engineer to join the Lexington Business Center (located in Lexington, MA). Please see the job description below. You can also find more detailed description here: principal semiconductor process engineer BAE systems lexington massachusetts (google.com)<https://www.google.com/search?q=principal+semiconductor+process+engineer+++BAE+systems+++lexington+massachusetts&ei=pCPBYIyiFf7l5NoP_86PuA0&oq=Principal+Semiconductor+Process+Engineer+lexington+ma&gs_lcp=Cgdnd3Mtd2l6EAEYADIFCCEQoAEyBQghEKsCMgUIIRCrAjoICCEQFhAdEB46BwghEAoQoAFQnrEDWPXYA2CM4gNoAXACeACAAa8CiAH5GpIBBjItMTQuMZgBAKABAqABAaoBB2d3cy13aXrAAQE&sclient=gws-wiz&ibp=htl;jobs&sa=X&ved=2ahUKEwjo2cGvsYvxAhVEFFkFHQz8CLkQkd0GMAB6BAgIEAE#fpstate=tldetail&htivrt=jobs&htidocid=NkqJWKzq-xVh9VQRAAAAAA%3D%3D>

If you are interested in the position, or would like to recommend someone, please apply or spread the words around. This position is available immediately.



Primary Responsibilities:
1.     Primary responsibilities of this role are to sustain and improve production processes and tools in the semiconductor wafer foundry, and to develop new processes, focusing on photolithography area.
2.     You will be responsible for making continuous process improvements for yield improvement, driving cycle time and cost reduction projects to completion, qualifying new tools for production including documentation and training/certification of operators, and working with advanced engineering group on new technology development.
3.     Multi-tasking is expected in our fast-paced environment with delivery commitments to both internal and external customers.


Required Skills:

  *   Must hold at minimum a Bachelor's degree in a Science and Engineering field
  *   5 years of experience in semiconductor industry and cleanroom work environment
  *   In depth photolithography knowledge and working experience
  *   Ability to multi-task, functioning both as individual contributor and as team leader
  *   Strong verbal and written communication skills
  *   Ability to perform job functions in wafer foundry clean-room environment
Preferred Education, Experience, & Skills :



  *   5 years of experience in DUV photolithography area
  *   Experience with data analysis software
  *   Experience with PROMIS software


Thanks,
Lan Zhang

Lan Zhang, PhD, MBA
Sr. Principle Engineer
BAE Systems Electronic Systems

T: 603-885-0697 | E: Lan.zhang at baesystems.com<mailto:Lan.zhang at baesystems.com>
65 Spit Brook Rd., Nashua, New Hampshire, 03060, USA
www.baesystems.com<http://www.baesystems.com/>


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From tbritton at criticalsystemsinc.com  Wed Jun  9 17:30:37 2021
From: tbritton at criticalsystemsinc.com (Tom Britton)
Date: Wed, 9 Jun 2021 21:30:37 +0000
Subject: [labnetwork] Two Sales Engineering Positions Open at Critical
 Systems
Message-ID: <PH0PR08MB6678E6143A6DB373BFE61AA7A0369@PH0PR08MB6678.namprd08.prod.outlook.com>

Dear Colleagues,

Critical Systems, Inc. www.criticalsystemsinc.com<http://www.criticalsystemsinc.com>, is hiring two Regional Sales Engineers; one for the east coast and one for the west coast. Ideally what we would like, and why I'm reaching out to the network, are recently graduated electrical, chemistry, mechanical or MEP engineers that spent time in one of the University Nanofabs associated with UGIM/Lab Network, and have had experience working with the facility equipment and the facility management software. Over the years I've met a number of you, have seen your facilities and respect what you all have accomplished. My thoughts are that some of you may have had individuals come through your programs who would be ideally suited for technical sales, and sending them this way would get them started with a great company that really cares about their employees.

We offer an excellent compensation package, that includes salary, commissions, 401K, health insurance, and profit sharing. We'll provide the training and guidance for these individuals to succeed, and are wanting motivated, excited engineers with personalities and persuasive abilities. They would be responsible for promoting CSI's gas delivery and abatement equipment, as well as a new offering that is really exciting that I can't release here.

If you know of anyone that would be interested in this, can you contact me and I'll provide further details?

Thank you so much,

Tom

Tom Britton
Director of Sales
Critical Systems, Inc.
Direct: 208.890.1417
Office: 877.572.5515
Skype: tombrittoncsi
www.CriticalSystemsInc.com<http://www.criticalsystemsinc.com/>

[logo for email signature png]

Note: 7 days per week Technical Support
Phone: 1-888-218-6308
Email: Fieldservices at criticalsystemsinc.com<mailto:Fieldservices at criticalsystemsinc.com>


This email and any files transmitted with it are confidential and intended solely for the use of the individual or entity to whom they are addressed. If you have received this email in error please notify the system manager. This message contains confidential information and is intended only for the individual named. If you are not the named addressee you should not disseminate, distribute or copy this e-mail. Please notify the sender immediately by e-mail if you have received this e-mail by mistake and delete this e-mail from your system. If you are not the intended recipient you are notified that disclosing, copying, distributing or taking any action in reliance on the contents of this information is strictly prohibited.'. If the disclaimer can't be applied, attach the message to a new disclaimer message.
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From darick at uw.edu  Wed Jun  9 19:43:53 2021
From: darick at uw.edu (Darick Baker)
Date: Wed, 9 Jun 2021 16:43:53 -0700
Subject: [labnetwork] vanadium dioxide sputtering
Message-ID: <CAJTeEcrZjvbtgcyFpOC99Wx2_M7_gQ=yGh1OKZ17k4Cf-y6f6Q@mail.gmail.com>

We have a lab user who is interested in sputtering vanadium dioxide. I
realize this has been asked before without an answer, but I thought I'd try
again. Does anybody have a VO2 process running and would be willing to do
some depositions for us?
Barring that, does anybody have any tips or successes with reactively
sputtering VO2?

Thanks for the help.

-- 
Darick Baker, PhD
Business Outreach and Customer Development
New User Orientation
Research Engineer - Deposition
Washington Nanofabrication Facility (WNF)
University of Washington
Fluke Hall 115, Box 352143
Desk: 206.221.8265 Cell: 206.395.4049
fab-support at wnf.uw.edu
https://www.wnf.washington.edu/
Pronouns: he/him
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From codreanu at udel.edu  Thu Jun 10 08:31:10 2021
From: codreanu at udel.edu (Iulian Codreanu)
Date: Thu, 10 Jun 2021 08:31:10 -0400
Subject: [labnetwork] vanadium dioxide sputtering
In-Reply-To: <CAJTeEcrZjvbtgcyFpOC99Wx2_M7_gQ=yGh1OKZ17k4Cf-y6f6Q@mail.gmail.com>
References: <CAJTeEcrZjvbtgcyFpOC99Wx2_M7_gQ=yGh1OKZ17k4Cf-y6f6Q@mail.gmail.com>
Message-ID: <76d1c199-36eb-e791-29b9-bd5e60962693@udel.edu>

Hi Darick,

We have a pulsed laser deposition (PLD) system here at UD which is 
mostly used for Vanadium oxide deposition. PLD is more suited for 
depositing oxides than sputtering.

Please send me a note if you would like to discuss.

Cheers,

Iulian


iulian Codreanu, Ph.D.
Director, Nanofabrication Facility
University of Delaware
Harker ISE Lab, Room 163
221 Academy Street
Newark, DE 19716
302-831-2784
http://udnf.udel.edu

On 6/9/2021 7:43 PM, Darick Baker wrote:
> We have a lab user who is interested in sputtering vanadium dioxide. I 
> realize this has been asked before without an answer, but I thought 
> I'd try again. Does anybody have a?VO2 process running and would be 
> willing to do some depositions for us?
> Barring that, does anybody have any tips or successes with reactively 
> sputtering VO2?
>
> Thanks for the help.
>
> -- 
> Darick Baker, PhD
> Business Outreach and Customer Development
> New User Orientation
> Research Engineer - Deposition
> Washington Nanofabrication Facility (WNF)
> University of Washington
> Fluke Hall 115, Box 352143
> Desk: 206.221.8265 Cell: 206.395.4049
> fab-support at wnf.uw.edu <mailto:fab-support at wnf.uw.edu>
> https://www.wnf.washington.edu/ <https://www.wnf.washington.edu/>
> Pronouns: he/him
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From bob.geil at unc.edu  Thu Jun 10 08:35:01 2021
From: bob.geil at unc.edu (Geil, Bob)
Date: Thu, 10 Jun 2021 12:35:01 +0000
Subject: [labnetwork] vanadium dioxide sputtering
In-Reply-To: <CAJTeEcrZjvbtgcyFpOC99Wx2_M7_gQ=yGh1OKZ17k4Cf-y6f6Q@mail.gmail.com>
References: <CAJTeEcrZjvbtgcyFpOC99Wx2_M7_gQ=yGh1OKZ17k4Cf-y6f6Q@mail.gmail.com>
Message-ID: <DM6PR03MB352985D32B2FDF4C246C35429E359@DM6PR03MB3529.namprd03.prod.outlook.com>

Hi Darick,
  One tip is that room temperate reactive sputtering with V and O2 results in V2O5.  Achieving VO2 requires a deposition temp around 200C or higher.

