From Matt.Dwyer at drs.com Mon Nov 1 17:43:20 2021 From: Matt.Dwyer at drs.com (Dwyer, Matt) Date: Mon, 1 Nov 2021 21:43:20 +0000 Subject: [labnetwork] Repairing cleanroom epoxy floor Message-ID: Hi all, Does anyone have experience repairing damaged cleanroom ESD epoxy floor? Some areas have cracks from shifting concrete, which should be ok to fill, but we also have some large areas where the epoxy has stained or degraded over 20 years of use. Are there vendors that specialize in epoxy floor repair in critical environments? Should we consider just covering the floor with another cleanroom flooring solution (for the room with degraded epoxy)? This is for a class 1000 facility. Any advice would be greatly appreciated! Thanks, Matt Matt Dwyer Principal Process Engineer DRS Daylight Solutions 1832 Wright St, Madison, WI 53704 USA Tel +1 608 287 3785 matt.dwyer at drs.com leonardodrs.com daylightsolutions.com -------------- next part -------------- An HTML attachment was scrubbed... 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Name: image006.png Type: image/png Size: 506 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: smime.p7s Type: application/pkcs7-signature Size: 6654 bytes Desc: not available URL: From wteynor at draper.com Tue Nov 2 12:04:01 2021 From: wteynor at draper.com (Teynor, William A.) Date: Tue, 2 Nov 2021 16:04:01 +0000 Subject: [labnetwork] Defects after resist spinning In-Reply-To: <50ecfa0c-8cf7-4704-83da-ccdc0c640434@email.android.com> References: <50ecfa0c-8cf7-4704-83da-ccdc0c640434@email.android.com> Message-ID: <1c82b103743a4d879beb4e654db9cb6d@draper.com> Hi Eva, Given the size of the defects and the lack of a comet tail in the resist, it looks like small droplets landed on the photoresist film near the end or after the wafer finished spinning. The droplets could be from aerosolized photoresist/solvent micro droplets generated during spin coating. Another possibility would be splashed acetone droplets, from wetting a fabwipe in close proximity. The defects appears to be surface wrinkling whose pattern is the result of stress minimization in the photoresist skin as the extra solvent dries. Bill From: labnetwork On Behalf Of Lino Eugene Sent: Saturday, October 23, 2021 9:28 AM To: Eva Rose Cc: labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Defects after resist spinning Hi Eva, It looks like that there is dendritic cristallisation in your defects. Was the subtrate immersed in RCA 1 or BOE or any solution involving a salt? If so, my first thought is that the substrate was not rinsed properly prior spin coating. Best, Lino Eugene On Oct. 23, 2021 07:46, Aaron Hryciw > wrote: Hi Eva, Out of curiosity, did you previously inspect the wafer in an optical microscope using a higher-mag objective than the one used to capture the images? Given how circular these defects look, and the concentric pattern, my guess is that this is a heating effect, the result of staying too long in one position with a high light intensity. Cheers, ? Aaron Aaron Hryciw, PhD, PEng Fabrication Group Manager University of Alberta - nanoFAB W1-060 ECERF Building 9107 - 116 Street Edmonton, Alberta Canada T6G 2V4 Ph: 780-940-7938 www.nanofab.ualberta.ca On Fri, Oct 22, 2021 at 5:55 PM Eva Rose > wrote: Dear all, did anybody ever see any defects like this on the resist surface after resist spinning. The diameter varies from about 20um to over 150um. [cid:17caaeab150a3a20b871] [cid:17caaeab15074e3f89d2] Any idea what the reason could be? Best regards, Eva _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork ________________________________ Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email. ________________________________ -------------- next part -------------- An HTML attachment was scrubbed... URL: From dhan.cardinal at mcgill.ca Tue Nov 2 16:03:11 2021 From: dhan.cardinal at mcgill.ca (Dhan Cardinal) Date: Tue, 2 Nov 2021 20:03:11 +0000 Subject: [labnetwork] Sopra GES5 Ellipsometer Message-ID: Dear all, We currently have a Sopra GES5 ellipsometer which we can't calibrate due to being locked out of the system, ie, we don't have the passwords for the maintenance/operator/calibration modes. I was wondering if anyone might know what the default passwords for these machines might be? And also, if anyone would have any kind of information for calibration it would also be greatly appreciated. Thank you Dhan Cardinal Research Assistant - Cleanroom Equipment Specialist McGill Nanotools Microfab (MNM) McGill Institute of Advanced Materials (MIAM) McGill University Montreal, Quebec, Canada H3A 2T8 * 514-398-7329 * Dhan.Cardinal at McGill.ca Website: www.mcgill.ca/microfab/ -------------- next part -------------- An HTML attachment was scrubbed... URL: From betemc at rit.edu Tue Nov 2 16:51:23 2021 From: betemc at rit.edu (Bruce Tolleson) Date: Tue, 2 Nov 2021 20:51:23 +0000 Subject: [labnetwork] Defects after resist spinning In-Reply-To: <1c82b103743a4d879beb4e654db9cb6d@draper.com> References: <50ecfa0c-8cf7-4704-83da-ccdc0c640434@email.android.com> <1c82b103743a4d879beb4e654db9cb6d@draper.com> Message-ID: <344fe182af684dc08a13dfba029f3ca0@ex04mail01d.ad.rit.edu> Are you using EBR when coating the wafer? EBR droplets from a leak could cause this. Bruce E. Tolleson Rochester Institute of Technology 82 Lomb Memorial Drive, Bldg 17-2627 Rochester, NY 14623-5604 (585) 478-3836 [http://www.rit.edu/~962www/logos/tiger_walking_rit_color.jpg] From: labnetwork On Behalf Of Teynor, William A. Sent: Tuesday, November 2, 2021 12:04 PM To: Lino Eugene ; Eva Rose Cc: labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Defects after resist spinning Hi Eva, Given the size of the defects and the lack of a comet tail in the resist, it looks like small droplets landed on the photoresist film near the end or after the wafer finished spinning. The droplets could be from aerosolized photoresist/solvent micro droplets generated during spin coating. Another possibility would be splashed acetone droplets, from wetting a fabwipe in close proximity. The defects appears to be surface wrinkling whose pattern is the result of stress minimization in the photoresist skin as the extra solvent dries. Bill From: labnetwork > On Behalf Of Lino Eugene Sent: Saturday, October 23, 2021 9:28 AM To: Eva Rose > Cc: labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Defects after resist spinning Hi Eva, It looks like that there is dendritic cristallisation in your defects. Was the subtrate immersed in RCA 1 or BOE or any solution involving a salt? If so, my first thought is that the substrate was not rinsed properly prior spin coating. Best, Lino Eugene On Oct. 23, 2021 07:46, Aaron Hryciw > wrote: Hi Eva, Out of curiosity, did you previously inspect the wafer in an optical microscope using a higher-mag objective than the one used to capture the images? Given how circular these defects look, and the concentric pattern, my guess is that this is a heating effect, the result of staying too long in one position with a high light intensity. Cheers, ? Aaron Aaron Hryciw, PhD, PEng Fabrication Group Manager University of Alberta - nanoFAB W1-060 ECERF Building 9107 - 116 Street Edmonton, Alberta Canada T6G 2V4 Ph: 780-940-7938 www.nanofab.ualberta.ca On Fri, Oct 22, 2021 at 5:55 PM Eva Rose > wrote: Dear all, did anybody ever see any defects like this on the resist surface after resist spinning. The diameter varies from about 20um to over 150um. [cid:17caaeab150a3a20b871] [cid:17caaeab15074e3f89d2] Any idea what the reason could be? Best regards, Eva _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork ________________________________ Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email. ________________________________ -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.jpg Type: image/jpeg Size: 2550 bytes Desc: image001.jpg URL: From blewis at eng.ufl.edu Wed Nov 3 08:53:53 2021 From: blewis at eng.ufl.edu (Lewis,William) Date: Wed, 3 Nov 2021 12:53:53 +0000 Subject: [labnetwork] Defects after resist spinning In-Reply-To: <344fe182af684dc08a13dfba029f3ca0@ex04mail01d.ad.rit.edu> References: <50ecfa0c-8cf7-4704-83da-ccdc0c640434@email.android.com> <1c82b103743a4d879beb4e654db9cb6d@draper.com> <344fe182af684dc08a13dfba029f3ca0@ex04mail01d.ad.rit.edu> Message-ID: Typical air bubbles in the resist. How is being dispensed? From: labnetwork On Behalf Of Bruce Tolleson Sent: Tuesday, November 2, 2021 4:51 PM To: Teynor, William A. ; Lino Eugene ; Eva Rose Cc: labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Defects after resist spinning [External Email] Are you using EBR when coating the wafer? EBR droplets from a leak could cause this. Bruce E. Tolleson Rochester Institute of Technology 82 Lomb Memorial Drive, Bldg 17-2627 Rochester, NY 14623-5604 (585) 478-3836 [http://www.rit.edu/~962www/logos/tiger_walking_rit_color.jpg] From: labnetwork > On Behalf Of Teynor, William A. Sent: Tuesday, November 2, 2021 12:04 PM To: Lino Eugene >; Eva Rose > Cc: labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Defects after resist spinning Hi Eva, Given the size of the defects and the lack of a comet tail in the resist, it looks like small droplets landed on the photoresist film near the end or after the wafer finished spinning. The droplets could be from aerosolized photoresist/solvent micro droplets generated during spin coating. Another possibility would be splashed acetone droplets, from wetting a fabwipe in close proximity. The defects appears to be surface wrinkling whose pattern is the result of stress minimization in the photoresist skin as the extra solvent dries. Bill From: labnetwork > On Behalf Of Lino Eugene Sent: Saturday, October 23, 2021 9:28 AM To: Eva Rose > Cc: labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Defects after resist spinning Hi Eva, It looks like that there is dendritic cristallisation in your defects. Was the subtrate immersed in RCA 1 or BOE or any solution involving a salt? If so, my first thought is that the substrate was not rinsed properly prior spin coating. Best, Lino Eugene On Oct. 23, 2021 07:46, Aaron Hryciw > wrote: Hi Eva, Out of curiosity, did you previously inspect the wafer in an optical microscope using a higher-mag objective than the one used to capture the images? Given how circular these defects look, and the concentric pattern, my guess is that this is a heating effect, the result of staying too long in one position with a high light intensity. Cheers, ? Aaron Aaron Hryciw, PhD, PEng Fabrication Group Manager University of Alberta - nanoFAB W1-060 ECERF Building 9107 - 116 Street Edmonton, Alberta Canada T6G 2V4 Ph: 780-940-7938 www.nanofab.ualberta.ca On Fri, Oct 22, 2021 at 5:55 PM Eva Rose > wrote: Dear all, did anybody ever see any defects like this on the resist surface after resist spinning. The diameter varies from about 20um to over 150um. [cid:17caaeab150a3a20b871] [cid:17caaeab15074e3f89d2] Any idea what the reason could be? Best regards, Eva _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork ________________________________ Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email. ________________________________ -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.jpg Type: image/jpeg Size: 2550 bytes Desc: image001.jpg URL: From shimonel at savion.huji.ac.il Wed Nov 3 10:31:10 2021 From: shimonel at savion.huji.ac.il (Shimon Eliav) Date: Wed, 3 Nov 2021 14:31:10 +0000 Subject: [labnetwork] Mask of Al in HF In-Reply-To: References: Message-ID: Hi All, I found very interesting the discussion around Joe's question. Please find attached the summary of the answers. Regards, Shimon From: labnetwork [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Maduzia, Joseph Walter Sent: Tuesday, 26 October 2021 23:49 To: labnetwork at mtl.mit.edu Subject: [labnetwork] Mask of Al in HF Hello, Does anyone have any suggestions for mask materials to protect Al in HF 49% for SiO2 removal in SOI wafer? The device is SOI, ICP DRIE etched to glass, HF etch to undercut and free devices, but have Al contact pads and AL is dep'd first. Typically we use PR as pattern mask, but the Al is etching behind the PR. In this case the Al is deposited first, so although order of operations change might help, it's not a good option atm. Thank you for any suggestions you might have! JOE MADUZIA MNMS Laboratory Specialist The Grainger College of Engineering Mechanical Science and Engineering 2239 Sidney Lu Mechanical Engineering Bldg 1206 W. Green Urbana, IL 61801 217.244.6302 | jmaduzi2 at illinois.edu https://cleanroom.mechse.illinois.edu/ [cid:image001.png at 01D7D0CF.E44D5540] Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 4711 bytes Desc: image001.png URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: HF Etching in the presence of Al.docx Type: application/vnd.openxmlformats-officedocument.wordprocessingml.document Size: 22570 bytes Desc: HF Etching in the presence of Al.docx URL: From jmaduzi2 at illinois.edu Thu Nov 4 09:59:09 2021 From: jmaduzi2 at illinois.edu (Maduzia, Joseph Walter) Date: Thu, 4 Nov 2021 13:59:09 +0000 Subject: [labnetwork] PR bubbles where exposed Message-ID: Hello All! Thank you again for all your feedback on SiO2 etch around Al. It has been very helpful and we are moving down multiple paths suggested via the Lab Network to try to solve the issue. More to come once we solve it! I have another issue I was hoping for feedback on. We have bubbling in our PR (SPR-220-4.5) (pos tone) that we haven't been able to track the source of. It only bubbles during exposure and only where it is exposed. Unexposed areas are unaffected. I've attached some images of the bubbling where you can see the exposed (lighter) and unexposed (darker) areas. The bubbles are visible to the naked eye. The wafer is silicon w a dry thermally grown SiO2 surface. We typically expose via EV620 mask aligner with Vac+HardContact. However, even in a flood exposure with the mask just set lightly down it still bubbles. Without a mask there are also bubbles randomly distributed across the wafer, but they don't get stuck to the mask so they don't pop. We tried various pre-bakes, HMDS coat vs not, piranha treat vs not. In the past these bubbles show up, we trial and error to get rid of them and suddenly they disappear. Our process, although seemingly repeatable, does not yield repeatable results. Thank You, JOE MADUZIA MNMS Laboratory Specialist The Grainger College of Engineering Mechanical Science and Engineering 2239 Sidney Lu Mechanical Engineering Bldg 1206 W. Green Urbana, IL 61801 217.244.6302 | jmaduzi2 at illinois.edu https://cleanroom.mechse.illinois.edu/ [cid:image001.png at 01D7D156.50D75180] Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 4711 bytes Desc: image001.png URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: 5x 2.jpg Type: image/jpeg Size: 2415651 bytes Desc: 5x 2.jpg URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: 5x 1.jpg Type: image/jpeg Size: 2309384 bytes Desc: 5x 1.jpg URL: From rmorrison at draper.com Thu Nov 4 11:45:06 2021 From: rmorrison at draper.com (Morrison, Richard H., Jr) Date: Thu, 4 Nov 2021 15:45:06 +0000 Subject: [labnetwork] PR bubbles where exposed In-Reply-To: References: Message-ID: <6113c23ed2d648b093fa08ca2eae0082@draper.com> HI, These look like Nitrogen bubbles, how thick is the resist? Is the thickness in the recommended range? We have this issue when the humidity is out of control, we solved the issue by reducing the thickness, to be in the recommended range and changing the prebake per advice form the resist supplier. Rick Richard Morrison PMTS Draper Laboratory 555 Technology Square Cambridge Ma 02139 Office: 617-258-3420 Cell: 508-930-3461 From: labnetwork On Behalf Of Maduzia, Joseph Walter Sent: Thursday, November 4, 2021 9:59 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] PR bubbles where exposed Hello All! Thank you again for all your feedback on SiO2 etch around Al. It has been very helpful and we are moving down multiple paths suggested via the Lab Network to try to solve the issue. More to come once we solve it! I have another issue I was hoping for feedback on. We have bubbling in our PR (SPR-220-4.5) (pos tone) that we haven't been able to track the source of. It only bubbles during exposure and only where it is exposed. Unexposed areas are unaffected. I've attached some images of the bubbling where you can see the exposed (lighter) and unexposed (darker) areas. The bubbles are visible to the naked eye. The wafer is silicon w a dry thermally grown SiO2 surface. We typically expose via EV620 mask aligner with Vac+HardContact. However, even in a flood exposure with the mask just set lightly down it still bubbles. Without a mask there are also bubbles randomly distributed across the wafer, but they don't get stuck to the mask so they don't pop. We tried various pre-bakes, HMDS coat vs not, piranha treat vs not. In the past these bubbles show up, we trial and error to get rid of them and suddenly they disappear. Our process, although seemingly repeatable, does not yield repeatable results. Thank You, JOE MADUZIA MNMS Laboratory Specialist The Grainger College of Engineering Mechanical Science and Engineering 2239 Sidney Lu Mechanical Engineering Bldg 1206 W. Green Urbana, IL 61801 217.244.6302 | jmaduzi2 at illinois.edu https://cleanroom.mechse.illinois.edu/ [cid:image001.png at 01D7D171.69662350] Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure. ________________________________ Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email. ________________________________ -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 4711 bytes Desc: image001.png URL: From Jeffrey.Salzmann at integer.net Thu Nov 4 11:47:36 2021 From: Jeffrey.Salzmann at integer.net (Salzmann, Jeffrey) Date: Thu, 4 Nov 2021 15:47:36 +0000 Subject: [labnetwork] PR bubbles where exposed In-Reply-To: References: Message-ID: Joe, What is the humidity of the photo area? Jeff Jeff Salzmann Senior Research Engineer Advanced Materials Technology Group Integer* 10000 Wehrle Drive Clarence, NY, 14031 Tel +1 716.759.5796 Cell +1 716.867.1302 Jeffrey.Salzmann at integer.net www.integer.net * Integer comprises the following companies: Greatbatch Medical -? Lake Region Medical -? Electrochem From: labnetwork On Behalf Of Maduzia, Joseph Walter Sent: Thursday, November 4, 2021 9:59 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] PR bubbles where exposed CAUTION: This email originated from outside of the organization. Do not click links or open attachments unless you recognize the sender and know the content is safe. Hello All! Thank you again for all your feedback on SiO2 etch around Al. It has been very helpful and we are moving down multiple paths suggested via the Lab Network to try to solve the issue. More to come once we solve it! I have another issue I was hoping for feedback on. We have bubbling in our PR (SPR-220-4.5) (pos tone) that we haven?t been able to track the source of. It only bubbles during exposure and only where it is exposed. Unexposed areas are unaffected. I?ve attached some images of the bubbling where you can see the exposed (lighter) and unexposed (darker) areas. The bubbles are visible to the naked eye. The wafer is silicon w a dry thermally grown SiO2 surface. We typically expose via EV620 mask aligner with Vac+HardContact. However, even in a flood exposure with the mask just set lightly down it still bubbles. Without a mask there are also bubbles randomly distributed across the wafer, but they don?t get stuck to the mask so they don?t pop. We tried various pre-bakes, HMDS coat vs not, piranha treat vs not. In the past these bubbles show up, we trial and error to get rid of them and suddenly they disappear. Our process, although seemingly repeatable, does not yield repeatable results. Thank You, JOE MADUZIA MNMS Laboratory Specialist The Grainger College of Engineering Mechanical Science and Engineering 2239 Sidney Lu Mechanical Engineering Bldg 1206 W. Green Urbana, IL 61801 217.244.6302 | jmaduzi2 at illinois.edu https://cleanroom.mechse.illinois.edu/ [cid:image001.png at 01D7D171.C25A5AD0] Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure. ________________________________ Integer Confidentiality Notice: This electronic mail transmission is intended for the use of the individual or entity to which it is addressed and may contain confidential or proprietary information belonging to the sender. If you are not the intended recipient, you are hereby notified that any disclosure, copying, distribution, or the taking of any action in reliance on the contents of this information is strictly prohibited. If you have received this transmission in error, please notify the sender immediately by e-mail and delete the original message. Thank you for your cooperation. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 4711 bytes Desc: image001.png URL: From yakimom at sunypoly.edu Thu Nov 4 11:49:12 2021 From: yakimom at sunypoly.edu (Michael Yakimov) Date: Thu, 4 Nov 2021 15:49:12 +0000 Subject: [labnetwork] PR bubbles where exposed In-Reply-To: References: Message-ID: I guess I am too late to be in first 10 to answer... N2 forms as a result of photochemical reaction in DNQ resists. You need slower and/or lower exposure to generate less N2 and allow it to dissipate Last paragraph in this link describes the problem: https://www.allresist.com/resist-wiki-why-may-air-bubbles-develop-in-photoresist-films-and-how-can-they-be-avoided/ [http://allresist.de/wp-content/themes/regnerbau/img/icons/facebook-logo.jpg] 7. Why may air bubbles develop in photoresist films, and how can they be avoided? - Allresist EN Luftbl?schen nach dem Aufschleudern sind meist Luftbl?schen, z.B. wenn die Lackflasche vor der Beschichtung gesch?ttelt bzw. st?rker bewegt wurde oder der Lack verd?nnt wurde. Beschichtungen nach unmittelbarer ?ffnung der Flaschen, insbesondere vor einem Temperaturausgleich k?nnen ebenfalls zu Luftblasen f?hren. www.allresist.com ________________________________ From: labnetwork on behalf of Maduzia, Joseph Walter Sent: Thursday, November 4, 2021 9:59 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] PR bubbles where exposed Hello All! Thank you again for all your feedback on SiO2 etch around Al. It has been very helpful and we are moving down multiple paths suggested via the Lab Network to try to solve the issue. More to come once we solve it! I have another issue I was hoping for feedback on. We have bubbling in our PR (SPR-220-4.5) (pos tone) that we haven?t been able to track the source of. It only bubbles during exposure and only where it is exposed. Unexposed areas are unaffected. I?ve attached some images of the bubbling where you can see the exposed (lighter) and unexposed (darker) areas. The bubbles are visible to the naked eye. The wafer is silicon w a dry thermally grown SiO2 surface. We typically expose via EV620 mask aligner with Vac+HardContact. However, even in a flood exposure with the mask just set lightly down it still bubbles. Without a mask there are also bubbles randomly distributed across the wafer, but they don?t get stuck to the mask so they don?t pop. We tried various pre-bakes, HMDS coat vs not, piranha treat vs not. In the past these bubbles show up, we trial and error to get rid of them and suddenly they disappear. Our process, although seemingly repeatable, does not yield repeatable results. Thank You, JOE MADUZIA MNMS Laboratory Specialist The Grainger College of Engineering Mechanical Science and Engineering 2239 Sidney Lu Mechanical Engineering Bldg 1206 W. Green Urbana, IL 61801 217.244.6302 | jmaduzi2 at illinois.edu https://cleanroom.mechse.illinois.edu/ [cid:image001.png at 01D7D156.50D75180] Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 4711 bytes Desc: image001.png URL: From price.798 at osu.edu Thu Nov 4 12:02:58 2021 From: price.798 at osu.edu (Price, Aimee) Date: Thu, 4 Nov 2021 16:02:58 +0000 Subject: [labnetwork] PR bubbles where exposed In-Reply-To: References: Message-ID: Hi Joe, In our experience at OSU, SPR220 is one of those resists that requires a "re-hydration" step for thicker films or you get bubbles. In our case we suggest a wait of 2hours after exposure before PEB(which seems ridiculous I realize) for films thicker than 7um. If we don't wait, this is the result. [cid:image002.png at 01D7D172.EBCAC390] If you have good control of your humidity in your lab, then you might look at various wait times. If you don't, that might explain why sometimes you don't see these defects. We had an issue with our humidifier (long story) that resulted in times of very low humidity. We believe that's where the 2 hour time came from, which would likely be less now that our humidity is under control. We don't use 220 much anymore, so haven't studied it further. Our spin coater has a hygrometer so we ask users to note the humidity for all of their lithography processes, however they don't always. By chance, we also have EV 620 aligners. I don't think that makes a difference but we have not studied it with either our MLA or our old MJB-3. Happy to discuss further if you'd like. Best, Aimee Manager, Nanofabrication The Ohio State University Nanotech West Lab Institute for Materials Research 1381 Kinnear Road Suite 100 Columbus, OH 43212 614-292-2753 From: labnetwork On Behalf Of Maduzia, Joseph Walter Sent: Thursday, November 4, 2021 9:59 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] PR bubbles where exposed Hello All! Thank you again for all your feedback on SiO2 etch around Al. It has been very helpful and we are moving down multiple paths suggested via the Lab Network to try to solve the issue. More to come once we solve it! I have another issue I was hoping for feedback on. We have bubbling in our PR (SPR-220-4.5) (pos tone) that we haven't been able to track the source of. It only bubbles during exposure and only where it is exposed. Unexposed areas are unaffected. I've attached some images of the bubbling where you can see the exposed (lighter) and unexposed (darker) areas. The bubbles are visible to the naked eye. The wafer is silicon w a dry thermally grown SiO2 surface. We typically expose via EV620 mask aligner with Vac+HardContact. However, even in a flood exposure with the mask just set lightly down it still bubbles. Without a mask there are also bubbles randomly distributed across the wafer, but they don't get stuck to the mask so they don't pop. We tried various pre-bakes, HMDS coat vs not, piranha treat vs not. In the past these bubbles show up, we trial and error to get rid of them and suddenly they disappear. Our process, although seemingly repeatable, does not yield repeatable results. Thank You, JOE MADUZIA MNMS Laboratory Specialist The Grainger College of Engineering Mechanical Science and Engineering 2239 Sidney Lu Mechanical Engineering Bldg 1206 W. Green Urbana, IL 61801 217.244.6302 | jmaduzi2 at illinois.edu https://cleanroom.mechse.illinois.edu/ [cid:image003.png at 01D7D172.EBCAC390] Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image002.png Type: image/png Size: 266402 bytes Desc: image002.png URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image003.png Type: image/png Size: 4711 bytes Desc: image003.png URL: From hollingshead.19 at osu.edu Thu Nov 4 12:12:59 2021 From: hollingshead.19 at osu.edu (Hollingshead, Dave) Date: Thu, 4 Nov 2021 16:12:59 +0000 Subject: [labnetwork] PR bubbles where exposed In-Reply-To: References: Message-ID: Hi Joe, The bubbles you are seeing are common, but typically only on thicker SPR-220 coats (~10+?m) that are processed without, or with too short of, a wait time. The samples must rehydrate to complete the photo-reaction. A wait time between exposure and your post-exposure bake usually allows this rehydration to occur. That being said, I'm guessing your spins are fairly thin with the 4.5 variant so it may be an issue with your cleanroom humidity. If that is particularly low the samples will take longer to rehydrate, or may not rehydrate properly if the humidity is too low. -Dave Dave Hollingshead Manager of Research Operations - Nanotech West Lab The Ohio State University Suite 100, 1381 Kinnear Road, Columbus, OH 43212 614.292.1355 Office hollingshead.19 at osu.edu osu.edu From: labnetwork On Behalf Of Maduzia, Joseph Walter Sent: Thursday, November 4, 2021 09:59 To: labnetwork at mtl.mit.edu Subject: [labnetwork] PR bubbles where exposed Hello All! Thank you again for all your feedback on SiO2 etch around Al. It has been very helpful and we are moving down multiple paths suggested via the Lab Network to try to solve the issue. More to come once we solve it! I have another issue I was hoping for feedback on. We have bubbling in our PR (SPR-220-4.5) (pos tone) that we haven't been able to track the source of. It only bubbles during exposure and only where it is exposed. Unexposed areas are unaffected. I've attached some images of the bubbling where you can see the exposed (lighter) and unexposed (darker) areas. The bubbles are visible to the naked eye. The wafer is silicon w a dry thermally grown SiO2 surface. We typically expose via EV620 mask aligner with Vac+HardContact. However, even in a flood exposure with the mask just set lightly down it still bubbles. Without a mask there are also bubbles randomly distributed across the wafer, but they don't get stuck to the mask so they don't pop. We tried various pre-bakes, HMDS coat vs not, piranha treat vs not. In the past these bubbles show up, we trial and error to get rid of them and suddenly they disappear. Our process, although seemingly repeatable, does not yield repeatable results. Thank You, JOE MADUZIA MNMS Laboratory Specialist The Grainger College of Engineering Mechanical Science and Engineering 2239 Sidney Lu Mechanical Engineering Bldg 1206 W. Green Urbana, IL 61801 217.244.6302 | jmaduzi2 at illinois.edu https://cleanroom.mechse.illinois.edu/ [cid:image001.png at 