Best,
Bob

Bob Geil, PhD
Technical Director ? CHANL
Applied Physical Sciences ? UNC-CH
223 Chapman Hall
(919) 843-6555
https://chanl.unc.edu/
[cid:f47b9cc9-feb7-4bf1-ba23-1b16f8c16dc5]



________________________________
From: labnetwork <labnetwork-bounces at mtl.mit.edu> on behalf of Darick Baker <darick at uw.edu>
Sent: Wednesday, June 9, 2021 7:43 PM
To: Fab Network <labnetwork at mtl.mit.edu>
Subject: [labnetwork] vanadium dioxide sputtering

We have a lab user who is interested in sputtering vanadium dioxide. I realize this has been asked before without an answer, but I thought I'd try again. Does anybody have a VO2 process running and would be willing to do some depositions for us?
Barring that, does anybody have any tips or successes with reactively sputtering VO2?

Thanks for the help.

--
Darick Baker, PhD
Business Outreach and Customer Development
New User Orientation
Research Engineer - Deposition
Washington Nanofabrication Facility (WNF)
University of Washington
Fluke Hall 115, Box 352143
Desk: 206.221.8265 Cell: 206.395.4049
fab-support at wnf.uw.edu<mailto:fab-support at wnf.uw.edu>
https://www.wnf.washington.edu/
Pronouns: he/him
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From demis at ucsb.edu  Thu Jun 10 12:51:06 2021
From: demis at ucsb.edu (Demis D. John)
Date: Thu, 10 Jun 2021 09:51:06 -0700
Subject: [labnetwork] vanadium dioxide sputtering
In-Reply-To: <76d1c199-36eb-e791-29b9-bd5e60962693@udel.edu>
References: <CAJTeEcrZjvbtgcyFpOC99Wx2_M7_gQ=yGh1OKZ17k4Cf-y6f6Q@mail.gmail.com>
 <76d1c199-36eb-e791-29b9-bd5e60962693@udel.edu>
Message-ID: <CAKrtPjqjU6cFi6aymZnJ-o4rp+sb77H1tuG7NSt+eGeuzaMC3g@mail.gmail.com>

We also have a VO2 deposition that we perform relatively regularly (few
times a year) for various external customers.
AJA reactive sputtering.
Single-wafer load, and we need ~3 weeks notice lead time to schedule the
Vanadium target install.  You can give my contact info to your customer or
we can bill to you lab, whichever you prefer.
? Demis




On Thu, Jun 10, 2021 at 09:08 Iulian Codreanu <codreanu at udel.edu> wrote:

> Hi Darick,
>
> We have a pulsed laser deposition (PLD) system here at UD which is mostly
> used for Vanadium oxide deposition. PLD is more suited for depositing
> oxides than sputtering.
>
> Please send me a note if you would like to discuss.
>
> Cheers,
>
> Iulian
>
>
> iulian Codreanu, Ph.D.
> Director, Nanofabrication Facility
> University of Delaware
> Harker ISE Lab, Room 163221 Academy Street
> Newark, DE 19716 <https://www.google.com/maps/search/221+Academy+Street%0D%0ANewark,+DE+19716?entry=gmail&source=g>
> 302-831-2784http://udnf.udel.edu
>
> On 6/9/2021 7:43 PM, Darick Baker wrote:
>
> We have a lab user who is interested in sputtering vanadium dioxide. I
> realize this has been asked before without an answer, but I thought I'd try
> again. Does anybody have a VO2 process running and would be willing to do
> some depositions for us?
> Barring that, does anybody have any tips or successes with reactively
> sputtering VO2?
>
> Thanks for the help.
>
> --
> Darick Baker, PhD
> Business Outreach and Customer Development
> New User Orientation
> Research Engineer - Deposition
> Washington Nanofabrication Facility (WNF)
> University of Washington
> Fluke Hall 115, Box 352143
> Desk: 206.221.8265 Cell: 206.395.4049
> fab-support at wnf.uw.edu
> https://www.wnf.washington.edu/
> Pronouns: he/him
>
> _______________________________________________
> labnetwork mailing listlabnetwork at mtl.mit.eduhttps://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
-- 
-- Demis

----------------------------------------
*   Process Scientist Manager*
 *UCSB Nanofabrication Facility* <https://www.nanotech.ucsb.edu/>
         Demis' Contact Info
<https://wiki.nanotech.ucsb.edu/wiki/Demis_D._John>
----------------------------------------
*Reminder*: The NanoFab has a publications policy
<https://wiki.nanotech.ucsb.edu/wiki/Frequently_Asked_Questions#Publications_acknowledging_the_Nanofab>
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From f.karouta at gmail.com  Thu Jun 10 19:11:11 2021
From: f.karouta at gmail.com (Fouad Karouta)
Date: Fri, 11 Jun 2021 09:11:11 +1000
Subject: [labnetwork] vanadium dioxide sputtering
In-Reply-To: <CAJTeEcrZjvbtgcyFpOC99Wx2_M7_gQ=yGh1OKZ17k4Cf-y6f6Q@mail.gmail.com>
References: <CAJTeEcrZjvbtgcyFpOC99Wx2_M7_gQ=yGh1OKZ17k4Cf-y6f6Q@mail.gmail.com>
Message-ID: <CANYCV9ureqjhq8O+fVy-Avo4a0_Qu40cLbYKG55VtJSQjgWKpA@mail.gmail.com>

Hi Darick and others,

Please check the toxicity of the material especially when you do get V2O5.
Several years ago we banned VO2 target from use in a system where we were
swapping targets twice a week due to that risk.
Better to have a dedicated machine to deposit this material.

Regards,
Fouad Karouta
Ex manager ANFF ACT Node
Canberra, Australia

On Thu, 10 Jun 2021 at 9:59 am, Darick Baker <darick at uw.edu> wrote:

> We have a lab user who is interested in sputtering vanadium dioxide. I
> realize this has been asked before without an answer, but I thought I'd try
> again. Does anybody have a VO2 process running and would be willing to do
> some depositions for us?
> Barring that, does anybody have any tips or successes with reactively
> sputtering VO2?
>
> Thanks for the help.
>
> --
> Darick Baker, PhD
> Business Outreach and Customer Development
> New User Orientation
> Research Engineer - Deposition
> Washington Nanofabrication Facility (WNF)
> University of Washington
> Fluke Hall 115, Box 352143
> Desk: 206.221.8265 Cell: 206.395.4049
> fab-support at wnf.uw.edu
> https://www.wnf.washington.edu/
> Pronouns: he/him
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From jdeng at cns.fas.harvard.edu  Fri Jun 11 11:47:35 2021
From: jdeng at cns.fas.harvard.edu (Deng, Jiangdong)
Date: Fri, 11 Jun 2021 15:47:35 +0000
Subject: [labnetwork] Photolithography engineer position at Center for
 Nanoscale Systems (CNS) of Harvard University
Message-ID: <659FDCED-7FC8-4067-8ECB-516EDCE86914@cns.fas.harvard.edu>

Hi, All,

A photolithography engineer position is available in Center for Nanoscale Systems of Harvard University. Please see the job description below. A direct link to the posting can be found here: https://bit.ly/3wbeOQr . Please apply If you are interested in the position, or spread the words around. Thanks!

Duties & Responsibilities
The Center for Nanoscale Systems (CNS) at Harvard University seeks a multi-talented, enthusiastic individual to work within the Nanofabrication Group as a photolithography engineer.  CNS is an open, shared-use facility that serves all of Harvard as well as external academic and industrial users. Working under the supervision of the Nanofabrication Facility Manager, this person will provide maintenance, training and research development in photolithography and chemical wet process for nanofabrication.

Responsibilities will include, but are not limited to: provide support and maintenance of multiple photolithography tools (mask aligners, steppers, UV exposure systems, resist coaters/developers, pattern design software and computers) with capabilities in i-line and DUV with line/space resolution of 1 um.  This person will oversee and lead chemical wet processes development, training and troubleshooting for nanofabrication, including various resist processes, wet etching, sample cleaning, wet process technology expansion, and chemical management in the cleanroom.  This individual will also be in charge of advanced patterning characterization with scanning electron microscopy (SEM) for feature patterning and multilayer alignment, as well teaming with members of the Nanofabrication Facility for film deposition projects.  Other responsibilities are training new users, ensuring safety practices, authoring SOPs and related documents for the Nanofabrication Facility. Collaboration with all CNS personnel and research group to achieve objectives and enhance service quality is expected. The candidate will also perform work for remote CNS users. Detailed record keeping of instrument activity, experimental results, maintenance and repair logs, and operating procedures is expected.

Basic Qualifications
Minimum of a Bachelor's Degree in Electrical Engineering, Material Science, Chemical Engineering, or related field plus 5-7year experience in semiconductor equipment field is required.

Additional Qualifications
Graduate degree in Electrical Engineering, Physics, Chemical Engineering, Material Science, Chemistry or a related field with 3-5year experience is desirable. Cleanroom fabrication experience, especially in photolithography, etching, film deposition, and metrology, are highly desired. The candidate should be self-motivated with a strong desire to acquire on-the-job training, to succeed, and to develop intellectual, and practical professional skills. Demonstrated ability to work well in teams is essential.

Physical Requirements: Must be able to work in cleanroom, chemical, and measurement laboratory environments. Will work around compressed gases, acids, solvents, vacuum pump oils, and other chemicals. Must be very dexterous; will be required to work on large and small assemblies.

All candidates must be authorized to work in the United States.




-JD

-- Jiangdong Deng (JD), Ph. D
Associate Director,
Center for Nanoscale Systems
Head of Nanofabrication Facility,
Harvard University,
11 Oxford St., LISE-G54,
Cambridge, MA 02138
Tel: 617-495-3396






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From darick at uw.edu  Fri Jun 11 15:28:29 2021
From: darick at uw.edu (Darick Baker)
Date: Fri, 11 Jun 2021 12:28:29 -0700
Subject: [labnetwork] vanadium dioxide sputtering
In-Reply-To: <CAJTeEcrZjvbtgcyFpOC99Wx2_M7_gQ=yGh1OKZ17k4Cf-y6f6Q@mail.gmail.com>
References: <CAJTeEcrZjvbtgcyFpOC99Wx2_M7_gQ=yGh1OKZ17k4Cf-y6f6Q@mail.gmail.com>
Message-ID: <CAJTeEcp-viuRdCyKb3czvQRWLg2E6Pzq-i7=cy+dudXU7vDiWQ@mail.gmail.com>

Thank you all for your help with this.
As it turns out, there are universities that are capable of ALD, PLD, and
sputtering of VO2.
I have passed along the contact information to our lab user and they will
be contacting the options they see as most reasonable for their process.

Thank you labnetwork for saving me from having to potentially deal with
V2O5!



On Wed, Jun 9, 2021 at 4:43 PM Darick Baker <darick at uw.edu> wrote:

> We have a lab user who is interested in sputtering vanadium dioxide. I
> realize this has been asked before without an answer, but I thought I'd try
> again. Does anybody have a VO2 process running and would be willing to do
> some depositions for us?
> Barring that, does anybody have any tips or successes with reactively
> sputtering VO2?
>
> Thanks for the help.
>
> --
> Darick Baker, PhD
> Business Outreach and Customer Development
> New User Orientation
> Research Engineer - Deposition
> Washington Nanofabrication Facility (WNF)
> University of Washington
> Fluke Hall 115, Box 352143
> Desk: 206.221.8265 Cell: 206.395.4049
> fab-support at wnf.uw.edu
> https://www.wnf.washington.edu/
> Pronouns: he/him
>


-- 
Darick Baker, PhD
Research Engineer
Washington Nanofabrication Facility
University of Washington
Fluke Hall 115, Box 352143
(206) 221-8265
Pronouns: he/him
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From deolivei at ualberta.ca  Tue Jun 15 11:02:59 2021
From: deolivei at ualberta.ca (Gustavo de Oliveira Luiz)
Date: Tue, 15 Jun 2021 09:02:59 -0600
Subject: [labnetwork] Seeking advice regarding developer/unexposed resist
 interaction
Message-ID: <CALPuYFy=Pz=F2seRBZzcTpotK+HHL9XON1Yq9bhOBDT8tPz8+Q@mail.gmail.com>

Hello everyone,

I am having some trouble developing recipes or testing performance on our
Heidelberg MLA150. Especially when testing performance, it is required for
us to expose the test pattern once, develop, inspect and repeat. We usually
coat a larger sample (e.g. a 4" wafer) with resist and expose a small test
design, allowing us to use the same sample many times. The problem that I
encounter is that the development time increases after each iteration, and
it is not due to the developer getting weaker (I tried using a new
developer to make sure). This behavior is observed on AZ 1500 and AZ 4000
series resists, with the latter presenting a more drastic change.

It seems to me that the developer changes something on the unexposed
resist, making it harder to develop. This is made obvious by the fact that
we don't see this problem when processing multiple samples and developing
them with the same developer bath. In that case the only problem we
encounter is the developer getting weaker depending on the exposed area and
number of samples, as expected.

I thought that it could be over-hydration, since the developer is a water
solution and we rinse with water as well. But high water content tends to
make development faster, not slower. Does anyone have more information on
the interaction between developer and unexposed resist? I'd appreciate any
input you may have.

Best regards,
--
Gustavo de Oliveira Luiz, PhD
Applications/Research Specialist
nanoFAB, University of Alberta
+1 (780) 619-1463
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From blewis at eng.ufl.edu  Tue Jun 15 16:27:19 2021
From: blewis at eng.ufl.edu (Lewis,William)
Date: Tue, 15 Jun 2021 20:27:19 +0000
Subject: [labnetwork] Seeking advice regarding developer/unexposed
 resist interaction
In-Reply-To: <CALPuYFy=Pz=F2seRBZzcTpotK+HHL9XON1Yq9bhOBDT8tPz8+Q@mail.gmail.com>
References: <CALPuYFy=Pz=F2seRBZzcTpotK+HHL9XON1Yq9bhOBDT8tPz8+Q@mail.gmail.com>
Message-ID: <BN6PR22MB0244E7D6B9D723AA047C034D9B309@BN6PR22MB0244.namprd22.prod.outlook.com>

Hi Gustavo,

You cannot expose these photoresists with developer more than once.  It will create a skin that takes longer to develop through on the 2nd pass and will cause you develop issues every time.  Use a pipetter and only develop and rinse the area that was exposed on the wafer.  I expose around the edge of the wafer but no closer than 1cm from the edge so pAF and resist edge bead isn?t an issue.  I use this method to shoot several tests on a single wafer.  Same applied to photomasks.


Bill Lewis
Research Service Center
University of Florida
walewis at ufl.edu
https://rsc.aux.eng.ufl.edu/


From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Gustavo de Oliveira Luiz
Sent: Tuesday, June 15, 2021 11:03 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Seeking advice regarding developer/unexposed resist interaction

[External Email]

Hello everyone,

I am having some trouble developing recipes or testing performance on our Heidelberg MLA150. Especially when testing performance, it is required for us to expose the test pattern once, develop, inspect and repeat. We usually coat a larger sample (e.g. a 4" wafer) with resist and expose a small test design, allowing us to use the same sample many times. The problem that I encounter is that the development time increases after each iteration, and it is not due to the developer getting weaker (I tried using a new developer to make sure). This behavior is observed on AZ 1500 and AZ 4000 series resists, with the latter presenting a more drastic change.

It seems to me that the developer changes something on the unexposed resist, making it harder to develop. This is made obvious by the fact that we don't see this problem when processing multiple samples and developing them with the same developer bath. In that case the only problem we encounter is the developer getting weaker depending on the exposed area and number of samples, as expected.

I thought that it could be over-hydration, since the developer is a water solution and we rinse with water as well. But high water content tends to make development faster, not slower. Does anyone have more information on the interaction between developer and unexposed resist? I'd appreciate any input you may have.

Best regards,
--
Gustavo de Oliveira Luiz, PhD
Applications/Research Specialist
nanoFAB, University of Alberta
+1 (780) 619-1463
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From deolivei at ualberta.ca  Tue Jun 15 18:15:49 2021
From: deolivei at ualberta.ca (Gustavo de Oliveira Luiz)
Date: Tue, 15 Jun 2021 16:15:49 -0600
Subject: [labnetwork] Seeking advice regarding developer/unexposed
 resist interaction
In-Reply-To: <CALPuYFy=Pz=F2seRBZzcTpotK+HHL9XON1Yq9bhOBDT8tPz8+Q@mail.gmail.com>
References: <CALPuYFy=Pz=F2seRBZzcTpotK+HHL9XON1Yq9bhOBDT8tPz8+Q@mail.gmail.com>
Message-ID: <CALPuYFw+n3XLDn=c9h3Obajgpb+kLOx49rMre2deQSwazGJ0mw@mail.gmail.com>

Thank you everyone for the replies! I am definitely taking note of all of
them.