01D7D174.0E5A4F10] Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 4711 bytes Desc: image001.png URL: From price.798 at osu.edu Thu Nov 4 15:44:51 2021 From: price.798 at osu.edu (Price, Aimee) Date: Thu, 4 Nov 2021 19:44:51 +0000 Subject: [labnetwork] MAEBL 2021 November 9-10 (hybrid event) Message-ID: Hello LabNetwork Colleagues, It's not too late to register for MAEBL 2021 (Meeting for Advanced Ebeam Lithography). Join the world wide community of EBL experts and new tool owners/users for a 2-day hybrid event (in person at The University of Pennsylvania or online in GatherTown). The program is here. * Day 1 features the EBL Foundations Workshop where experts impart their working knowledge in nano patterning to next gen e-beamers; students (and EBL users) are strongly encouraged to attend. * Day 2 is the Core Meeting that covers a wide variety of EBL related topics from cost of ownership to modeling to process development and features invited talks from both industry and academia. It's not too late to register: https://maebl.eventbrite.com. I look forward to seeing many of you next week! Best, Aimee Bross Price President/Co-founder MAEBL Inc. Manager, Nanofabrication The Ohio State University Nanotech West Lab Institute for Materials Research 1381 Kinnear Road Suite 100 Columbus, OH 43212 614-292-2753 -------------- next part -------------- An HTML attachment was scrubbed... URL: From dlloyd at laseroptical.co.uk Fri Nov 5 06:17:57 2021 From: dlloyd at laseroptical.co.uk (Daniel Lloyd) Date: Fri, 5 Nov 2021 10:17:57 +0000 Subject: [labnetwork] PR bubbles where exposed In-Reply-To: <6113c23ed2d648b093fa08ca2eae0082@draper.com> References: <6113c23ed2d648b093fa08ca2eae0082@draper.com> Message-ID: Hi, I've seen similar bubbles in the past, but not consistently. While I'm aware that the clean room I have access to is only loosely humidity controlled, what should be an acceptable range. The resist I use doesn't mention anything. My relaxation time between pre-bake and exposure is typically 1 hour to let the substrates cool, does anyone have a guide to working that out? Thanks, Daniel Lloyd Development Engineer, From: labnetwork On Behalf Of Morrison, Richard H., Jr Sent: 04 November 2021 15:45 To: Maduzia, Joseph Walter ; labnetwork at mtl.mit.edu Subject: Re: [labnetwork] PR bubbles where exposed HI, These look like Nitrogen bubbles, how thick is the resist? Is the thickness in the recommended range? We have this issue when the humidity is out of control, we solved the issue by reducing the thickness, to be in the recommended range and changing the prebake per advice form the resist supplier. Rick Richard Morrison PMTS Draper Laboratory 555 Technology Square Cambridge Ma 02139 Office: 617-258-3420 Cell: 508-930-3461 From: labnetwork > On Behalf Of Maduzia, Joseph Walter Sent: Thursday, November 4, 2021 9:59 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] PR bubbles where exposed Hello All! Thank you again for all your feedback on SiO2 etch around Al. It has been very helpful and we are moving down multiple paths suggested via the Lab Network to try to solve the issue. More to come once we solve it! I have another issue I was hoping for feedback on. We have bubbling in our PR (SPR-220-4.5) (pos tone) that we haven't been able to track the source of. It only bubbles during exposure and only where it is exposed. Unexposed areas are unaffected. I've attached some images of the bubbling where you can see the exposed (lighter) and unexposed (darker) areas. The bubbles are visible to the naked eye. The wafer is silicon w a dry thermally grown SiO2 surface. We typically expose via EV620 mask aligner with Vac+HardContact. However, even in a flood exposure with the mask just set lightly down it still bubbles. Without a mask there are also bubbles randomly distributed across the wafer, but they don't get stuck to the mask so they don't pop. We tried various pre-bakes, HMDS coat vs not, piranha treat vs not. In the past these bubbles show up, we trial and error to get rid of them and suddenly they disappear. Our process, although seemingly repeatable, does not yield repeatable results. Thank You, JOE MADUZIA MNMS Laboratory Specialist The Grainger College of Engineering Mechanical Science and Engineering 2239 Sidney Lu Mechanical Engineering Bldg 1206 W. Green Urbana, IL 61801 217.244.6302 | jmaduzi2 at illinois.edu https://cleanroom.mechse.illinois.edu/ [cid:image001.png at 01D7D22E.664E3910] Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure. ________________________________ Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email. ________________________________ -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 4711 bytes Desc: image001.png URL: From yakimom at sunypoly.edu Fri Nov 5 10:30:42 2021 From: yakimom at sunypoly.edu (Michael Yakimov) Date: Fri, 5 Nov 2021 14:30:42 +0000 Subject: [labnetwork] PR bubbles where exposed In-Reply-To: References: <6113c23ed2d648b093fa08ca2eae0082@draper.com> Message-ID: Both water and N2 are part of photochemical reaction. https://www.microchemicals.com/technical_information/exposure_photoresist.pdf [cid:image002.png at 01D7D230.2DCF4320] Bubbles formed in the resist under exposure are nitrogen. Hydration is only tangentially related, as lack of moisture calls for longer exposure times and overexposure of top layers which get hydrated first. I believe N2 can still be split off without water, but soluble molecule doesn?t form without H2O. My understanding is that normal resist exposure doesn?t involve 100% reaction. Hydration process time goes as resist thickness squared; If I remember correctly, 1 micron calls for 5-10 second of exposure to air at normal humidity; 7 micron would be on the order of 5 minutes. The only case when I really had to care was dealing with chemically amplified 25 micron resist. From: labnetwork On Behalf Of Daniel Lloyd Sent: Friday, November 5, 2021 06:18 To: Morrison, Richard H., Jr ; Maduzia, Joseph Walter ; labnetwork at mtl.mit.edu Subject: Re: [labnetwork] PR bubbles where exposed Hi, I?ve seen similar bubbles in the past, but not consistently. While I?m aware that the clean room I have access to is only loosely humidity controlled, what should be an acceptable range. The resist I use doesn?t mention anything. My relaxation time between pre-bake and exposure is typically 1 hour to let the substrates cool, does anyone have a guide to working that out? Thanks, Daniel Lloyd Development Engineer, From: labnetwork > On Behalf Of Morrison, Richard H., Jr Sent: 04 November 2021 15:45 To: Maduzia, Joseph Walter >; labnetwork at mtl.mit.edu Subject: Re: [labnetwork] PR bubbles where exposed HI, These look like Nitrogen bubbles, how thick is the resist? Is the thickness in the recommended range? We have this issue when the humidity is out of control, we solved the issue by reducing the thickness, to be in the recommended range and changing the prebake per advice form the resist supplier. Rick Richard Morrison PMTS Draper Laboratory 555 Technology Square Cambridge Ma 02139 Office: 617-258-3420 Cell: 508-930-3461 From: labnetwork > On Behalf Of Maduzia, Joseph Walter Sent: Thursday, November 4, 2021 9:59 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] PR bubbles where exposed Hello All! Thank you again for all your feedback on SiO2 etch around Al. It has been very helpful and we are moving down multiple paths suggested via the Lab Network to try to solve the issue. More to come once we solve it! I have another issue I was hoping for feedback on. We have bubbling in our PR (SPR-220-4.5) (pos tone) that we haven?t been able to track the source of. It only bubbles during exposure and only where it is exposed. Unexposed areas are unaffected. I?ve attached some images of the bubbling where you can see the exposed (lighter) and unexposed (darker) areas. The bubbles are visible to the naked eye. The wafer is silicon w a dry thermally grown SiO2 surface. We typically expose via EV620 mask aligner with Vac+HardContact. However, even in a flood exposure with the mask just set lightly down it still bubbles. Without a mask there are also bubbles randomly distributed across the wafer, but they don?t get stuck to the mask so they don?t pop. We tried various pre-bakes, HMDS coat vs not, piranha treat vs not. In the past these bubbles show up, we trial and error to get rid of them and suddenly they disappear. Our process, although seemingly repeatable, does not yield repeatable results. Thank You, JOE MADUZIA MNMS Laboratory Specialist The Grainger College of Engineering Mechanical Science and Engineering 2239 Sidney Lu Mechanical Engineering Bldg 1206 W. Green Urbana, IL 61801 217.244.6302 | jmaduzi2 at illinois.edu https://cleanroom.mechse.illinois.edu/ [cid:image001.png at 01D7D22E.F98A7BD0] Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure. ________________________________ Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email. ________________________________ -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 4711 bytes Desc: image001.png URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image002.png Type: image/png Size: 82884 bytes Desc: image002.png URL: From michael.martin at louisville.edu Fri Nov 5 10:36:28 2021 From: michael.martin at louisville.edu (Martin,Michael David) Date: Fri, 5 Nov 2021 14:36:28 +0000 Subject: [labnetwork] PR bubbles where exposed In-Reply-To: References: Message-ID: We have used SPR 220 a lot in the past and came to the conclusion that it was just very finicky probably due to requiring just the right bake and hold times as mentioned by others. In the end, most of our users switched to AZ 4620 which is much easier to process and is a nice thick resist with a 12um nominal thickness. Regards, Michael ________________________________ From: labnetwork on behalf of Maduzia, Joseph Walter Sent: Thursday, November 4, 2021 9:59 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] PR bubbles where exposed You don't often get email from jmaduzi2 at illinois.edu. Learn why this is important CAUTION: This email originated from outside of our organization. Do not click links, open attachments, or respond unless you recognize the sender's email address and know the contents are safe. Hello All! Thank you again for all your feedback on SiO2 etch around Al. It has been very helpful and we are moving down multiple paths suggested via the Lab Network to try to solve the issue. More to come once we solve it! I have another issue I was hoping for feedback on. We have bubbling in our PR (SPR-220-4.5) (pos tone) that we haven?t been able to track the source of. It only bubbles during exposure and only where it is exposed. Unexposed areas are unaffected. I?ve attached some images of the bubbling where you can see the exposed (lighter) and unexposed (darker) areas. The bubbles are visible to the naked eye. The wafer is silicon w a dry thermally grown SiO2 surface. We typically expose via EV620 mask aligner with Vac+HardContact. However, even in a flood exposure with the mask just set lightly down it still bubbles. Without a mask there are also bubbles randomly distributed across the wafer, but they don?t get stuck to the mask so they don?t pop. We tried various pre-bakes, HMDS coat vs not, piranha treat vs not. In the past these bubbles show up, we trial and error to get rid of them and suddenly they disappear. Our process, although seemingly repeatable, does not yield repeatable results. Thank You, JOE MADUZIA MNMS Laboratory Specialist The Grainger College of Engineering Mechanical Science and Engineering 2239 Sidney Lu Mechanical Engineering Bldg 1206 W. Green Urbana, IL 61801 217.244.6302 | jmaduzi2 at illinois.edu https://cleanroom.mechse.illinois.edu/ [cid:image001.png at 01D7D156.50D75180] Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 4711 bytes Desc: image001.png URL: From beach at umich.edu Fri Nov 5 12:05:31 2021 From: beach at umich.edu (Katharine Beach) Date: Fri, 5 Nov 2021 12:05:31 -0400 Subject: [labnetwork] PR bubbles where exposed In-Reply-To: References: <6113c23ed2d648b093fa08ca2eae0082@draper.com> Message-ID: At the LNF we have recently started using AZ 12xt. It is a chemically amplified photoresist and doesn't require the wait times of the DNQ resists. So far it's working well and for our users the time savings and repeatability have made it worth the increased cost. We have processes for 10-25um. Katharine On Fri, Nov 5, 2021 at 11:59 AM Michael Yakimov wrote: > Both water and N2 are part of photochemical reaction. > > > https://www.microchemicals.com/technical_information/exposure_photoresist.pdf > > > > Bubbles formed in the resist under exposure are nitrogen. Hydration is > only tangentially related, as lack of moisture calls for longer exposure > times and overexposure of top layers which get hydrated first. I believe N2 > can still be split off without water, but soluble molecule doesn?t form > without H2O. My understanding is that normal resist exposure doesn?t > involve 100% reaction. > > Hydration process time goes as resist thickness squared; If I remember > correctly, 1 micron calls for 5-10 second of exposure to air at normal > humidity; 7 micron would be on the order of 5 minutes. The only case when I > really had to care was dealing with chemically amplified 25 micron resist. > > > > > > > > > > *From:* labnetwork * On Behalf Of *Daniel > Lloyd > *Sent:* Friday, November 5, 2021 06:18 > *To:* Morrison, Richard H., Jr ; Maduzia, Joseph > Walter ; labnetwork at mtl.mit.edu > *Subject:* Re: [labnetwork] PR bubbles where exposed > > > > Hi, > > > > I?ve seen similar bubbles in the past, but not consistently. While I?m > aware that the clean room I have access to is only loosely humidity > controlled, what should be an acceptable range. The resist I use doesn?t > mention anything. My relaxation time between pre-bake and exposure is > typically 1 hour to let the substrates cool, does anyone have a guide to > working that out? > > > > Thanks, > > > > Daniel Lloyd > > Development Engineer, > > > > *From:* labnetwork *On Behalf Of *Morrison, > Richard H., Jr > *Sent:* 04 November 2021 15:45 > *To:* Maduzia, Joseph Walter ; > labnetwork at mtl.mit.edu > *Subject:* Re: [labnetwork] PR bubbles where exposed > > > > HI, > > > > These look like Nitrogen bubbles, how thick is the resist? Is the > thickness in the recommended range? > > > > We have this issue when the humidity is out of control, we solved the > issue by reducing the thickness, to be in the recommended range and > changing the prebake per advice form the resist supplier. > > > > Rick > > > > > > Richard Morrison > > PMTS > > Draper Laboratory > > 555 Technology Square > > Cambridge Ma 02139 > > Office: 617-258-3420 > > Cell: 508-930-3461 > > > > > > > > *From:* labnetwork *On Behalf Of *Maduzia, > Joseph Walter > *Sent:* Thursday, November 4, 2021 9:59 AM > *To:* labnetwork at mtl.mit.edu > *Subject:* [labnetwork] PR bubbles where exposed > > > > Hello All! > > > > Thank you again for all your feedback on SiO2 etch around Al. It has been > very helpful and we are moving down multiple paths suggested via the Lab > Network to try to solve the issue. More to come once we solve it! > > > > I have another issue I was hoping for feedback on. We have bubbling in our > PR (SPR-220-4.5) (pos tone) that we haven?t been able to track the source > of. It only bubbles during exposure and only where it is exposed. Unexposed > areas are unaffected. I?ve attached some images of the bubbling where you > can see the exposed (lighter) and unexposed (darker) areas. The bubbles are > visible to the naked eye. The wafer is silicon w a dry thermally grown SiO2 > surface. We typically expose via EV620 mask aligner with Vac+HardContact. > However, even in a flood exposure with the mask just set lightly down it > still bubbles. Without a mask there are also bubbles randomly distributed > across the wafer, but they don?t get stuck to the mask so they don?t pop. > We tried various pre-bakes, HMDS coat vs not, piranha treat vs not. In the > past these bubbles show up, we trial and error to get rid of them and > suddenly they disappear. Our process, although seemingly repeatable, does > not yield repeatable results. > > > > Thank You, > > *JOE MADUZIA* > *MNMS Laboratory Specialist* > > The Grainger College of Engineering > Mechanical Science and Engineering > > 2239 Sidney Lu Mechanical Engineering Bldg > 1206 W. Green > Urbana, IL 61801 > 217.244.6302 | jmaduzi2 at illinois.edu > > https://cleanroom.mechse.illinois.edu/ > > > > *Under the Illinois Freedom of Information Act any written communication > to or from university employees regarding university business is a public > record and may be subject to public disclosure.