Some of you asked why I am developing the same sample multiple times. This
is necessary when we are servicing the system and need to test performance
after changes, before moving forward. The idea was to avoid breaking the
wafer and being able to clean and reuse it afterwards. Another use of this
is when adjusting testing overlay alignment, since we need to expose and
develop 2 layers.

I'll try to sumarize below the information that you shared, so it's
available to more people in the network.

   - Some of you confirmed that this is indeed a problem. The plausible
   causes are either the basic nature of the developer, or water ? I'd guess
   the former. One of these seems to form a skin on the surface of the resist,
   making it harder to develop.
      - One of you even said that they used this to their advantage,
      producing undercut for lift-off
   - One of you said that even doing the same thing as we do, never saw
   this problem. They said that they use AZ-300MIF (we usually use AZ 400k 1:4
   in our standard processes), and perhaps that makes a difference.
   - The suggested solutions are:
      - Cut the wafer after coating, of course
      - Use pipettes to dispense developer only on the areas of interest.
      In fact, as some of you pointed out, this is the technique used by
      Heidelberg when servicing, we just had no idea why. And,  apparently, we
      should be alright rinsing the whole wafer with water (which makes it more
      plausible that the base in the developer is the cause of resist
hardening).
      - An interesting suggestion was to perform a PEB after the second
      exposure (after one run in the developer) to try and break that surface
      film. We will probably try this one, and perhaps try baking between
      development and exposure as well.

Again, thank you all for sharing your thoughts and experience. It was very
fruitful.

Best regards,
--
Gustavo de Oliveira Luiz, PhD
Applications/Research Specialist
nanoFAB, University of Alberta
+1 (780) 619-1463

On Tue, Jun 15, 2021 at 9:02 AM Gustavo de Oliveira Luiz <
deolivei at ualberta.ca> wrote:

> Hello everyone,
>
> I am having some trouble developing recipes or testing performance on our
> Heidelberg MLA150. Especially when testing performance, it is required for
> us to expose the test pattern once, develop, inspect and repeat. We usually
> coat a larger sample (e.g. a 4" wafer) with resist and expose a small test
> design, allowing us to use the same sample many times. The problem that I
> encounter is that the development time increases after each iteration, and
> it is not due to the developer getting weaker (I tried using a new
> developer to make sure). This behavior is observed on AZ 1500 and AZ 4000
> series resists, with the latter presenting a more drastic change.
>
> It seems to me that the developer changes something on the unexposed
> resist, making it harder to develop. This is made obvious by the fact that
> we don't see this problem when processing multiple samples and developing
> them with the same developer bath. In that case the only problem we
> encounter is the developer getting weaker depending on the exposed area and
> number of samples, as expected.
>
> I thought that it could be over-hydration, since the developer is a water
> solution and we rinse with water as well. But high water content tends to
> make development faster, not slower. Does anyone have more information on
> the interaction between developer and unexposed resist? I'd appreciate any
> input you may have.
>
> Best regards,
> --
> Gustavo de Oliveira Luiz, PhD
> Applications/Research Specialist
> nanoFAB, University of Alberta
> +1 (780) 619-1463
>
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From yb2471 at columbia.edu  Wed Jun 16 15:11:49 2021
From: yb2471 at columbia.edu (Youry Borisenkov)
Date: Wed, 16 Jun 2021 15:11:49 -0400
Subject: [labnetwork] Bismuth evaporation
Message-ID: <CAGOt4s1kEqGmzO=GCEjDO2bYy2hzmbM2=EFA4+R9XhjYdP5oNQ@mail.gmail.com>

Dear All,
We have a user that needs to deposit *Bismuth *for contact electrodes for
2D materials.

We also have an Edwards 306 thermal evaporator for these types of
exotic/"contaminating" materials deposition requests. However, the results
he is getting on this tool are not satisfactory (sometimes he will get 50%
working devices and sometimes 0). So they ask to use Bi in a general use
e-Beam evaporator.

I have 2 questions:
1. Do any of you have experience in evaporating Bismuth in general
use e-Beam evaporator? And what are the main concerns?
2. Alternatively, do any of you have any input on how to improve the
deposition repeatability or what's the important parameter to look at
during Bismuth deposition in thermal evaporation?

Thank you and Best regards,
Youry Borisenkov, Ph.D.
Process engineer CNI Shared Labs
Columbia University
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From hbtusainc at yahoo.com  Thu Jun 17 03:52:06 2021
From: hbtusainc at yahoo.com (Mario Portillo)
Date: Thu, 17 Jun 2021 15:52:06 +0800
Subject: [labnetwork] Seeking advice regarding developer/unexposed
 resist interaction
In-Reply-To: <CALPuYFw+n3XLDn=c9h3Obajgpb+kLOx49rMre2deQSwazGJ0mw@mail.gmail.com>
References: <CALPuYFw+n3XLDn=c9h3Obajgpb+kLOx49rMre2deQSwazGJ0mw@mail.gmail.com>
Message-ID: <192108F1-B8AC-4799-9124-1536A27E3A43@yahoo.com>

Gustavo, I second Biil?s advice, I just would like to add to split the wafer / mask in four quadrants, using the X-Y data coordinates move the data from quadrant to quadrant then follow Bill,s suggested processing steps

Sent from my iPhone hbtusainc Mario Portillo

> On Jun 16, 2021, at 8:01 PM, Gustavo de Oliveira Luiz <deolivei at ualberta.ca> wrote:
> 
> ?
> Thank you everyone for the replies! I am definitely taking note of all of them.
> 
> Some of you asked why I am developing the same sample multiple times. This is necessary when we are servicing the system and need to test performance after changes, before moving forward. The idea was to avoid breaking the wafer and being able to clean and reuse it afterwards. Another use of this is when adjusting testing overlay alignment, since we need to expose and develop 2 layers.
> 
> I'll try to sumarize below the information that you shared, so it's available to more people in the network.
> Some of you confirmed that this is indeed a problem. The plausible causes are either the basic nature of the developer, or water ? I'd guess the former. One of these seems to form a skin on the surface of the resist, making it harder to develop.
> One of you even said that they used this to their advantage, producing undercut for lift-off
> One of you said that even doing the same thing as we do, never saw this problem. They said that they use AZ-300MIF (we usually use AZ 400k 1:4 in our standard processes), and perhaps that makes a difference.
> The suggested solutions are:
> Cut the wafer after coating, of course
> Use pipettes to dispense developer only on the areas of interest. In fact, as some of you pointed out, this is the technique used by Heidelberg when servicing, we just had no idea why. And,  apparently, we should be alright rinsing the whole wafer with water (which makes it more plausible that the base in the developer is the cause of resist hardening).
> An interesting suggestion was to perform a PEB after the second exposure (after one run in the developer) to try and break that surface film. We will probably try this one, and perhaps try baking between development and exposure as well.
> Again, thank you all for sharing your thoughts and experience. It was very fruitful.
> 
> Best regards,
> --
> Gustavo de Oliveira Luiz, PhD
> Applications/Research Specialist
> nanoFAB, University of Alberta
> +1 (780) 619-1463
> 
>> On Tue, Jun 15, 2021 at 9:02 AM Gustavo de Oliveira Luiz <deolivei at ualberta.ca> wrote:
>> Hello everyone,
>> 
>> I am having some trouble developing recipes or testing performance on our Heidelberg MLA150. Especially when testing performance, it is required for us to expose the test pattern once, develop, inspect and repeat. We usually coat a larger sample (e.g. a 4" wafer) with resist and expose a small test design, allowing us to use the same sample many times. The problem that I encounter is that the development time increases after each iteration, and it is not due to the developer getting weaker (I tried using a new developer to make sure). This behavior is observed on AZ 1500 and AZ 4000 series resists, with the latter presenting a more drastic change.
>> 
>> It seems to me that the developer changes something on the unexposed resist, making it harder to develop. This is made obvious by the fact that we don't see this problem when processing multiple samples and developing them with the same developer bath. In that case the only problem we encounter is the developer getting weaker depending on the exposed area and number of samples, as expected.
>> 
>> I thought that it could be over-hydration, since the developer is a water solution and we rinse with water as well. But high water content tends to make development faster, not slower. Does anyone have more information on the interaction between developer and unexposed resist? I'd appreciate any input you may have.
>> 
>> Best regards,
>> --
>> Gustavo de Oliveira Luiz, PhD
>> Applications/Research Specialist
>> nanoFAB, University of Alberta
>> +1 (780) 619-1463
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From kmcpeak at lsu.edu  Thu Jun 17 09:21:54 2021
From: kmcpeak at lsu.edu (Kevin M McPeak)
Date: Thu, 17 Jun 2021 13:21:54 +0000
Subject: [labnetwork] Branson S3100 plasma asher repair
Message-ID: <DM5PR06MB3195D96FE8B221D5164C3C9DB00E9@DM5PR06MB3195.namprd06.prod.outlook.com>

Dear Colleagues,

We have an old Branson S3100 plasma asher in the LSU nanofab. We believe the matching network is in need of repair. The power supply is stable when connected to a dummy load but gives unstable power output when connected to the matching network/chamber.

Does anyone on the list know of a reliable 3rd party that works on these old tools? Thanks!

Regards,
Kevin


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From jtmitch5 at ncsu.edu  Thu Jun 17 13:33:13 2021
From: jtmitch5 at ncsu.edu (James Mitchell)
Date: Thu, 17 Jun 2021 13:33:13 -0400
Subject: [labnetwork] Branson S3100 plasma asher repair
In-Reply-To: <DM5PR06MB3195D96FE8B221D5164C3C9DB00E9@DM5PR06MB3195.namprd06.prod.outlook.com>
References: <DM5PR06MB3195D96FE8B221D5164C3C9DB00E9@DM5PR06MB3195.namprd06.prod.outlook.com>
Message-ID: <CAEXS_M-AwiW5TgiqPvXf7koKmSazGg_E+oBpjRghD-s64sXseg@mail.gmail.com>

Try Class One.

Jim

On Thu, Jun 17, 2021 at 1:23 PM Kevin M McPeak <kmcpeak at lsu.edu> wrote:

> Dear Colleagues,
>
> We have an old Branson S3100 plasma asher in the LSU nanofab. We believe
> the matching network is in need of repair. The power supply is stable when
> connected to a dummy load but gives unstable power output when connected to
> the matching network/chamber.
>
> Does anyone on the list know of a reliable 3rd party that works on these
> old tools? Thanks!
>
> Regards,
> Kevin
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>


-- 
*James Mitchell*
*Specialty Trades Technician*
*Dept. of Electrical and Computer Engineering*
*NCSU Nanofabrication Facility*
*MRC RM243A **Box 7911*
*2410 Campus Shore Dr., Raleigh, NC 27606*
*jtmitch5 at ncsu.edu* <jtmitch5 at ncsu.edu>
*Desk: 919-515-5394*
*Cell: 919-717-7325*
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From Edward.Gonzales at colorado.edu  Tue Jun 22 12:24:07 2021
From: Edward.Gonzales at colorado.edu (Edward Gonzales)
Date: Tue, 22 Jun 2021 16:24:07 +0000
Subject: [labnetwork] SF-100 DLW
Message-ID: <DM5PR03MB297265BAA7BFB2D90020330D9F099@DM5PR03MB2972.namprd03.prod.outlook.com>

Is anybody utilizing a direct write SF-100 UV exposure system manufactured by Intelligent Micro Pattering at their facility? If so, can you please contact me to discuss your successes with the system?

Many Thanks,
Edward

Edward Gonzales
Research Facilities Manager
Colorado Shared Instrumentation in Nanofabrication and Characterization
COSINC
University of Colorado Boulder
303-735-1203 (office)
505-450-3338 (cell)
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From kovalev at magnet.fsu.edu  Tue Jun 22 13:27:20 2021
From: kovalev at magnet.fsu.edu (Alexey Kovalev)
Date: Tue, 22 Jun 2021 13:27:20 -0400 (EDT)
Subject: [labnetwork] Magnesium deposition
Message-ID: <1829976871.350305.1624382840715.JavaMail.zimbra@magnet.fsu.edu>


Hello All,
I would like advice on the Magnesium e-beam deposition. We are considering doing it in our shared use chamber, which is vented to the atmosphere to load/unload samples. We also switch liners and do not keep materials in the chamber.

I worry that we will have two issues:

1) Spontaneous combustion of pellets in the liner. Spontaneous combustion of Mg film on chamber walls.

2) When we deposit the next material, the sample holder and chamber will heat (up to 350-400K, maybe), leading to Mg contamination. We have a shutter that blocks the source and a heated area around it.

We are not depositing super clean films in that chamber, but on the other hand, I don't want to make it badly contaminated.
Any comments will be greatly appreciated.
Alexey




-- 
Alexey Kovalev 
Assistant in Research
A302
NHMFL FSU
1800 E. Paul Dirac Dr.
Tallahassee , FL 32310-3706 
kovalev at magnet.fsu.edu
TEL:850-644-1657
FAX:850-644-5038

5161 706C 6127


From sbyoo at ucdavis.edu  Tue Jun 22 15:48:51 2021
From: sbyoo at ucdavis.edu (S. J. Ben Yoo)
Date: Tue, 22 Jun 2021 12:48:51 -0700
Subject: [labnetwork] Quantel, OAI, or MJB3 Mask Aligners?
Message-ID: <CF8F4BD8-B41D-41F9-ACC4-288977F9FF36@ucdavis.edu>

Hello, Everyone,

I am wondering if anyone has a Quantel, OAI, or MJB3 Mask Aligner that I can purchase or burrow?

I am interested in transfer printing research so no UV lamp optics is necessary but a reasonably good mechanical capability is desired.

Thank you for your attention and willingness to help.

Best Wishes,

-Ben
_______________________________________________________________________________

S. J. Ben Yoo
Joint Faculty LBL and UC Davis 
Distinguished Professor, Department of Electrical and Computer Engineering
Room 3110, Kemper Hall
Mail Code 1915
University of California
Davis, California 95616
Mobile: (510) 407-2457
Fax: (530) 752-8428
email: sbyoo at ucdavis.edu
home page: http://sierra.ece.ucdavis.edu
_______________________________________________________________________________ 

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From robert.ilic at nist.gov  Wed Jun 23 08:01:41 2021
From: robert.ilic at nist.gov (Ilic, Robert (Fed))
Date: Wed, 23 Jun 2021 12:01:41 +0000
Subject: [labnetwork] Fabrication and Equipment Maintenance position at NIST
Message-ID: <DM6PR09MB5928F744B33D71D906B1B73397089@DM6PR09MB5928.namprd09.prod.outlook.com>

A hands-on fabrication and equipment maintenance position is available at NIST's Center for Nanoscale Science and Technology nanofabrication user facility. More information can be found at:
https://www.usajobs.gov/GetJob/ViewDetails/605317100

B. Robert Ilic, PhD
National Institute of Standards and Technology, Physical Measurement Laboratory
Physicist - Microsystems and Nanotechnology Division
Acting Group Leader and Manager - Center for Nanoscale Science and Technology NanoFab
100 Bureau Drive, Mail Stop 6201, building 216
Gaithersburg, MD 20899
(301)975-3712
robert.ilic at nist.gov<mailto:robert.ilic at nist.gov>
https://www.nist.gov/cnst
http://scholar.google.com/citations?user=FxzEsBQAAAAJ&hl=en

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From betemc at rit.edu  Wed Jun 23 09:14:29 2021
From: betemc at rit.edu (Bruce Tolleson)
Date: Wed, 23 Jun 2021 13:14:29 +0000
Subject: [labnetwork] Plasmatherm Apex ICP High Temperature Operation
Message-ID: <d51911254e19450fb96f3cbeb6df4b74@ex04mail01a.ad.rit.edu>

Dear Labnetwork,
  Our Plasmatherm Apex ICP has the high temperature option installed to run as high as 200?C.  We are trying to determine the actual temperature of the lower electrode to substrate contact. The display temperature verses actual temperature has an offset and we are trying to determine what that offset is. Has anyone else been able to measure this?
Thank you,

Bruce E. Tolleson
Rochester Institute of Technology
82  Lomb Memorial Drive, Bldg 17-2627
Rochester, NY 14623-5604
(585) 478-3836
[http://www.rit.edu/~962www/logos/tiger_walking_rit_color.jpg]

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From dlafleur at cns.fas.harvard.edu  Wed Jun 23 13:16:44 2021
From: dlafleur at cns.fas.harvard.edu (LaFleur, David W)
Date: Wed, 23 Jun 2021 17:16:44 +0000
Subject: [labnetwork] Plasmatherm Apex ICP High Temperature Operation
Message-ID: <FCCA0298-202C-41E7-92B1-20E041D5FF20@cns.fas.harvard.edu>

Hi Bruce

There are 2 ways I know of, an inexpensive way and an expensive way. The inexpensive way is to use thermal dots sold here:

https://www.mcmaster.com/temperature-indicating-dots/

Expensive way is using  SensArray.

https://www.kla-tencor.com/products/chip-manufacturing/in-situ-process-management.