* > > > ------------------------------ > > Notice: This email and any attachments may contain proprietary (Draper > non-public) and/or export-controlled information of Draper. If you are not > the intended recipient of this email, please immediately notify the sender > by replying to this email and immediately destroy all copies of this email. > ------------------------------ > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 4711 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image002.png Type: image/png Size: 82884 bytes Desc: not available URL: From vamsinittala at gmail.com Sun Nov 7 15:01:52 2021 From: vamsinittala at gmail.com (N P Vamsi Krishna) Date: Sun, 7 Nov 2021 14:01:52 -0600 Subject: [labnetwork] PR bubbles where exposed In-Reply-To: References: <6113c23ed2d648b093fa08ca2eae0082@draper.com> Message-ID: Hi Joe, I have seen this problem particularly with thick resists like SPR-220 and AZ4620. After spin coating and before the exposure, a wait time of 3-8 hrs helped in getting rid of these problems. Also, this step helps in longer resist survival in the plasma (DRIE etch in particular). Thanks & br, vamsi On Fri, Nov 5, 2021 at 3:03 PM Katharine Beach wrote: > At the LNF we have recently started using AZ 12xt. It is a > chemically amplified photoresist and doesn't require the wait times of the > DNQ resists. So far it's working well and for our users the time savings > and repeatability have made it worth the increased cost. We have processes > for 10-25um. > > Katharine > > On Fri, Nov 5, 2021 at 11:59 AM Michael Yakimov > wrote: > >> Both water and N2 are part of photochemical reaction. >> >> >> https://www.microchemicals.com/technical_information/exposure_photoresist.pdf >> >> >> >> Bubbles formed in the resist under exposure are nitrogen. Hydration is >> only tangentially related, as lack of moisture calls for longer exposure >> times and overexposure of top layers which get hydrated first. I believe N2 >> can still be split off without water, but soluble molecule doesn?t form >> without H2O. My understanding is that normal resist exposure doesn?t >> involve 100% reaction. >> >> Hydration process time goes as resist thickness squared; If I remember >> correctly, 1 micron calls for 5-10 second of exposure to air at normal >> humidity; 7 micron would be on the order of 5 minutes. The only case when I >> really had to care was dealing with chemically amplified 25 micron resist. >> >> >> >> >> >> >> >> >> >> *From:* labnetwork * On Behalf Of *Daniel >> Lloyd >> *Sent:* Friday, November 5, 2021 06:18 >> *To:* Morrison, Richard H., Jr ; Maduzia, Joseph >> Walter ; labnetwork at mtl.mit.edu >> *Subject:* Re: [labnetwork] PR bubbles where exposed >> >> >> >> Hi, >> >> >> >> I?ve seen similar bubbles in the past, but not consistently. While I?m >> aware that the clean room I have access to is only loosely humidity >> controlled, what should be an acceptable range. The resist I use doesn?t >> mention anything. My relaxation time between pre-bake and exposure is >> typically 1 hour to let the substrates cool, does anyone have a guide to >> working that out? >> >> >> >> Thanks, >> >> >> >> Daniel Lloyd >> >> Development Engineer, >> >> >> >> *From:* labnetwork *On Behalf Of *Morrison, >> Richard H., Jr >> *Sent:* 04 November 2021 15:45 >> *To:* Maduzia, Joseph Walter ; >> labnetwork at mtl.mit.edu >> *Subject:* Re: [labnetwork] PR bubbles where exposed >> >> >> >> HI, >> >> >> >> These look like Nitrogen bubbles, how thick is the resist? Is the >> thickness in the recommended range? >> >> >> >> We have this issue when the humidity is out of control, we solved the >> issue by reducing the thickness, to be in the recommended range and >> changing the prebake per advice form the resist supplier. >> >> >> >> Rick >> >> >> >> >> >> Richard Morrison >> >> PMTS >> >> Draper Laboratory >> >> 555 Technology Square >> >> Cambridge Ma 02139 >> >> Office: 617-258-3420 >> >> Cell: 508-930-3461 >> >> >> >> >> >> >> >> *From:* labnetwork *On Behalf Of *Maduzia, >> Joseph Walter >> *Sent:* Thursday, November 4, 2021 9:59 AM >> *To:* labnetwork at mtl.mit.edu >> *Subject:* [labnetwork] PR bubbles where exposed >> >> >> >> Hello All! >> >> >> >> Thank you again for all your feedback on SiO2 etch around Al. It has been >> very helpful and we are moving down multiple paths suggested via the Lab >> Network to try to solve the issue. More to come once we solve it! >> >> >> >> I have another issue I was hoping for feedback on. We have bubbling in >> our PR (SPR-220-4.5) (pos tone) that we haven?t been able to track the >> source of. It only bubbles during exposure and only where it is exposed. >> Unexposed areas are unaffected. I?ve attached some images of the bubbling >> where you can see the exposed (lighter) and unexposed (darker) areas. The >> bubbles are visible to the naked eye. The wafer is silicon w a dry >> thermally grown SiO2 surface. We typically expose via EV620 mask aligner >> with Vac+HardContact. However, even in a flood exposure with the mask just >> set lightly down it still bubbles. Without a mask there are also bubbles >> randomly distributed across the wafer, but they don?t get stuck to the mask >> so they don?t pop. We tried various pre-bakes, HMDS coat vs not, piranha >> treat vs not. In the past these bubbles show up, we trial and error to get >> rid of them and suddenly they disappear. Our process, although seemingly >> repeatable, does not yield repeatable results. >> >> >> >> Thank You, >> >> *JOE MADUZIA* >> *MNMS Laboratory Specialist* >> >> The Grainger College of Engineering >> Mechanical Science and Engineering >> >> 2239 Sidney Lu Mechanical Engineering Bldg >> 1206 W. Green >> Urbana, IL 61801 >> 217.244.6302 | jmaduzi2 at illinois.edu >> >> https://cleanroom.mechse.illinois.edu/ >> >> >> >> *Under the Illinois Freedom of Information Act any written communication >> to or from university employees regarding university business is a public >> record and may be subject to public disclosure.* >> >> >> ------------------------------ >> >> Notice: This email and any attachments may contain proprietary (Draper >> non-public) and/or export-controlled information of Draper. If you are not >> the intended recipient of this email, please immediately notify the sender >> by replying to this email and immediately destroy all copies of this email. >> ------------------------------ >> _______________________________________________ >> labnetwork mailing list >> labnetwork at mtl.mit.edu >> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork >> > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -- ___________________________________________________ N.P. Vamsi Krishna, PhD *Staff Scientist* Pritzker School of Molecular Engineering, *The University of Chicago * *Resident **Associate* Center for Nanoscale Materials, *Argonne National Laboratory * Phone: 1 (331) 757-8565 -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 4711 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image002.png Type: image/png Size: 82884 bytes Desc: not available URL: From lopezg at seas.upenn.edu Mon Nov 8 09:35:05 2021 From: lopezg at seas.upenn.edu (Gerald Lopez) Date: Mon, 8 Nov 2021 09:35:05 -0500 Subject: [labnetwork] MAEBL 2021 November 9-10 (hybrid event) In-Reply-To: References: Message-ID: Registration closes today at 5pm EST for MAEBL 2021. All EBL users and tool owners are encouraged to attend our world wide meeting. https://maebl.eventbrite.com We look forward to seeing you there! Gerald G. Lopez, Ph.D. (he/him/his) Director of Business Development University of Pennsylvania Singh Center for Nanotechnology 3205 Walnut Street Philadelphia, PA 19104 https://nano.upenn.edu +1-215-573-4041 On Thu, Nov 4, 2021, 16:14 Price, Aimee wrote: > Hello LabNetwork Colleagues, > > It?s not too late to register > > for MAEBL 2021 > > (Meeting for Advanced Ebeam Lithography). Join the world wide community of > EBL experts and new tool owners/users for a 2-day hybrid event (in person > at The University of Pennsylvania or online in GatherTown). The program is > here > > . > > - Day 1 features the *EBL Foundations Workshop *where experts impart > their working knowledge in nano patterning to next gen e-beamers; students > (and EBL users) are strongly encouraged to attend. > - Day 2 is the *Core Meeting *that covers a wide variety of EBL > related topics from *cost of ownership *to *modeling *to *process > development *and features invited talks from both industry and > academia. > > It's not too late to register: https://maebl.eventbrite.com > > . > > > > I look forward to seeing many of you next week! > > > > Best, > > Aimee Bross Price > > > > President/Co-founder MAEBL > > Inc. > > > > Manager, Nanofabrication > > The Ohio State University > > Nanotech West Lab > > Institute for Materials Research > > 1381 Kinnear Road > > Suite 100 > > Columbus, OH 43212 > > 614-292-2753 > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > > https://urldefense.com/v3/__https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork__;!!IBzWLUs!FW52AKu7tUasIhc9cwSGNWI9ZUSH_spHZ2NCb4E2LyGV0tBXHu1_gdqMZoesKem-Trw$ > -------------- next part -------------- An HTML attachment was scrubbed... URL: From info at fabsurplus.com Sat Nov 6 05:48:03 2021 From: info at fabsurplus.com (Stephen Howe) Date: Sat, 06 Nov 2021 10:48:03 +0100 Subject: [labnetwork] Wall Street Journal Article about the used fab equipment business Message-ID: <69be9cc649f7351a6ea29e0a666d8b663f4e3e49.camel@fabsurplus.com> Here is an article in today's Wall Street Journal about the used fab equipment business which I helped them write.Enjoy !!!! https://www.wsj.com/articles/manufacturing-microchips-the-equipment-that-makes-them-11636149507 Yours sincerely, SDI Fabsurplus Italia SRLStephen HoweCompany Owneremail: info at fabsurplus.comMobile (Italy) : +39 335-710-7756Mobile (USA) : +1 830-388-1071WWW.FABSURPLUS.COMYour Marketplace for Used Semiconductor Equipment -------------- next part -------------- An HTML attachment was scrubbed... URL: From kamal.yadav at gmail.com Mon Nov 8 11:58:35 2021 From: kamal.yadav at gmail.com (Kamal Yadav) Date: Mon, 8 Nov 2021 08:58:35 -0800 Subject: [labnetwork] MAEBL 2021 November 9-10 (hybrid event) In-Reply-To: References: Message-ID: Hi Aimee, Thanks, Will the session be recorded and available after the event? On Thu, Nov 4, 2021 at 1:12 PM Price, Aimee wrote: > Hello LabNetwork Colleagues, > > It?s not too late to register > > for MAEBL 2021 (Meeting for Advanced Ebeam > Lithography). Join the world wide community of EBL experts and new tool > owners/users for a 2-day hybrid event (in person at The University of > Pennsylvania or online in GatherTown). The program is here > > . > > - Day 1 features the *EBL Foundations Workshop *where experts impart > their working knowledge in nano patterning to next gen e-beamers; students > (and EBL users) are strongly encouraged to attend. > - Day 2 is the *Core Meeting *that covers a wide variety of EBL > related topics from *cost of ownership *to *modeling *to *process > development *and features invited talks from both industry and > academia. > > It's not too late to register: https://maebl.eventbrite.com > > . > > > > I look forward to seeing many of you next week! > > > > Best, > > Aimee Bross Price > > > > President/Co-founder MAEBL Inc. > > > > Manager, Nanofabrication > > The Ohio State University > > Nanotech West Lab > > Institute for Materials Research > > 1381 Kinnear Road > > Suite 100 > > Columbus, OH 43212 > > 614-292-2753 > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -- Thanks, Kamal -------------- next part -------------- An HTML attachment was scrubbed... URL: From jdeng at cns.fas.harvard.edu Mon Nov 8 14:31:52 2021 From: jdeng at cns.fas.harvard.edu (Deng, Jiangdong) Date: Mon, 8 Nov 2021 19:31:52 +0000 Subject: [labnetwork] Photolithography engineer position and Postdoc position at CNS of Harvard University Message-ID: Hi, All, There are two openings in in Center for Nanoscale Systems of Harvard University. Attached please find the job descriptions for both positions, 1. Photolithography engineer position. A direct link to the posting can be found here: https://bit.ly/3wbeOQr . ? ?Working under the supervision of the Nanofabrication Facility Manager, this person will provide maintenance, training and research development in photolithography and chemical wet process for nanofabrication. Responsibilities will include, but are not limited to: provide support and maintenance of multiple photolithography tools (mask aligners, steppers, UV exposure systems, resist coaters/developers, pattern design software and computers) with capabilities in i-line and DUV with line/space resolution of 1 um. This person will oversee and lead chemical wet processes development, training and troubleshooting for nanofabrication, including various resist processes, wet etching, sample cleaning, wet process technology expansion, and chemical management in the cleanroom. This individual will also be in charge of advanced patterning characterization with scanning electron microscopy (SEM) for feature patterning and multilayer alignment, as well teaming with members of the Nanofabrication Facility for film deposition projects. Other responsibilities are training new users, ensuring safety practices, authoring SOPs and related documents for the Nanofabrication Facility. Collaboration with all CNS personnel and research group to achieve objectives and enhance service quality is expected... ? 