Regards,

Dave LaFleur
Harvard University
CNS

From: "labnetwork-bounces at mtl.mit.edu" <labnetwork-bounces at mtl.mit.edu> on behalf of Bruce Tolleson <betemc at rit.edu>
Date: Wednesday, June 23, 2021 at 11:42 AM
To: "labnetwork at mtl.mit.edu" <labnetwork at mtl.mit.edu>
Subject: [labnetwork] Plasmatherm Apex ICP High Temperature Operation

Dear Labnetwork,
  Our Plasmatherm Apex ICP has the high temperature option installed to run as high as 200?C.  We are trying to determine the actual temperature of the lower electrode to substrate contact. The display temperature verses actual temperature has an offset and we are trying to determine what that offset is. Has anyone else been able to measure this?
Thank you,

Bruce E. Tolleson
Rochester Institute of Technology
82  Lomb Memorial Drive, Bldg 17-2627
Rochester, NY 14623-5604
(585) 478-3836
[http://www.rit.edu/~962www/logos/tiger_walking_rit_color.jpg]

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From spaolini at cns.fas.harvard.edu  Wed Jun 23 13:19:02 2021
From: spaolini at cns.fas.harvard.edu (Paolini, Steven)
Date: Wed, 23 Jun 2021 17:19:02 +0000
Subject: [labnetwork] Plasmatherm Apex ICP High Temperature Operation
In-Reply-To: <d51911254e19450fb96f3cbeb6df4b74@ex04mail01a.ad.rit.edu>
References: <d51911254e19450fb96f3cbeb6df4b74@ex04mail01a.ad.rit.edu>
Message-ID: <BL0PR07MB40509848AA4A1C5CC8EE2177DF089@BL0PR07MB4050.namprd07.prod.outlook.com>

Bruce,
  One way to measure the actual wafer temp is with a T/C wafer (Sensarray). These are designed with cemented T/C junctions on the wafer itself. The leads are encapsulated in a plastic ribbon which is designed to cross an O ring. You will find that the wafer will sit at a much lower temperature than the chuck under vacuum since there is no surrounding air to allow for convection. I would recommend testing the temperature with the wafer unclamped. Clamped, and clamped with He backing. You may be surprised at the results!
  Equipment Dood


Steve Paolini
Principal Equipment Engineer
Harvard University Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA 02138
617- 496- 9816
spaolini at cns.fas.harvard.edu
www.cns.fas.harvard.edu

From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Bruce Tolleson
Sent: Wednesday, June 23, 2021 9:14 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Plasmatherm Apex ICP High Temperature Operation

Dear Labnetwork,
  Our Plasmatherm Apex ICP has the high temperature option installed to run as high as 200?C.  We are trying to determine the actual temperature of the lower electrode to substrate contact. The display temperature verses actual temperature has an offset and we are trying to determine what that offset is. Has anyone else been able to measure this?
Thank you,

Bruce E. Tolleson
Rochester Institute of Technology
82  Lomb Memorial Drive, Bldg 17-2627
Rochester, NY 14623-5604
(585) 478-3836
[http://www.rit.edu/~962www/logos/tiger_walking_rit_color.jpg]

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From clark at cnf.cornell.edu  Wed Jun 23 16:20:15 2021
From: clark at cnf.cornell.edu (Jeremy Clark)
Date: Wed, 23 Jun 2021 16:20:15 -0400
Subject: [labnetwork] Plasmatherm Apex ICP High Temperature Operation
In-Reply-To: <FCCA0298-202C-41E7-92B1-20E041D5FF20@cns.fas.harvard.edu>
References: <FCCA0298-202C-41E7-92B1-20E041D5FF20@cns.fas.harvard.edu>
Message-ID: <a1b75584-f314-e5f0-fdb3-73df1042d55c@cnf.cornell.edu>

The trick with the dots is that you need to press them hard and flat to 
the wafer, as the vacuum tries to pull them up and away from the 
surface, thus defeating the purpose of measuring the temperature of a 
surface.

Also leave the wafer in there for a few minutes- or wait /and/ don't 
wait with separate dots and see the difference!


Jeremy Clark

Cornell Nanoscale Facility

On 6/23/21 1:16 PM, LaFleur, David W wrote:
>
> Hi Bruce
>
> There are 2 ways I know of, an inexpensive way and an expensive way. 
> The inexpensive way is to use thermal dots sold here:
>
> https://www.mcmaster.com/temperature-indicating-dots/ 
> <https://www.mcmaster.com/temperature-indicating-dots/>
>
> Expensive way is using ?SensArray.
>
> https://www.kla-tencor.com/products/chip-manufacturing/in-situ-process-management 
> <https://www.kla-tencor.com/products/chip-manufacturing/in-situ-process-management>.
>
> Regards,
>
> Dave LaFleur
>
> Harvard University
>
> CNS
>
> *From: *"labnetwork-bounces at mtl.mit.edu" 
> <labnetwork-bounces at mtl.mit.edu> on behalf of Bruce Tolleson 
> <betemc at rit.edu>
> *Date: *Wednesday, June 23, 2021 at 11:42 AM
> *To: *"labnetwork at mtl.mit.edu" <labnetwork at mtl.mit.edu>
> *Subject: *[labnetwork] Plasmatherm Apex ICP High Temperature Operation
>
> Dear Labnetwork,
>
> ? Our Plasmatherm Apex ICP has the high temperature option installed 
> to run as high as 200?C.? We are trying to determine the actual 
> temperature of the lower electrode to substrate contact. The display 
> temperature verses actual temperature has an offset and we are trying 
> to determine what that offset is. Has anyone else been able to measure 
> this?
>
> Thank you,
>
> Bruce E. Tolleson
>
> Rochester Institute of Technology
>
> 82? Lomb Memorial Drive, Bldg 17-2627
>
> Rochester, NY 14623-5604
>
> (585) 478-3836
>
> http://www.rit.edu/~962www/logos/tiger_walking_rit_color.jpg
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From lino.eugene at uwaterloo.ca  Wed Jun 23 21:11:16 2021
From: lino.eugene at uwaterloo.ca (Lino Eugene)
Date: Thu, 24 Jun 2021 01:11:16 +0000
Subject: [labnetwork] Plasmatherm Apex ICP High Temperature Operation
In-Reply-To: <a1b75584-f314-e5f0-fdb3-73df1042d55c@cnf.cornell.edu>
References: <FCCA0298-202C-41E7-92B1-20E041D5FF20@cns.fas.harvard.edu>
 <a1b75584-f314-e5f0-fdb3-73df1042d55c@cnf.cornell.edu>
Message-ID: <YQBPR0101MB153916D01627098BD561D2ED89079@YQBPR0101MB1539.CANPRD01.PROD.OUTLOOK.COM>

I did cover thermal dots with Kapton tape or discs to check the wafer temperature during plasma etching. I did not see any issue in vacuum although the temperature did not exceeded 100?C. Kapton tape can withstand temperatures up to 260?C, so it should be ok.

Best,

Lino Eugene, P.Eng., Ph.D.,
Micro/nanofabrication process engineer
Quantum-Nano Fabrication and Characterization Facility
QNC 1611
University of Waterloo
200 University Avenue West
Waterloo, ON, Canada
N2L 3G1

Ph: +1 519-888-4567 #37788
Cell: +1 226-929-1685
Website: https://qnfcf.uwaterloo.ca/



De : labnetwork <labnetwork-bounces at mtl.mit.edu> De la part de Jeremy Clark
Envoy? : 23 juin 2021 16:20
? : labnetwork at mtl.mit.edu
Objet : Re: [labnetwork] Plasmatherm Apex ICP High Temperature Operation


The trick with the dots is that you need to press them hard and flat to the wafer, as the vacuum tries to pull them up and away from the surface, thus defeating the purpose of measuring the temperature of a surface.

Also leave the wafer in there for a few minutes- or wait and don't wait with separate dots and see the difference!



Jeremy Clark

Cornell Nanoscale Facility
On 6/23/21 1:16 PM, LaFleur, David W wrote:
Hi Bruce

There are 2 ways I know of, an inexpensive way and an expensive way. The inexpensive way is to use thermal dots sold here:

https://www.mcmaster.com/temperature-indicating-dots/

Expensive way is using  SensArray.

https://www.kla-tencor.com/products/chip-manufacturing/in-situ-process-management.

Regards,

Dave LaFleur
Harvard University
CNS

From: "labnetwork-bounces at mtl.mit.edu"<mailto:labnetwork-bounces at mtl.mit.edu> <labnetwork-bounces at mtl.mit.edu><mailto:labnetwork-bounces at mtl.mit.edu> on behalf of Bruce Tolleson <betemc at rit.edu><mailto:betemc at rit.edu>
Date: Wednesday, June 23, 2021 at 11:42 AM
To: "labnetwork at mtl.mit.edu"<mailto:labnetwork at mtl.mit.edu> <labnetwork at mtl.mit.edu><mailto:labnetwork at mtl.mit.edu>
Subject: [labnetwork] Plasmatherm Apex ICP High Temperature Operation

Dear Labnetwork,
  Our Plasmatherm Apex ICP has the high temperature option installed to run as high as 200?C.  We are trying to determine the actual temperature of the lower electrode to substrate contact. The display temperature verses actual temperature has an offset and we are trying to determine what that offset is. Has anyone else been able to measure this?
Thank you,

Bruce E. Tolleson
Rochester Institute of Technology
82  Lomb Memorial Drive, Bldg 17-2627
Rochester, NY 14623-5604
(585) 478-3836
[http://www.rit.edu/~962www/logos/tiger_walking_rit_color.jpg]




_______________________________________________

labnetwork mailing list

labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>

https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From jtmitch5 at ncsu.edu  Thu Jun 24 07:56:51 2021
From: jtmitch5 at ncsu.edu (James Mitchell)
Date: Thu, 24 Jun 2021 07:56:51 -0400
Subject: [labnetwork] Oxford NPG 80 Parts Manual.
Message-ID: <CAEXS_M-=dE2gD1gpeko94AzMZu5rnHRF-7cB5yvJcLEHN9BuZw@mail.gmail.com>

Does anyone have one?

Thanks!

-- 
*James Mitchell*
*Specialty Trades Technician*
*Dept. of Electrical and Computer Engineering*
*NCSU Nanofabrication Facility*
*MRC RM243A **Box 7911*
*2410 Campus Shore Dr., Raleigh, NC 27606*
*jtmitch5 at ncsu.edu* <jtmitch5 at ncsu.edu>
*Desk: 919-515-5394*
*Cell: 919-717-7325*
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From robert.j.macdon at gmail.com  Thu Jun 24 09:03:52 2021
From: robert.j.macdon at gmail.com (Robert MacDonald)
Date: Thu, 24 Jun 2021 09:03:52 -0400
Subject: [labnetwork] Plasmatherm Apex ICP High Temperature Operation
In-Reply-To: <YQBPR0101MB153916D01627098BD561D2ED89079@YQBPR0101MB1539.CANPRD01.PROD.OUTLOOK.COM>
References: <FCCA0298-202C-41E7-92B1-20E041D5FF20@cns.fas.harvard.edu>
 <a1b75584-f314-e5f0-fdb3-73df1042d55c@cnf.cornell.edu>
 <YQBPR0101MB153916D01627098BD561D2ED89079@YQBPR0101MB1539.CANPRD01.PROD.OUTLOOK.COM>
Message-ID: <370B6B43-D5F4-4559-9614-14B29E76C66B@gmail.com>

And you can make your own TC wafer. If you only need one tc omega sells thin wire type 

Bond between wafers with thermal epoxy. 

Strip insulation where wires cross oring and reinsulate with Kapton.  

Works well enough generally. 

Thanks,

Rob 

Sent from my iDidntspellcheckit

> On Jun 23, 2021, at 9:11 PM, Lino Eugene <lino.eugene at uwaterloo.ca> wrote:
> 
> I did cover thermal dots with Kapton tape or discs to check the wafer temperature during plasma etching. I did not see any issue in vacuum although the temperature did not exceeded 100?C. Kapton tape can withstand temperatures up to 260?C, so it should be ok.
>  
> Best,
>  
> Lino Eugene, P.Eng., Ph.D.,
> Micro/nanofabrication process engineer
> Quantum-Nano Fabrication and Characterization Facility
> QNC 1611
> University of Waterloo
> 200 University Avenue West
> Waterloo, ON, Canada  
> N2L 3G1
>  
> Ph: +1 519-888-4567 #37788
> Cell: +1 226-929-1685
> Website: https://qnfcf.uwaterloo.ca/
>  
>  
>  
> De : labnetwork <labnetwork-bounces at mtl.mit.edu> De la part de Jeremy Clark
> Envoy? : 23 juin 2021 16:20
> ? : labnetwork at mtl.mit.edu
> Objet : Re: [labnetwork] Plasmatherm Apex ICP High Temperature Operation
>  
> The trick with the dots is that you need to press them hard and flat to the wafer, as the vacuum tries to pull them up and away from the surface, thus defeating the purpose of measuring the temperature of a surface.
> 
> Also leave the wafer in there for a few minutes- or wait and don't wait with separate dots and see the difference!
> 
>  
> 
> Jeremy Clark
> 
> Cornell Nanoscale Facility
> 
> On 6/23/21 1:16 PM, LaFleur, David W wrote:
> Hi Bruce
>  
> There are 2 ways I know of, an inexpensive way and an expensive way. The inexpensive way is to use thermal dots sold here:
>  
> https://www.mcmaster.com/temperature-indicating-dots/
>  
> Expensive way is using  SensArray.
>  
> https://www.kla-tencor.com/products/chip-manufacturing/in-situ-process-management.
>  
> Regards,
>  
> Dave LaFleur
> Harvard University
> CNS
>  
> From: "labnetwork-bounces at mtl.mit.edu" <labnetwork-bounces at mtl.mit.edu> on behalf of Bruce Tolleson <betemc at rit.edu>
> Date: Wednesday, June 23, 2021 at 11:42 AM
> To: "labnetwork at mtl.mit.edu" <labnetwork at mtl.mit.edu>
> Subject: [labnetwork] Plasmatherm Apex ICP High Temperature Operation
>  
> Dear Labnetwork,
>   Our Plasmatherm Apex ICP has the high temperature option installed to run as high as 200?C.  We are trying to determine the actual temperature of the lower electrode to substrate contact. The display temperature verses actual temperature has an offset and we are trying to determine what that offset is. Has anyone else been able to measure this?
> Thank you,
>  
> Bruce E. Tolleson
> Rochester Institute of Technology
> 82  Lomb Memorial Drive, Bldg 17-2627
> Rochester, NY 14623-5604
> (585) 478-3836
> <image001.jpg>
>  
> 
> 
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From kmcpeak at lsu.edu  Mon Jun 28 14:54:21 2021
From: kmcpeak at lsu.edu (Kevin M McPeak)
Date: Mon, 28 Jun 2021 18:54:21 +0000
Subject: [labnetwork] Alcatel Turbo pump repair
Message-ID: <DM5PR06MB319517CC5E6F8645398C1150B0039@DM5PR06MB3195.namprd06.prod.outlook.com>

Dear Colleagues,

Can you recommend a firm for Alcatel turbo pump repair? Thanks.

Regards,
Kevin

--
Kevin M. McPeak
Assistant Professor | LSU Dept. of Chemical Engineering
225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication



From yglian at illinois.edu  Mon Jun 28 15:44:41 2021
From: yglian at illinois.edu (Lian, Yaguang)
Date: Mon, 28 Jun 2021 19:44:41 +0000
Subject: [labnetwork] Alcatel Turbo pump repair
In-Reply-To: <DM5PR06MB319517CC5E6F8645398C1150B0039@DM5PR06MB3195.namprd06.prod.outlook.com>
References: <DM5PR06MB319517CC5E6F8645398C1150B0039@DM5PR06MB3195.namprd06.prod.outlook.com>
Message-ID: <BN6PR11MB1361FA48DD295A64E1523093AF039@BN6PR11MB1361.namprd11.prod.outlook.com>

Kevin,

You may contact Provac Sales, Inc.

Best,

Yaguang Lian
Research Engineer
2306 Holonyak Micro and Nanotechnology?Laboratory
University of Illinois at Urbana-Champaign
208 N. Wright St.
Urbana, IL 61801
Phone: 217-333-8051
Email: yglian at illinois.edu



-----Original Message-----
From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Kevin M McPeak
Sent: Monday, June 28, 2021 1:54 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Alcatel Turbo pump repair

Dear Colleagues,

Can you recommend a firm for Alcatel turbo pump repair? Thanks.

Regards,
Kevin

--
Kevin M. McPeak
Assistant Professor | LSU Dept. of Chemical Engineering
225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://urldefense.com/v3/__https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork__;!!DZ3fjg!uW0zUEz3iD1aI_Nqg568N9Pwaf3bwL8oCTBdpHvslbxzoijxzvSO3MueZudnxAJewQ$ 


From mo.kh.1985 at gmail.com  Mon Jun 28 16:07:24 2021
From: mo.kh.1985 at gmail.com (Mo Khodadadi)
Date: Mon, 28 Jun 2021 15:07:24 -0500
Subject: [labnetwork] Alcatel Turbo pump repair
In-Reply-To: <DM5PR06MB319517CC5E6F8645398C1150B0039@DM5PR06MB3195.namprd06.prod.outlook.com>
References: <DM5PR06MB319517CC5E6F8645398C1150B0039@DM5PR06MB3195.namprd06.prod.outlook.com>
Message-ID: <CACEs6rTwQJQffmRb0Uh_gXAawuaq56b0SvMYUqzx=r7xsfj-kQ@mail.gmail.com>

Hi Kevin,

I would recommend Provac <https://www.provac.com/> and PTB
<https://www.ptbsales.com/>.

Sincerely yours;
Mo Khodadadi
Research Associate
University of Houston Nanofabrication Facility <https://uhnf.egr.uh.edu/>
mkhodada at central.uh.edu


On Mon, Jun 28, 2021 at 2:42 PM Kevin M McPeak <kmcpeak at lsu.edu> wrote:

> Dear Colleagues,
>
> Can you recommend a firm for Alcatel turbo pump repair? Thanks.
>
> Regards,
> Kevin
>
> --
> Kevin M. McPeak
> Assistant Professor | LSU Dept. of Chemical Engineering
> 225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From rob.breisch at trilliumus.com  Mon Jun 28 20:01:36 2021
From: rob.breisch at trilliumus.com (Rob Breisch)
Date: Tue, 29 Jun 2021 00:01:36 +0000
Subject: [labnetwork] Alcatel Turbo pump repair
In-Reply-To: <BN6PR11MB1361FA48DD295A64E1523093AF039@BN6PR11MB1361.namprd11.prod.outlook.com>
References: <DM5PR06MB319517CC5E6F8645398C1150B0039@DM5PR06MB3195.namprd06.prod.outlook.com>,
 <BN6PR11MB1361FA48DD295A64E1523093AF039@BN6PR11MB1361.namprd11.prod.outlook.com>
Message-ID: <C5F5AF95-2999-4FBC-BEAB-24A419359B3F@trilliumus.com>

Pfeiffer is reasonably priced (IMO) for an OEM - they bought Alcatel several years ago.  I wouldn?t send them a turbo used on a dirty process - they tend to err on the side of replacing dirty parts as opposed to cleaning them.  I?m also not sure what model you have, so they may have discontinued support. Just check their lead times and ask for what the real lead times are.

Be careful sending to a 3rd party.  Ask if they can get the parts (rotors, stators, etc.).  I have some just take them in to deem them unrepairable so they can sell you a new one.  If your turbo is a maglev make sure they own the proper balancer.

Good luck!

Rob Breisch
801-726-5035

> On Jun 28, 2021, at 6:45 PM, Lian, Yaguang <yglian at illinois.edu> wrote:
> 
> ?Kevin,
> 
> You may contact Provac Sales, Inc.
> 
> Best,
> 
> Yaguang Lian
> Research Engineer
> 2306 Holonyak Micro and Nanotechnology Laboratory
> University of Illinois at Urbana-Champaign
> 208 N. Wright St.
> Urbana, IL 61801
> Phone: 217-333-8051
> Email: yglian at illinois.edu
> 
> 
> 
> -----Original Message-----
> From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Kevin M McPeak
> Sent: Monday, June 28, 2021 1:54 PM
> To: labnetwork at mtl.mit.edu
> Subject: [labnetwork] Alcatel Turbo pump repair
> 
> Dear Colleagues,
> 
> Can you recommend a firm for Alcatel turbo pump repair? Thanks.
> 
> Regards,
> Kevin
> 
> --
> Kevin M. McPeak
> Assistant Professor | LSU Dept. of Chemical Engineering
> 225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication
> 
> 
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://urldefense.com/v3/__https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork__;!!DZ3fjg!uW0zUEz3iD1aI_Nqg568N9Pwaf3bwL8oCTBdpHvslbxzoijxzvSO3MueZudnxAJewQ$ 
> 
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork

From mapril at draper.com  Tue Jun 29 05:21:10 2021
From: mapril at draper.com (April, Mark R.)
Date: Tue, 29 Jun 2021 09:21:10 +0000
Subject: [labnetwork] Alcatel Turbo pump repair
In-Reply-To: <BN6PR11MB1361FA48DD295A64E1523093AF039@BN6PR11MB1361.namprd11.prod.outlook.com>
References: <DM5PR06MB319517CC5E6F8645398C1150B0039@DM5PR06MB3195.namprd06.prod.outlook.com>
 <BN6PR11MB1361FA48DD295A64E1523093AF039@BN6PR11MB1361.namprd11.prod.outlook.com>
Message-ID: <1ba9c68a7607462d8d31f4e809a772e5@draper.com>

HI Kevin,
I found that this company does a good job and their prices are good.
Vincent Wang
Texas Capitol Semiconductor, Inc.
East Coast Service
(347) 866-7804 Cell
(480) 834-3000 Office (Arizona Headquarter)
www.tcsemi.com
good luck

Mark R. April
Senior  Equipment Engineer
Microfabrication Laboratory
Draper Laboratory
555 Technology Square
Cambridge, MA  02139
mapril at draper.com
O # 617-258-1613 C # 617-455-1596
www.draper.com



-----Original Message-----
From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Lian, Yaguang
Sent: Monday, June 28, 2021 3:45 PM
To: Kevin M McPeak <kmcpeak at lsu.edu>; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Alcatel Turbo pump repair

Kevin,

You may contact Provac Sales, Inc.

Best,

Yaguang Lian
Research Engineer
2306 Holonyak Micro and Nanotechnology Laboratory University of Illinois at Urbana-Champaign
208 N. Wright St.
Urbana, IL 61801
Phone: 217-333-8051
Email: yglian at illinois.edu



-----Original Message-----
From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Kevin M McPeak
Sent: Monday, June 28, 2021 1:54 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Alcatel Turbo pump repair

Dear Colleagues,

Can you recommend a firm for Alcatel turbo pump repair? Thanks.

Regards,
Kevin

--
Kevin M. McPeak
Assistant Professor | LSU Dept. of Chemical Engineering
225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://urldefense.com/v3/__https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork__;!!DZ3fjg!uW0zUEz3iD1aI_Nqg568N9Pwaf3bwL8oCTBdpHvslbxzoijxzvSO3MueZudnxAJewQ$

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
________________________________
 Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________


From dlafleur at cns.fas.harvard.edu  Tue Jun 29 07:23:16 2021
From: dlafleur at cns.fas.harvard.edu (LaFleur, David W)
Date: Tue, 29 Jun 2021 11:23:16 +0000
Subject: [labnetwork] Alcatel Turbo pump repair
In-Reply-To: <BN6PR11MB1361FA48DD295A64E1523093AF039@BN6PR11MB1361.namprd11.prod.outlook.com>
References: <DM5PR06MB319517CC5E6F8645398C1150B0039@DM5PR06MB3195.namprd06.prod.outlook.com>,
 <BN6PR11MB1361FA48DD295A64E1523093AF039@BN6PR11MB1361.namprd11.prod.outlook.com>
Message-ID: <0C3D6D4B-4B4C-4BE0-B001-31741F6DB970@cns.fas.harvard.edu>

Hi Kevin,

We use Turbo Vacuum Inc. They give excellent service and they can repair all makes of turbos. I?ve been using them for many years and have never been disappointed. 

Regards,

David LaFleur
CNS
Harvard University 

Sent from my iPhone

> On Jun 28, 2021, at 7:44 PM, Lian, Yaguang <yglian at illinois.edu> wrote:
> 
> ?Kevin,
> 
> You may contact Provac Sales, Inc.
> 
> Best,
> 
> Yaguang Lian
> Research Engineer
> 2306 Holonyak Micro and Nanotechnology Laboratory
> University of Illinois at Urbana-Champaign
> 208 N. Wright St.
> Urbana, IL 61801
> Phone: 217-333-8051
> Email: yglian at illinois.edu
> 
> 
> 
> -----Original Message-----
> From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Kevin M McPeak
> Sent: Monday, June 28, 2021 1:54 PM
> To: labnetwork at mtl.mit.edu
> Subject: [labnetwork] Alcatel Turbo pump repair
> 
> Dear Colleagues,
> 
> Can you recommend a firm for Alcatel turbo pump repair? Thanks.
> 
> Regards,
> Kevin
> 
> --
> Kevin M. McPeak
> Assistant Professor | LSU Dept. of Chemical Engineering
> 225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication
> 
> 
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://urldefense.com/v3/__https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork__;!!DZ3fjg!uW0zUEz3iD1aI_Nqg568N9Pwaf3bwL8oCTBdpHvslbxzoijxzvSO3MueZudnxAJewQ$ 
> 
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork

From andrew.lingley at montana.edu  Wed Jun 30 14:04:50 2021
From: andrew.lingley at montana.edu (Lingley, Andrew)
Date: Wed, 30 Jun 2021 18:04:50 +0000
Subject: [labnetwork] LLZO sputtering
Message-ID: <MW2PR02MB36590D3F5F147E1020E93D558F019@MW2PR02MB3659.namprd02.prod.outlook.com>

Hello,
Does anyone have experience sputtering LLZO, lithium lanthanum zirconium oxide? We have a 3 target Angstrom Engineering sputter tool, and their general recommendations are to either a) avoid it, or b) cover everything with aluminum foil and then deposit a ton of aluminum after the LLZO target is out of the tool. The SDS indicates that the target is air and water sensitive, and that we need to take respiratory and handling precautions.
Does anyone have any recommendations on loading and unloading the target? Any ideas on additional cleaning protocols? Contamination issues? Does anyone allow this?
Advice appreciated, and thanks in advance,
Andy

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