1. Postdoctoral scholar position. Responsibilities: Collaborating with several MGH groups, a full-time postdoctoral research fellow to on the development of novel micro-TMS coils for biomedical applications. Requirements: A candidate must be highly motivated, with a demonstrated excellent research track record in the fields of MEMS device design, nano-/micro- fabrication, and characterization. Independent process skills in nano-fabrication, including E-beam lithography, Photolithography, RIE, film deposition and electron microscopy (EM), as well as experimental and numerical characterizations of material, electrical, and thermal properties, are required. Experience in high currents amplifiers, and non-invasive human experiments is desired but not required. A PhD (or equivalent) in physics, applied physics, electrical engineering, chemical/biomedical engineering, material sciences or a related field is required. Please apply If you are interested in the position, or spread the words around. Thanks! -JD -- Jiangdong Deng (JD), Ph. D Associate Director, Center for Nanoscale Systems Head of Nanofabrication Facility, Harvard University, 11 Oxford St., LISE-G54, Cambridge, MA 02138 Tel: 617-495-3396 -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Photolithography engineer-2021.pdf Type: application/pdf Size: 50589 bytes Desc: Photolithography engineer-2021.pdf URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Post-doc-NIH-uMS project.pdf Type: application/pdf Size: 60717 bytes Desc: Post-doc-NIH-uMS project.pdf URL: From sandra.malhotra at tamu.edu Tue Nov 9 10:18:34 2021 From: sandra.malhotra at tamu.edu (Malhotra, Sandra Guy) Date: Tue, 9 Nov 2021 15:18:34 +0000 Subject: [labnetwork] Seeking cleanroom manufacturers Message-ID: Howdy All! I am looking for recommendations for companies that build semiconductor cleanrooms (modular or raised floor). If you have experience in this area, please reach out. I would appreciate any advice and information you can provide. Thanks in advance! Best, Sandra G. Malhotra, Ph.D. | Technical Lab Manager AggieFab Nanofabrication Facility Department of Electrical & Computer Engineering, College of Engineering | Texas A&M University 3253 TAMU | College Station, TX 77843 ph: 979.845.3199 | sandra.malhotra at tamu.edu - - - - - - - - - - - - - - - - - - - - - - - - TEXAS A&M UNIVERSITY | FEARLESS on Every Front -------------- next part -------------- An HTML attachment was scrubbed... URL: From rlc12 at cornell.edu Tue Nov 9 10:54:54 2021 From: rlc12 at cornell.edu (Rebecca Lee Vliet) Date: Tue, 9 Nov 2021 15:54:54 +0000 Subject: [labnetwork] January 2022 CNF TCN VIRTUAL Short Course - REGISTRATION OPEN! Message-ID: Please post & share the announcement with other members of the scientific communities. Thank you! CNF Technology & Characterization at the Nanoscale (CNF TCN) VIRTUAL Short Course January 19, 2022 - January 21, 2022 The CNF TCN is going virtual for January 2022! The virtual shorts course will be held Wednesday, January 19, 2022 - Friday, January 21, 2022, daily from 11:00am to 4:00pm (EDT). Each day offers lectures and laboratory demonstrations designed to impart a broad understanding of the science and technology required to undertake research in nanoscience. TCN is an ideal way for faculty, students, post docs and staff members to rapidly come up to speed in many of the technologies that users of the CNF need to employ. Members of the high tech business community will also find it an effective way to learn best practices for success in a nanofab environment. Attendance is open to the general scientific community. Note: The short course does not replace the three part training required to become a user of our facility. To become a CNF user, please visit the "Getting Started" link (https:cnf.cornell.edu/howto) on the CNF website. For more information and to register visit: https://cnf.cornell.edu/education/tcn (Registration deadline, January 10, 2022) -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Announcement_January2022_EMAIL.jpg Type: image/jpeg Size: 205208 bytes Desc: Announcement_January2022_EMAIL.jpg URL: From jt4292 at nyu.edu Tue Nov 9 16:08:10 2021 From: jt4292 at nyu.edu (Jacob Trevino) Date: Tue, 9 Nov 2021 16:08:10 -0500 Subject: [labnetwork] Seeking cleanroom manufacturers In-Reply-To: References: Message-ID: Hi Sandra, I've worked with AdvancedTEC (https://www.advancetecllc.com/), based out of Richmond, VA, on multiple cleanroom projects over the years and can't recommend them enough. If you need more information or want to chat about my experiences with them, I'm more than happy to discuss. Good luck with the project! _____________________________ *Jacob Trevino, PhD* Nanofabrication Cleanroom & Shared Instrumentation Facilities Director Tandon School of Engineering New York University 6 MetroTech Center, Rogers Hall 821-B Brooklyn, NY 11201 *Email:* jacob.trevino at nyu.edu *Phone:* 646-997-3506 On Tue, Nov 9, 2021 at 1:06 PM Malhotra, Sandra Guy < sandra.malhotra at tamu.edu> wrote: > Howdy All! I am looking for recommendations for companies that build > semiconductor cleanrooms (modular or raised floor). If you have experience > in this area, please reach out. I would appreciate any advice and > information you can provide. Thanks in advance! > > Best, > > *Sandra G. Malhotra, Ph.D.* | Technical Lab Manager > > AggieFab Nanofabrication Facility > Department of Electrical & Computer Engineering, College of Engineering | > Texas A&M University > 3253 TAMU | College Station, TX 77843 > ph: 979.845.3199 | s andra.malhotra at tamu.edu > - - - - - - - - - - - - - - - - - - - - - - - - > *TEXAS A&M UNIVERSITY* | FEARLESS on Every Front > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > > https://urldefense.proofpoint.com/v2/url?u=https-3A__mtl.mit.edu_mailman_listinfo.cgi_labnetwork&d=DwICAg&c=slrrB7dE8n7gBJbeO0g-IQ&r=AheFLqWO_-F7qywgfmAxxg&m=N8GfiZsAN3Bk6IWnPtn_lUIBOXv94tKL1560NfT_HfTqRQDRDENSjqmMJpOuE67s&s=CEyMcT7Iy-YzC7S0j6hAApsel7rXtWC-JrcQ217kwd0&e= > -------------- next part -------------- An HTML attachment was scrubbed... URL: From sandra.malhotra at tamu.edu Tue Nov 9 16:47:34 2021 From: sandra.malhotra at tamu.edu (Malhotra, Sandra Guy) Date: Tue, 9 Nov 2021 21:47:34 +0000 Subject: [labnetwork] Seeking cleanroom manufacturers In-Reply-To: References: Message-ID: Thank you very much, Jacob! This is very helpful. At this point, we're looking for back-of-the-envelope numbers for a proposal. If this should come to pass, I may take you up on the offer to learn more about AdvancedTEC. Have a great evening, Sandra G. Malhotra, Ph.D. | Technical Lab Manager AggieFab Nanofabrication Facility Department of Electrical & Computer Engineering, College of Engineering | Texas A&M University 3253 TAMU | College Station, TX 77843 ph: 979.845.3199 | sandra.malhotra at tamu.edu - - - - - - - - - - - - - - - - - - - - - - - - TEXAS A&M UNIVERSITY | FEARLESS on Every Front ________________________________ From: Jacob Trevino Sent: Tuesday, November 9, 2021 3:08 PM To: Malhotra, Sandra Guy Cc: Fab Network Subject: Re: [labnetwork] Seeking cleanroom manufacturers Hi Sandra, I've worked with AdvancedTEC (https://www.advancetecllc.com/), based out of Richmond, VA, on multiple cleanroom projects over the years and can't recommend them enough. If you need more information or want to chat about my ZjQcmQRYFpfptBannerStart This Message Is From an External Sender This message came from outside your organization. ZjQcmQRYFpfptBannerEnd Hi Sandra, I've worked with AdvancedTEC (https://www.advancetecllc.com/), based out of Richmond, VA, on multiple cleanroom projects over the years and can't recommend them enough. If you need more information or want to chat about my experiences with them, I'm more than happy to discuss. Good luck with the project! _____________________________ Jacob Trevino, PhD Nanofabrication Cleanroom & Shared Instrumentation Facilities Director Tandon School of Engineering New York University 6 MetroTech Center, Rogers Hall 821-B Brooklyn, NY 11201 Email: jacob.trevino at nyu.edu Phone: 646-997-3506 On Tue, Nov 9, 2021 at 1:06 PM Malhotra, Sandra Guy > wrote: Howdy All! I am looking for recommendations for companies that build semiconductor cleanrooms (modular or raised floor). If you have experience in this area, please reach out. I would appreciate any advice and information you can provide. Thanks in advance! Best, Sandra G. Malhotra, Ph.D. | Technical Lab Manager AggieFab Nanofabrication Facility Department of Electrical & Computer Engineering, College of Engineering | Texas A&M University 3253 TAMU | College Station, TX 77843 ph: 979.845.3199 | sandra.malhotra at tamu.edu - - - - - - - - - - - - - - - - - - - - - - - - TEXAS A&M UNIVERSITY | FEARLESS on Every Front _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://urldefense.proofpoint.com/v2/url?u=https-3A__mtl.mit.edu_mailman_listinfo.cgi_labnetwork&d=DwICAg&c=slrrB7dE8n7gBJbeO0g-IQ&r=AheFLqWO_-F7qywgfmAxxg&m=N8GfiZsAN3Bk6IWnPtn_lUIBOXv94tKL1560NfT_HfTqRQDRDENSjqmMJpOuE67s&s=CEyMcT7Iy-YzC7S0j6hAApsel7rXtWC-JrcQ217kwd0&e= -------------- next part -------------- An HTML attachment was scrubbed... URL: From beaudoin at physics.ubc.ca Tue Nov 9 17:00:38 2021 From: beaudoin at physics.ubc.ca (Beaudoin, Mario) Date: Tue, 9 Nov 2021 14:00:38 -0800 Subject: [labnetwork] Seeking cleanroom manufacturers In-Reply-To: References: Message-ID: <21b7b081-adab-abe2-bf25-6e3f7f326f97@physics.ubc.ca> We had our new cleanroom built by M?cart: * https://mecart.com/fr/ We're happy with it so far. Mario On 2021-11-09 1:47 p.m., Malhotra, Sandra Guy wrote: > [*CAUTION:* Non-UBC Email] > > Thank you very much, Jacob! This is very helpful. At this point, we're > looking for back-of-the-envelope numbers for a proposal. If this > should come to pass, I may take you up on the offer to learn more > about AdvancedTEC. > > Have a great evening, > > *Sandra G. Malhotra, Ph.D.*? |? Technical Lab Manager > > AggieFab Nanofabrication Facility > Department of Electrical & Computer Engineering, College of > Engineering | Texas?A&M University > 3253 TAMU | College Station, TX?77843 > ph: 979.845.3199? | s andra.malhotra at tamu.edu > - - - - - - - - - - - - - - - - - - - - - - - - > *TEXAS A&M UNIVERSITY*?| FEARLESS on Every Front > > > ------------------------------------------------------------------------ > *From:* Jacob Trevino > *Sent:* Tuesday, November 9, 2021 3:08 PM > *To:* Malhotra, Sandra Guy > *Cc:* Fab Network > *Subject:* Re: [labnetwork] Seeking cleanroom manufacturers > Hi Sandra, I've worked with AdvancedTEC > (https://www.advancetecllc.com/), based out of Richmond, VA, on > multiple cleanroom projects over the years and can't recommend them > enough. If you need more information or want to chat about my > ZjQcmQRYFpfptBannerStart > This Message Is From an External Sender > This message came from outside your organization. > ZjQcmQRYFpfptBannerEnd > Hi Sandra, > > I've worked with AdvancedTEC (https://www.advancetecllc.com/ > ), > based out of Richmond, VA, on multiple cleanroom projects over the > years and can't recommend them enough. If you need more information or > want to chat about my experiences with them, I'm more than happy to > discuss. Good luck with the project! > > _____________________________ > *Jacob Trevino, PhD* > Nanofabrication Cleanroom & Shared Instrumentation Facilities Director > Tandon School of Engineering > New York University > 6 MetroTech Center, Rogers Hall 821-B > Brooklyn, NY 11201 > *Email:* jacob.trevino at nyu.edu > *Phone:* 646-997-3506 > > On Tue, Nov 9, 2021 at 1:06 PM Malhotra, Sandra Guy > wrote: > > Howdy All! I am looking for recommendations for companies that > build semiconductor cleanrooms (modular or raised floor). If you > have experience in this area, please reach out. I would appreciate > any advice and information you can provide. Thanks in advance! > > Best, > > *Sandra G. Malhotra, Ph.D.*|? Technical Lab Manager > > AggieFab Nanofabrication Facility > Department of Electrical & Computer Engineering, College of > Engineering | Texas?A&M University > 3253 TAMU | College Station, TX?77843 > ph: 979.845.3199? | s > andra.malhotra at tamu.edu > - - - - - - - - - - - - - - - - - - - - - - - - > *TEXAS A&M UNIVERSITY*?| FEARLESS on Every Front > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://urldefense.proofpoint.com/v2/url?u=https-3A__mtl.mit.edu_mailman_listinfo.cgi_labnetwork&d=DwICAg&c=slrrB7dE8n7gBJbeO0g-IQ&r=AheFLqWO_-F7qywgfmAxxg&m=N8GfiZsAN3Bk6IWnPtn_lUIBOXv94tKL1560NfT_HfTqRQDRDENSjqmMJpOuE67s&s=CEyMcT7Iy-YzC7S0j6hAApsel7rXtWC-JrcQ217kwd0&e= > > > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -- -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Mario%20Beaudoin%20SBQMI%20sig%202.jpg Type: image/jpeg Size: 21446 bytes Desc: not available URL: From julia.aebersold at louisville.edu Tue Nov 9 17:08:01 2021 From: julia.aebersold at louisville.edu (Aebersold,Julia W.) Date: Tue, 9 Nov 2021 22:08:01 +0000 Subject: [labnetwork] Seeking cleanroom manufacturers In-Reply-To: References: Message-ID: Reach out to Abbie Gregg. They can help you locate suitable contractors to build your cleanroom. They also design cleanrooms. Cheers! Julia Aebersold, Ph.D. Manager, Micro/Nano Technology Center Shumaker Research Building, Room 233 2210 South Brook Street Louisville,KY 40208 louisville.edu/micronano ________________________________ From: labnetwork on behalf of Malhotra, Sandra Guy Sent: Tuesday, November 9, 2021 4:47:34 PM To: Jacob Trevino Cc: Fab Network Subject: Re: [labnetwork] Seeking cleanroom manufacturers CAUTION: This email originated from outside of our organization. Do not click links, open attachments, or respond unless you recognize the sender's email address and know the contents are safe. Thank you very much, Jacob! This is very helpful. At this point, we're looking for back-of-the-envelope numbers for a proposal. If this should come to pass, I may take you up on the offer to learn more about AdvancedTEC. Have a great evening, Sandra G. Malhotra, Ph.D. | Technical Lab Manager AggieFab Nanofabrication Facility Department of Electrical & Computer Engineering, College of Engineering | Texas A&M University 3253 TAMU | College Station, TX 77843 ph: 979.845.3199 | sandra.malhotra at tamu.edu - - - - - - - - - - - - - - - - - - - - - - - - TEXAS A&M UNIVERSITY | FEARLESS on Every Front ________________________________ From: Jacob Trevino Sent: Tuesday, November 9, 2021 3:08 PM To: Malhotra, Sandra Guy Cc: Fab Network Subject: Re: [labnetwork] Seeking cleanroom manufacturers Hi Sandra, I've worked with AdvancedTEC (https://www.advancetecllc.com/), based out of Richmond, VA, on multiple cleanroom projects over the years and can't recommend them enough. If you need more information or want to chat about my ZjQcmQRYFpfptBannerStart This Message Is From an External Sender This message came from outside your organization. ZjQcmQRYFpfptBannerEnd Hi Sandra, I've worked with AdvancedTEC (https://www.advancetecllc.com/), based out of Richmond, VA, on multiple cleanroom projects over the years and can't recommend them enough. If you need more information or want to chat about my experiences with them, I'm more than happy to discuss. Good luck with the project! _____________________________ Jacob Trevino, PhD Nanofabrication Cleanroom & Shared Instrumentation Facilities Director Tandon School of Engineering New York University 6 MetroTech Center, Rogers Hall 821-B Brooklyn, NY 11201 Email: jacob.trevino at nyu.edu Phone: 646-997-3506 On Tue, Nov 9, 2021 at 1:06 PM Malhotra, Sandra Guy > wrote: Howdy All! I am looking for recommendations for companies that build semiconductor cleanrooms (modular or raised floor). If you have experience in this area, please reach out. I would appreciate any advice and information you can provide. Thanks in advance! Best, Sandra G. Malhotra, Ph.D. | Technical Lab Manager AggieFab Nanofabrication Facility Department of Electrical & Computer Engineering, College of Engineering | Texas A&M University 3253 TAMU | College Station, TX 77843 ph: 979.845.3199 | sandra.malhotra at tamu.edu - - - - - - - - - - - - - - - - - - - - - - - - TEXAS A&M UNIVERSITY | FEARLESS on Every Front _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://urldefense.proofpoint.com/v2/url?u=https-3A__mtl.mit.edu_mailman_listinfo.cgi_labnetwork&d=DwICAg&c=slrrB7dE8n7gBJbeO0g-IQ&r=AheFLqWO_-F7qywgfmAxxg&m=N8GfiZsAN3Bk6IWnPtn_lUIBOXv94tKL1560NfT_HfTqRQDRDENSjqmMJpOuE67s&s=CEyMcT7Iy-YzC7S0j6hAApsel7rXtWC-JrcQ217kwd0&e= -------------- next part -------------- An HTML attachment was scrubbed... URL: From gilheart at rice.edu Tue Nov 9 19:54:21 2021 From: gilheart at rice.edu (Tim Gilheart) Date: Tue, 9 Nov 2021 18:54:21 -0600 Subject: [labnetwork] Seeking cleanroom manufacturers In-Reply-To: References: Message-ID: <155AA596-8710-4B45-9011-A1FE9D7672FA@rice.edu> Hi Sandra, At Rice, we have relied on Bob Barbour and his team at Controlled Environments Group here in Houston. We?ve had nothing but excellent experiences working with them: Bob Barbour Controlled Environments Group 18128 Kieth Harrow Blvd, Ste C Houston, Tx 77084 bbarbour at ce-grp.com o: 281-859-5999 c: 281-381-8974 www.ce-grp.com Bonus: they are close to your location at TAMU. Best of luck with the project, -- Tim Gilheart, Ph.D. Research Scientist - Nanofabrication Cleanroom Manager, Shared Equipment Authority (SEA), Rice University Cell: 832-341-5488 | Office: 713-348-3159 | gilheart at rice.edu > On Nov 9, 2021, at 9:18 AM, Malhotra, Sandra Guy wrote: > > Howdy All! I am looking for recommendations for companies that build semiconductor cleanrooms (modular or raised floor). If you have experience in this area, please reach out. I would appreciate any advice and information you can provide. Thanks in advance! > > Best, > > Sandra G. Malhotra, Ph.D. | Technical Lab Manager > AggieFab Nanofabrication Facility > Department of Electrical & Computer Engineering, College of Engineering | Texas A&M University > 3253 TAMU | College Station, TX 77843 > ph: 979.845.3199 | s andra.malhotra at tamu.edu > - - - - - - - - - - - - - - - - - - - - - - - - > TEXAS A&M UNIVERSITY | FEARLESS on Every Front > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From gilheart at rice.edu Tue Nov 9 19:59:45 2021 From: gilheart at rice.edu (Tim Gilheart) Date: Tue, 9 Nov 2021 18:59:45 -0600 Subject: [labnetwork] Seeking cleanroom manufacturers In-Reply-To: References: Message-ID: <1442E9F5-2151-42B6-B6A6-B16125C6E3D1@rice.edu> Also, seconding what Julia just said - we also worked with Abbie and her team on our facility. -- Tim Gilheart, Ph.D. Research Scientist - Nanofabrication Cleanroom Manager, Shared Equipment Authority (SEA), Rice University Cell: 832-341-5488 | Office: 713-348-3159 | gilheart at rice.edu > On Nov 9, 2021, at 4:08 PM, Aebersold,Julia W. wrote: > > Reach out to Abbie Gregg. They can help you locate suitable contractors to build your cleanroom. They also design cleanrooms. > > Cheers! > > Julia Aebersold, Ph.D. > Manager, Micro/Nano Technology Center > Shumaker Research Building, Room 233 > 2210 South Brook Street > Louisville,KY 40208 > > louisville.edu/micronano > From: labnetwork > on behalf of Malhotra, Sandra Guy > > Sent: Tuesday, November 9, 2021 4:47:34 PM > To: Jacob Trevino > > Cc: Fab Network > > Subject: Re: [labnetwork] Seeking cleanroom manufacturers > > CAUTION: This email originated from outside of our organization. Do not click links, open attachments, or respond unless you recognize the sender's email address and know the contents are safe. > Thank you very much, Jacob! This is very helpful. At this point, we're looking for back-of-the-envelope numbers for a proposal. If this should come to pass, I may take you up on the offer to learn more about AdvancedTEC. > > Have a great evening, > > Sandra G. Malhotra, Ph.D. | Technical Lab Manager > AggieFab Nanofabrication Facility > Department of Electrical & Computer Engineering, College of Engineering | Texas A&M University > 3253 TAMU | College Station, TX 77843 > ph: 979.845.3199 | s andra.malhotra at tamu.edu > - - - - - - - - - - - - - - - - - - - - - - - - > TEXAS A&M UNIVERSITY | FEARLESS on Every Front > > From: Jacob Trevino > Sent: Tuesday, November 9, 2021 3:08 PM > To: Malhotra, Sandra Guy > Cc: Fab Network > Subject: Re: [labnetwork] Seeking cleanroom manufacturers > > This Message Is From an External Sender > This message came from outside your organization. > Hi Sandra, > > I've worked with AdvancedTEC (https://www.advancetecllc.com/ ), based out of Richmond, VA, on multiple cleanroom projects over the years and can't recommend them enough. If you need more information or want to chat about my experiences with them, I'm more than happy to discuss. Good luck with the project! > > _____________________________ > Jacob Trevino, PhD > Nanofabrication Cleanroom & Shared Instrumentation Facilities Director > Tandon School of Engineering > New York University > 6 MetroTech Center, Rogers Hall 821-B > Brooklyn, NY 11201 > Email: jacob.trevino at nyu.edu > Phone: 646-997-3506 > > On Tue, Nov 9, 2021 at 1:06 PM Malhotra, Sandra Guy > wrote: > Howdy All! I am looking for recommendations for companies that build semiconductor cleanrooms (modular or raised floor). If you have experience in this area, please reach out. I would appreciate any advice and information you can provide. Thanks in advance! > > Best, > > Sandra G. Malhotra, Ph.D. | Technical Lab Manager > AggieFab Nanofabrication Facility > Department of Electrical & Computer Engineering, College of Engineering | Texas A&M University > 3253 TAMU | College Station, TX 77843 > ph: 979.845.3199 | s andra.malhotra at tamu.edu > - - - - - - - - - - - - - - - - - - - - - - - - > TEXAS A&M UNIVERSITY | FEARLESS on Every Front > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://urldefense.proofpoint.com/v2/url?u=https-3A__mtl.mit.edu_mailman_listinfo.cgi_labnetwork&d=DwICAg&c=slrrB7dE8n7gBJbeO0g-IQ&r=AheFLqWO_-F7qywgfmAxxg&m=N8GfiZsAN3Bk6IWnPtn_lUIBOXv94tKL1560NfT_HfTqRQDRDENSjqmMJpOuE67s&s=CEyMcT7Iy-YzC7S0j6hAApsel7rXtWC-JrcQ217kwd0&e= > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From ahad.syed at kaust.edu.sa Wed Nov 10 00:04:36 2021 From: ahad.syed at kaust.edu.sa (Ahad Syed) Date: Wed, 10 Nov 2021 05:04:36 +0000 Subject: [labnetwork] Seeking cleanroom manufacturers In-Reply-To: References: Message-ID: <1636520676002.72902@kaust.edu.sa> Abbie Gregg! They did a fantastic job at KAUST. Below are the contact details. [cid:b70ae8b7-f5b7-4c50-873b-96c42ad523cc]? -- Nanofabrication Core Lab 4700 King Abdullah University of Science and Technology 0253 Building 3, Thuwal 23955-6900, Kingdom of Saudi Arabia Tel:+966 12 808 2348 Visit The Core Labs ________________________________ From: labnetwork on behalf of Malhotra, Sandra Guy Sent: Tuesday, November 9, 2021 6:18 PM To: Fab Network Subject: [labnetwork] Seeking cleanroom manufacturers Howdy All! I am looking for recommendations for companies that build semiconductor cleanrooms (modular or raised floor). If you have experience in this area, please reach out. I would appreciate any advice and information you can provide. Thanks in advance! Best, Sandra G. Malhotra, Ph.D. | Technical Lab Manager AggieFab Nanofabrication Facility Department of Electrical & Computer Engineering, College of Engineering | Texas A&M University 3253 TAMU | College Station, TX 77843 ph: 979.845.3199 | sandra.malhotra at tamu.edu - - - - - - - - - - - - - - - - - - - - - - - - TEXAS A&M UNIVERSITY | FEARLESS on Every Front -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: pastedImage.png Type: image/png Size: 32032 bytes Desc: pastedImage.png URL: From sandra.malhotra at tamu.edu Wed Nov 10 14:42:15 2021 From: sandra.malhotra at tamu.edu (Malhotra, Sandra Guy) Date: Wed, 10 Nov 2021 19:42:15 +0000 Subject: [labnetwork] Who built your academic fab? Message-ID: Howdy All, Thank you all very much for the helpful referrals for nanofab designers and builders. We'd like to ask this question in a different way as well. For those of you working in academic nanofab facilities that are up to 10 years old, who built it for you? I have this answer for several places already, and it would be great to gather a bit more information along these lines. Thanks in advance for your time in answering my questions! Best, Sandra G. Malhotra, Ph.D. | Technical Lab Manager AggieFab Nanofabrication Facility Department of Electrical & Computer Engineering, College of Engineering | Texas A&M University 3253 TAMU | College Station, TX 77843 ph: 979.845.3199 | sandra.malhotra at tamu.edu - - - - - - - - - - - - - - - - - - - - - - - - TEXAS A&M UNIVERSITY | FEARLESS on Every Front -------------- next part -------------- An HTML attachment was scrubbed... URL: From jdeng at cns.fas.harvard.edu Wed Nov 10 15:48:59 2021 From: jdeng at cns.fas.harvard.edu (Deng, Jiangdong) Date: Wed, 10 Nov 2021 20:48:59 +0000 Subject: [labnetwork] Who built your academic fab? Message-ID: <69C98475-DAF7-4FDA-87B6-9462DE8AAB33@cns.fas.harvard.edu> Abbie Gregg and her team built our cleanroom in 2005. -JD -- Jiangdong Deng (JD), Ph. D Associate Director, Center for Nanoscale Systems Head of Nanofabrication Facility, Harvard University, 11 Oxford St., LISE-G54, Cambridge, MA 02138 Tel: 617-495-3396 From: labnetwork on behalf of "Malhotra, Sandra Guy" Date: Wednesday, November 10, 2021 at 3:41 PM To: "labnetwork at mtl. Network" Subject: [labnetwork] Who built your academic fab? Howdy All, Thank you all very much for the helpful referrals for nanofab designers and builders. We'd like to ask this question in a different way as well. For those of you working in academic nanofab facilities that are up to 10 years old, who built it for you? I have this answer for several places already, and it would be great to gather a bit more information along these lines. Thanks in advance for your time in answering my questions! Best, Sandra G. Malhotra, Ph.D. | Technical Lab Manager AggieFab Nanofabrication Facility Department of Electrical & Computer Engineering, College of Engineering | Texas A&M University 3253 TAMU | College Station, TX 77843 ph: 979.845.3199 | sandra.malhotra at tamu.edu - - - - - - - - - - - - - - - - - - - - - - - - TEXAS A&M UNIVERSITY | FEARLESS on Every Front -------------- next part -------------- An HTML attachment was scrubbed... URL: From agregg at amts.com Thu Nov 11 11:12:55 2021 From: agregg at amts.com (Abbie Gregg) Date: Thu, 11 Nov 2021 16:12:55 +0000 Subject: [labnetwork] Seeking cleanroom manufacturers In-Reply-To: <1636520676002.72902@kaust.edu.sa> References: <1636520676002.72902@kaust.edu.sa> Message-ID: Thank you ! Happy to help wherever we can be of service! Abbie Gregg Chief Technology Officer Cell: (480) 577-5083 Email: agregg at amts.com AM Technical Solutions, 1501 West Fountainhead Parkway, Suite 130 ,Tempe, AZ 85282 [cid:image001.png at 01D7D6DC.4F097CD0] Please check out the full range of our services at: Facebook | Twitter | LinkedIn | www.amts.com CONFIDENTIALITY NOTICE: All information contained in or attached to this email constitutes confidential information belonging to AM Technical Solutions, Inc., its affiliates and subsidiaries and/or its clients. This email and any attachments are proprietary and/or confidential and are intended for business use of the addressee(s) only. All other uses or disclosures are strictly prohibited. If the reader is not the intended recipient you are hereby notified that the perusal, copying or dissemination of this email is strictly prohibited. If you have received this communication in error, please notify the sender, and delete all copies of this message and its attachments immediately. . From: labnetwork On Behalf Of Ahad Syed Sent: Tuesday, November 9, 2021 10:05 PM To: Malhotra, Sandra Guy ; Fab Network Subject: Re: [labnetwork] Seeking cleanroom manufacturers You don't often get email from ahad.syed at kaust.edu.sa. Learn why this is important Abbie Gregg! They did a fantastic job at KAUST. Below are the contact details. [cid:image002.png at 01D7D6DC.4F097CD0]? -- Nanofabrication Core Lab 4700 King Abdullah University of Science and Technology 0253 Building 3, Thuwal 23955-6900, Kingdom of Saudi Arabia Tel:+966 12 808 2348 Visit The Core Labs ________________________________ From: labnetwork > on behalf of Malhotra, Sandra Guy > Sent: Tuesday, November 9, 2021 6:18 PM To: Fab Network Subject: [labnetwork] Seeking cleanroom manufacturers Howdy All! I am looking for recommendations for companies that build semiconductor cleanrooms (modular or raised floor). If you have experience in this area, please reach out. I would appreciate any advice and information you can provide. Thanks in advance! Best, Sandra G. Malhotra, Ph.D. | Technical Lab Manager AggieFab Nanofabrication Facility Department of Electrical & Computer Engineering, College of Engineering | Texas A&M University 3253 TAMU | College Station, TX 77843 ph: 979.845.3199 | sandra.malhotra at tamu.edu - - - - - - - - - - - - - - - - - - - - - - - - TEXAS A&M UNIVERSITY | FEARLESS on Every Front -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 7737 bytes Desc: image001.png URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image002.png Type: image/png Size: 32032 bytes Desc: image002.png URL: From agregg at amts.com Thu Nov 11 11:14:42 2021 From: agregg at amts.com (Abbie Gregg) Date: Thu, 11 Nov 2021 16:14:42 +0000 Subject: [labnetwork] Seeking cleanroom manufacturers In-Reply-To: <155AA596-8710-4B45-9011-A1FE9D7672FA@rice.edu> References: <155AA596-8710-4B45-9011-A1FE9D7672FA@rice.edu> Message-ID: Thank you Tim, AMTS provided the design and the actual architectural cleanroom construction on the Rice Cleanroom. Bob Barbour supervised the entire construction project! Abbie Gregg Chief Technology Officer Cell: (480) 577-5083 Email: agregg at amts.com AM Technical Solutions, 1501 West Fountainhead Parkway, Suite 130 ,Tempe, AZ 85282 [cid:image001.png at 01D7D6DC.8F1FBCD0] Please check out the full range of our services at: Facebook | Twitter | LinkedIn | www.amts.com CONFIDENTIALITY NOTICE: All information contained in or attached to this email constitutes confidential information belonging to AM Technical Solutions, Inc., its affiliates and subsidiaries and/or its clients. This email and any attachments are proprietary and/or confidential and are intended for business use of the addressee(s) only. All other uses or disclosures are strictly prohibited. If the reader is not the intended recipient you are hereby notified that the perusal, copying or dissemination of this email is strictly prohibited. If you have received this communication in error, please notify the sender, and delete all copies of this message and its attachments immediately. . From: labnetwork On Behalf Of Tim Gilheart Sent: Tuesday, November 9, 2021 5:54 PM To: Malhotra, Sandra Guy Cc: Fab Network Subject: Re: [labnetwork] Seeking cleanroom manufacturers Hi Sandra, At Rice, we have relied on Bob Barbour and his team at Controlled Environments Group here in Houston. We've had nothing but excellent experiences working with them: Bob Barbour Controlled Environments Group 18128 Kieth Harrow Blvd, Ste C Houston, Tx 77084 bbarbour at ce-grp.com o: 281-859-5999 c: 281-381-8974 www.ce-grp.com Bonus: they are close to your location at TAMU. Best of luck with the project, -- Tim Gilheart, Ph.D. Research Scientist - Nanofabrication Cleanroom Manager, Shared Equipment Authority (SEA), Rice University Cell: 832-341-5488 | Office: 713-348-3159 | gilheart at rice.edu On Nov 9, 2021, at 9:18 AM, Malhotra, Sandra Guy > wrote: Howdy All! I am looking for recommendations for companies that build semiconductor cleanrooms (modular or raised floor). If you have experience in this area, please reach out. I would appreciate any advice and information you can provide. Thanks in advance! Best, Sandra G. Malhotra, Ph.D. | Technical Lab Manager AggieFab Nanofabrication Facility Department of Electrical & Computer Engineering, College of Engineering | Texas A&M University 3253 TAMU | College Station, TX 77843 ph: 979.845.3199 | sandra.malhotra at tamu.edu - - - - - - - - - - - - - - - - - - - - - - - - TEXAS A&M UNIVERSITY | FEARLESS on Every Front _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 7737 bytes Desc: image001.png URL: From kmcpeak at lsu.edu Thu Nov 11 17:46:27 2021 From: kmcpeak at lsu.edu (Kevin M McPeak) Date: Thu, 11 Nov 2021 22:46:27 +0000 Subject: [labnetwork] Software and drivers for K&S 7100-4D Dicing Saw Message-ID: Dear Colleagues, The LSU nanofabrication facility is getting a K&S 7100-4D Dicing Saw from the DOE equipment donation program. Unfortunately, the DOE is removing the hard drive per their privacy rules. I have reached out to KNS by phone and email but so far I have not had any luck getting a response. Do you any of you have a good contact at KNS that I could ask about getting software and drivers for this tool? Thanks! Regards, Kevin -- Kevin M. McPeak Associate Professor | LSU Dept. of Chemical Engineering 225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication From shimonel at savion.huji.ac.il Fri Nov 12 01:01:08 2021 From: shimonel at savion.huji.ac.il (Shimon Eliav) Date: Fri, 12 Nov 2021 06:01:08 +0000 Subject: [labnetwork] Software and drivers for K&S 7100-4D Dicing Saw In-Reply-To: References: Message-ID: Hi Kevin, As far as I know K&S became ADT some twenty years ago. We have good contacts with ADT Israel. We can put you in contact with them. Some years ago we exchanged the computer and software of our ADT 7100 Dicing system. We kept the old computer just to be in the safe side, but after years of stable operation with the new software/hardware we have no need of it anymore. If you want we can donate it. Regards, Shimon The Hebrew University of Jerusalem The Unit for Nano Fabrication - UNF ISRAEL -----Original Message----- From: labnetwork [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Kevin M McPeak Sent: Friday, 12 November 2021 0:46 To: labnetwork at mtl.mit.edu Subject: [labnetwork] Software and drivers for K&S 7100-4D Dicing Saw Dear Colleagues, The LSU nanofabrication facility is getting a K&S 7100-4D Dicing Saw from the DOE equipment donation program. Unfortunately, the DOE is removing the hard drive per their privacy rules. I have reached out to KNS by phone and email but so far I have not had any luck getting a response. Do you any of you have a good contact at KNS that I could ask about getting software and drivers for this tool? Thanks! Regards, Kevin -- Kevin M. McPeak Associate Professor | LSU Dept. of Chemical Engineering 225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From kmcpeak at lsu.edu Fri Nov 12 14:48:31 2021 From: kmcpeak at lsu.edu (Kevin M McPeak) Date: Fri, 12 Nov 2021 19:48:31 +0000 Subject: [labnetwork] Software and drivers for K&S 7100-4D Dicing Saw In-Reply-To: References: Message-ID: Dear Shimon, Thank you. I may take you up on that. I am waiting for a quote from ADT (I did get in touch with them) for the hard drive. I will be in touch. Thanks again! Regards, Kevin ________________________________________ From: Shimon Eliav Sent: Friday, November 12, 2021 12:01 AM To: Kevin M McPeak; labnetwork at mtl.mit.edu Subject: RE: Software and drivers for K&S 7100-4D Dicing Saw Hi Kevin, As far as I know K&S became ADT some twenty years ago. We have good contacts with ADT Israel. We can put you in contact with them. Some years ago we exchanged the computer and software of our ADT 7100 Dicing system. We kept the old computer just to be in the safe side, but after years of stable operation with the new software/hardware we have no need of it anymore. If you want we can donate it. Regards, Shimon The Hebrew University of Jerusalem The Unit for Nano Fabrication - UNF ISRAEL -----Original Message----- From: labnetwork [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Kevin M McPeak Sent: Friday, 12 November 2021 0:46 To: labnetwork at mtl.mit.edu Subject: [labnetwork] Software and drivers for K&S 7100-4D Dicing Saw Dear Colleagues, The LSU nanofabrication facility is getting a K&S 7100-4D Dicing Saw from the DOE equipment donation program. Unfortunately, the DOE is removing the hard drive per their privacy rules. I have reached out to KNS by phone and email but so far I have not had any luck getting a response. Do you any of you have a good contact at KNS that I could ask about getting software and drivers for this tool? Thanks! Regards, Kevin -- Kevin M. McPeak Associate Professor | LSU Dept. of Chemical Engineering 225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork From dan at enervibe.co Sun Nov 14 23:42:33 2021 From: dan at enervibe.co (Dan Haronian) Date: Mon, 15 Nov 2021 06:42:33 +0200 Subject: [labnetwork] Mask of Al in HF In-Reply-To: References: Message-ID: Hi, See attached paper referring to the glycerin option. According to this paper, adding 1 or 3 parts of glycerin actually decreases the selectivity. Maybe higher glycerin concentration is required. With best regards, _______________ *Dr. Dan Haronian* CTO and co-founder *m*: (+972) 54 542 1951 | *e*:dan at enervibe.co | *w*: enervibe.co *Mailing address:* 1st floor Barkat building, 1 Golan street, Airport City, Zip code 7019900, ISRAEL On Wed, 3 Nov 2021 at 16:31, Shimon Eliav wrote: > Hi All, > > I found very interesting the discussion around Joe?s question. > > Please find attached the summary of the answers. > > Regards, > > Shimon > > > > *From:* labnetwork [mailto:labnetwork-bounces at mtl.mit.edu] *On Behalf Of *Maduzia, > Joseph Walter > *Sent:* Tuesday, 26 October 2021 23:49 > *To:* labnetwork at mtl.mit.edu > *Subject:* [labnetwork] Mask of Al in HF > > > > Hello, > > > > Does anyone have any suggestions for mask materials to protect Al in HF > 49% for SiO2 removal in SOI wafer? The device is SOI, ICP DRIE etched to > glass, HF etch to undercut and free devices, but have Al contact pads and > AL is dep?d first. Typically we use PR as pattern mask, but the Al is > etching behind the PR. In this case the Al is deposited first, so although > order of operations change might help, it?s not a good option atm. > > > Thank you for any suggestions you might have! > > *JOE MADUZIA* > *MNMS Laboratory Specialist* > > The Grainger College of Engineering > Mechanical Science and Engineering > > 2239 Sidney Lu Mechanical Engineering Bldg > 1206 W. Green > Urbana, IL 61801 > 217.244.6302 | jmaduzi2 at illinois.edu > > https://cleanroom.mechse.illinois.edu/ > > > > *Under the Illinois Freedom of Information Act any written communication > to or from university employees regarding university business is a public > record and may be subject to public disclosure.* > > > -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 4711 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Studying_the_Etch_Rates_and_Selectivity_of_SiO2_and_Al_in_BHF_Solutions.pdf Type: application/pdf Size: 670132 bytes Desc: not available URL: From shimonel at savion.huji.ac.il Thu Nov 18 03:07:48 2021 From: shimonel at savion.huji.ac.il (Shimon Eliav) Date: Thu, 18 Nov 2021 08:07:48 +0000 Subject: [labnetwork] Dan Maydan Prize in Nanoscience Research - Call for Proposal 2022 Message-ID: Dear all, Please find below link to the Hebrew University's Center for Nanoscience and Nanotechnology Dan Maydan Prize in Nanoscience Research Call for Proposal 2022. Kindly assist us to distributing the Call among your colleagues. Information about the prize and previous years laureates can be found on our website: https://nano.huji.ac.il/about-award Submission until January 15, 2022 to huj-nano at savion.huji.ac.il Contact person: Noa Gordon-Assayag (Cc). [cid:image002.jpg at 01D7DC64.09183260] Regards, Shimon -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image002.jpg Type: image/jpeg Size: 18172 bytes Desc: image002.jpg URL: From gilheart at rice.edu Mon Nov 22 11:28:25 2021 From: gilheart at rice.edu (Timothy J Gilheart) Date: Mon, 22 Nov 2021 10:28:25 -0600 Subject: [labnetwork] Open position on Rice Nanofabrication Facility (RNF) team In-Reply-To: <6161DF83-F15E-45FB-B5B0-CB8227624C36@rice.edu> References: <6161DF83-F15E-45FB-B5B0-CB8227624C36@rice.edu> Message-ID: <505A24F8-1158-4C80-98A9-515DED2B5FEF@rice.edu> Greetings colleagues, We have an opening on our team for another research scientist to complete our staff of three. More job information and application submission link available here: https://emdz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/656 Details about our facility can be found here: https://research.rice.edu/sea/rice-nanofabrication-facility At Rice, the cleanroom is part of the Shared Equipment Authority (SEA), a larger umbrella organization under the Vice Provost for Research, that administers most shared core labs (electron microscopy, nanofab cleanroom, NMR, mass spec, optical microscopy, XRD, etc) located throughout the university. This position is part of the SEA's collegial team of scientists that support research efforts from the schools of engineering and natural sciences. More information about the SEA can be found on our website: https://sea.rice.edu/ If you know a good candidate, please pass this information along to them. Interested candidates are welcome to contact me directly with any questions. Thanks, -- Tim Gilheart, Ph.D. Research Scientist - Nanofabrication Cleanroom Manager, Shared Equipment Authority (SEA), Rice University Cell: 832-341-5488 | Office: 713-348-3159 | gilheart at rice.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From jmaduzi2 at illinois.edu Tue Nov 23 13:36:09 2021 From: jmaduzi2 at illinois.edu (Maduzia, Joseph Walter) Date: Tue, 23 Nov 2021 18:36:09 +0000 Subject: [labnetwork] Software and drivers for K&S 7100-4D Dicing Saw In-Reply-To: References: Message-ID: Hello Kevin, Jim Machaby has a one person operation near Boston who collects spares and refurbishes used K&S dicing equipment. He also does service calls and will bring a bag full of spare boards or parts he can swap in and out. He can also have parts drop shipped from his shop while he is on site. He's come to UIUC a few times over the years to service our K&S 780 dicing saw. He may not have the parts you need, but it's worth asking. He operates under the business Northeast Semiconductor: http://www.northeastsemiconductor.com/ Thank You, JOE MADUZIA MNMS Laboratory Specialist, Grainger College of Engineering, MechSE, Univ of IL 2239 LuMEB | (P) 217.244.6302 | https://cleanroom.mechse.illinois.edu/ -----Original Message----- From: labnetwork On Behalf Of Kevin M McPeak Sent: Friday, November 12, 2021 1:49 PM To: Shimon Eliav ; labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Software and drivers for K&S 7100-4D Dicing Saw Dear Shimon, Thank you. I may take you up on that. I am waiting for a quote from ADT (I did get in touch with them) for the hard drive. I will be in touch. Thanks again! Regards, Kevin ________________________________________ From: Shimon Eliav Sent: Friday, November 12, 2021 12:01 AM To: Kevin M McPeak; labnetwork at mtl.mit.edu Subject: RE: Software and drivers for K&S 7100-4D Dicing Saw Hi Kevin, As far as I know K&S became ADT some twenty years ago. We have good contacts with ADT Israel. We can put you in contact with them. Some years ago we exchanged the computer and software of our ADT 7100 Dicing system. We kept the old computer just to be in the safe side, but after years of stable operation with the new software/hardware we have no need of it anymore. If you want we can donate it. Regards, Shimon The Hebrew University of Jerusalem The Unit for Nano Fabrication - UNF ISRAEL -----Original Message----- From: labnetwork [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Kevin M McPeak Sent: Friday, 12 November 2021 0:46 To: labnetwork at mtl.mit.edu Subject: [labnetwork] Software and drivers for K&S 7100-4D Dicing Saw Dear Colleagues, The LSU nanofabrication facility is getting a K&S 7100-4D Dicing Saw from the DOE equipment donation program. Unfortunately, the DOE is removing the hard drive per their privacy rules. I have reached out to KNS by phone and email but so far I have not had any luck getting a response. Do you any of you have a good contact at KNS that I could ask about getting software and drivers for this tool? Thanks! Regards, Kevin -- Kevin M. McPeak Associate Professor | LSU Dept. of Chemical Engineering 225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://urldefense.com/v3/__https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork__;!!DZ3fjg!v__Ijt8yoA-AlxKUp5igbu1Y6EOZh4mdKN5loddeiDPdBBDsRyN1v9f2IIDk9_N7JvBX$ _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://urldefense.com/v3/__https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork__;!!DZ3fjg!v__Ijt8yoA-AlxKUp5igbu1Y6EOZh4mdKN5loddeiDPdBBDsRyN1v9f2IIDk9_N7JvBX$ From bothman at engineering.ucsb.edu Tue Nov 23 14:33:00 2021 From: bothman at engineering.ucsb.edu (David Bothman) Date: Tue, 23 Nov 2021 11:33:00 -0800 Subject: [labnetwork] Staff scientist/engineer position at UCSB CNSI Microflidics Lab Message-ID: The California Nanosystems Institute at UC Santa Barbara has an opening for a staff scientist/engineer to manage our Microfluidics Lab and the Innovation Workshop (a makerspace for researchers and campus innovators) Information about the position can be found at https://recruit.ap.ucsb.edu/JPF02044 Dave Bothman -------------- next part -------------- An HTML attachment was scrubbed... URL: From James_Goodman at uml.edu Wed Nov 24 12:34:03 2021 From: James_Goodman at uml.edu (Goodman, James R) Date: Wed, 24 Nov 2021 17:34:03 +0000 Subject: [labnetwork] Jetfirst 200 Message-ID: <7F1CC194-009F-4C54-9E84-D450EBA223DA@uml.edu> Hello all, I have a Jetfirst 200 RTA system that I am having some problems with. I have been working with the vendor and they have been helpful with suggestions for troubleshooting but have not been able or willing to provide electrical schematics. I am popping a couple of breakers when I try to heat the system and really need these schematics to do any significant diagnostic work. Does anyone have these drawings that they would be willing to share? We bought this system used and only have an operations manual. Thanks, Jay. [https://static.uml.edu/email/signature-logo.png] James Goodman ETIC Clean Room Equipment Mgr CORE RESEARCH FACILITY E: James_Goodman at uml.edu T: 978-934-3469 -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 2581 bytes Desc: image001.png URL: From jtmitch5 at ncsu.edu Wed Nov 24 13:00:57 2021 From: jtmitch5 at ncsu.edu (James Mitchell) Date: Wed, 24 Nov 2021 13:00:57 -0500 Subject: [labnetwork] Jetfirst 200 In-Reply-To: <7F1CC194-009F-4C54-9E84-D450EBA223DA@uml.edu> References: <7F1CC194-009F-4C54-9E84-D450EBA223DA@uml.edu> Message-ID: Sounds like a power supply issue but just a guess. Jim On Wed, Nov 24, 2021 at 12:40 PM Goodman, James R wrote: > Hello all, > > I have a Jetfirst 200 RTA system that I am having some problems with. I > have been working with the vendor and they have been helpful with > suggestions for troubleshooting but have not been able or willing to > provide electrical schematics. I am popping a couple of breakers when I try > to heat the system and really need these schematics to do any significant > diagnostic work. Does anyone have these drawings that they would be willing > to share? We bought this system used and only have an operations manual. > > Thanks, Jay. > > > > > > [image: https://static.uml.edu/email/signature-logo.png] > > *James Goodman* > > *ETIC Clean Room Equipment Mgr* > > CORE RESEARCH FACILITY > > *E: *James_Goodman at uml.edu > > *T: *978-934-3469 > > > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -- *James Mitchell* *Specialty Trades Technician* *Dept. of Electrical and Computer Engineering* *NCSU Nanofabrication Facility* *MRC RM243A **Box 7911* *2410 Campus Shore Dr., Raleigh, NC 27606* *jtmitch5 at ncsu.edu* *Desk: 919-515-5394* *Cell: 919-717-7325* -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 2581 bytes Desc: not available URL: From odc1n08 at soton.ac.uk Wed Nov 24 13:20:34 2021 From: odc1n08 at soton.ac.uk (Owain Clark) Date: Wed, 24 Nov 2021 18:20:34 +0000 Subject: [labnetwork] Jetfirst 200 In-Reply-To: <7F1CC194-009F-4C54-9E84-D450EBA223DA@uml.edu> References: <7F1CC194-009F-4C54-9E84-D450EBA223DA@uml.edu> Message-ID: No schematics but we've had a few failures on these over the years and it is usually the thyristor modules which you should be able to replace with off the shelf units. Sometimes they go bang with a good noise. They are not that complicatedly internally with regards to power electronics as I recall.. The PLC drives the thyristor modules on 3 phases, one per bank of lamps either via manually set power or as part of a sensed feedback loop. On the power side I do not think there is much else to check. Make sure your banks of lamps meter out correctly when disconnected from the supply also I guess. From: labnetwork On Behalf Of Goodman, James R Sent: 24 November 2021 17:34 To: labnetwork at mtl.mit.edu Subject: [labnetwork] Jetfirst 200 CAUTION: This e-mail originated outside the University of Southampton. Hello all, I have a Jetfirst 200 RTA system that I am having some problems with. I have been working with the vendor and they have been helpful with suggestions for troubleshooting but have not been able or willing to provide electrical schematics. I am popping a couple of breakers when I try to heat the system and really need these schematics to do any significant diagnostic work. Does anyone have these drawings that they would be willing to share? We bought this system used and only have an operations manual. Thanks, Jay. [https://static.uml.edu/email/signature-logo.png] James Goodman ETIC Clean Room Equipment Mgr CORE RESEARCH FACILITY E: James_Goodman at uml.edu T: 978-934-3469 -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 2581 bytes Desc: image001.png URL: From rosendo.bindoy at kaust.edu.sa Wed Nov 24 16:07:52 2021 From: rosendo.bindoy at kaust.edu.sa (Rosendo Bindoy) Date: Wed, 24 Nov 2021 21:07:52 +0000 Subject: [labnetwork] Jetfirst 200 In-Reply-To: References: <7F1CC194-009F-4C54-9E84-D450EBA223DA@uml.edu> Message-ID: <5ED2B146-8D27-40EA-B510-D4F716669D60@kaust.edu.sa> Hello James, See attached technical manuals. This is for Jetfirst 100C-200C, not sure exactly what model you have. I agree with Owain, it?s also good to check the lamp terminals. Some terminals might be burnt already. I recently experienced it in one of our system. Hope this helps. [cid:image001.png at 01D7E190.7A044780] Regards, Rosendo Rosendo M. Bindoy Equipment Engineer Nanofabrication Core Lab Ibn Sina Bldg. 3 (Sea Side), Level 0 Room 0252 King Abdullah University of Science and Technology Phone: +966 12 808 4413 Mobile: +966 54 251 5257 Email: rosendo.bindoy at kaust.edu.sa Visit The Core Labs From: labnetwork on behalf of James Mitchell Date: Wednesday, 24 November 2021 at 11:55 PM To: "Goodman, James R" Cc: "labnetwork at mtl.mit.edu" Subject: Re: [labnetwork] Jetfirst 200 Sounds like a power supply issue but just a guess. Jim On Wed, Nov 24, 2021 at 12:40 PM Goodman, James R > wrote: Hello all, I have a Jetfirst 200 RTA system that I am having some problems with. I have been working with the vendor and they have been helpful with suggestions for troubleshooting but have not been able or willing to provide electrical schematics. I am popping a couple of breakers when I try to heat the system and really need these schematics to do any significant diagnostic work. Does anyone have these drawings that they would be willing to share? We bought this system used and only have an operations manual. Thanks, Jay. [https://static.uml.edu/email/signature-logo.png] James Goodman ETIC Clean Room Equipment Mgr CORE RESEARCH FACILITY E: James_Goodman at uml.edu T: 978-934-3469 _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -- James Mitchell Specialty Trades Technician Dept. of Electrical and Computer Engineering NCSU Nanofabrication Facility MRC RM243A Box 7911 2410 Campus Shore Dr., Raleigh, NC 27606 jtmitch5 at ncsu.edu Desk: 919-515-5394 Cell: 919-717-7325 [Image removed by sender.] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 3521786 bytes Desc: image001.png URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image002.png Type: image/png Size: 2582 bytes Desc: image002.png URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: JetFirst200C_Technical Manual_628.pdf Type: application/pdf Size: 2908849 bytes Desc: JetFirst200C_Technical Manual_628.pdf URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: JetFirst200C_Technical Manual_629.pdf Type: application/pdf Size: 1764803 bytes Desc: JetFirst200C_Technical Manual_629.pdf URL: From sbyoo at ucdavis.edu Wed Nov 24 20:41:44 2021 From: sbyoo at ucdavis.edu (S. J. Ben Yoo) Date: Wed, 24 Nov 2021 17:41:44 -0800 Subject: [labnetwork] Research Positions at UC Davis Message-ID: Dear Colleagues, We have four new exciting projects, and we are looking for three postdocs and one project research scientist. Please help us recruit in the following two general areas! 1) Silicon Photonics, Group IV Photonics, and 3D Photonic-Electronic Integration: this position area specializes in research and development of silicon photonic and group IV photonic technologies including modulators, detectors, multiplexers, demultiplexers, arrayed waveguide gratings, transimpedance amplifiers, and electronic drivers for applications in future computing systems, signal processors, LIDAR, imager processors. Multiple positions are available, and candidates are expected to work in a team environment taking part in one or more of design, fabrication, 2D/3D integration, testing, and application demonstrations. Applications of the integrated microsystems include computing, networking, imaging, and other areas, which will also involve testbed demonstrations. Demonstrated skills in one or more aspects of design, fabrication, and testing of photonic components are required. In particular, we are interested in candidates with good fabrication skills. 2) III-V Photonics, Heterogeneous Integration, Hybrid Lasers, Neuromorphic Processors: this position area specializes in active/passive integration such as hybrid lasers, amplifiers, nanophotonic neuromorphic processors, based on silicon, III-V, silica, and other materials leading to heterogeneous and hybrid integration of functional microsystems on chip. In addition to research and development of novel devices, the emphasis will be on integration of a large number of photonic and electronic components including lasers, modulators, detectors, multiplexers, demultiplexers, optical amplifiers, logic gates, arrayed waveguide gratings, transimpedance amplifiers, and electronic drivers. Multiple positions are available, and candidates are expected to work in a team environment taking part in one or more of design, fabrication, 2D/3D integration, testing, and application demonstrations. Applications of the integrated microsystems include computing, networking, imaging, and other areas, which will also involve testbed demonstrations. Demonstrated skills in one or more aspects of design, fabrication, and testing of photonic components are required. In particular, we are interested in candidates with good fabrication skills. https://sierra.ece.ucdavis.edu/ https://sierra.ece.ucdavis.edu/index.php/membership-join/ https://sierra.ece.ucdavis.edu/index.php/category/project/ Project Scientist Position: https://recruit.ucdavis.edu/JPF04060 _______________________________________________________________________________ S. J. Ben Yoo Joint Faculty LBL and UC Davis Distinguished Professor, Department of Electrical and Computer Engineering Room 3110, Kemper Hall Mail Code 1915 University of California Davis, California 95616 Mobile: (510) 407-2457 Fax: (530) 752-8428 email: sbyoo at ucdavis.edu home page: http://sierra.ece.ucdavis.edu _______________________________________________________________________________ -------------- next part -------------- An HTML attachment was scrubbed... URL: From James_Goodman at uml.edu Mon Nov 29 11:10:34 2021 From: James_Goodman at uml.edu (Goodman, James R) Date: Mon, 29 Nov 2021 16:10:34 +0000 Subject: [labnetwork] Jetfirst 200 Message-ID: <1B5A808B-3CFD-4913-BE3C-DB2FA41084C8@uml.edu> Thanks to all who responded! I have my schematics and will be able to get started on this today. Jay. [https://static.uml.edu/email/signature-logo.png] James Goodman ETIC Clean Room Equipment Mgr CORE RESEARCH FACILITY E: James_Goodman at uml.edu T: 978-934-3469 -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 2581 bytes Desc: image001.png URL: From jtmitch5 at ncsu.edu Mon Nov 29 17:50:53 2021 From: jtmitch5 at ncsu.edu (James Mitchell) Date: Mon, 29 Nov 2021 17:50:53 -0500 Subject: [labnetwork] Need dry pump service. Message-ID: We have a dry pump that has failed and would like to know if anyone knows someone who can service it. It is currently making a loud bearing sound and is shut down. We would like to have it serviced by someone locally if possible. Here is the tag info: [image: 20211129_141627.jpg] Thanks, Jim *James Mitchell* *Specialty Trades Technician* *Dept. of Electrical and Computer Engineering* *NCSU Nanofabrication Facility* *MRC RM243A **Box 7911* *2410 Campus Shore Dr., Raleigh, NC 27606* *jtmitch5 at ncsu.edu* *Desk: 919-515-5394* *Cell: 919-717-7325* -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: 20211129_141627.jpg Type: image/jpeg Size: 1809889 bytes Desc: not available URL: From kmcpeak at lsu.edu Mon Nov 29 22:26:45 2021 From: kmcpeak at lsu.edu (Kevin M McPeak) Date: Tue, 30 Nov 2021 03:26:45 +0000 Subject: [labnetwork] Software and drivers for K&S 7100-4D Dicing Saw In-Reply-To: References: Message-ID: Dear Colleagues, Thanks to everyone who provided input on obtaining new software/hardware for the K&S/ADT 7100 dicing saw. Our latest challenge is shipping the saw from Sandia National Lab to Baton Rouge, LA. ADT recommends installing two yellow securing jigs (see attached pdf) before we ship the 7100. Unfortunately, ADT doesn't have these jigs in stock and it will take 6 weeks to build them, which is longer then the DOE is willing to store the tool. By chance does anyway have these yellow jigs lying around that we could borrow? I will pay for shipping both ways. Fingers crossed! Regards, Kevin ________________________________________ From: labnetwork on behalf of Kevin M McPeak Sent: Thursday, November 11, 2021 4:46 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Software and drivers for K&S 7100-4D Dicing Saw Dear Colleagues, The LSU nanofabrication facility is getting a K&S 7100-4D Dicing Saw from the DOE equipment donation program. Unfortunately, the DOE is removing the hard drive per their privacy rules. I have reached out to KNS by phone and email but so far I have not had any luck getting a response. Do you any of you have a good contact at KNS that I could ask about getting software and drivers for this tool? Thanks! Regards, Kevin -- Kevin M. McPeak Associate Professor | LSU Dept. of Chemical Engineering 225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Fmtl.mit.edu%2Fmailman%2Flistinfo.cgi%2Flabnetwork&data=04%7C01%7Ckmcpeak%40lsu.edu%7Cac88533ec96848827db508d9a5787b99%7C2d4dad3f50ae47d983a09ae2b1f466f8%7C0%7C0%7C637722759156630260%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C2000&sdata=d4BXo3bxrJHH6WkbJV3IM%2B30EfPUqJTidjFaXXJzDJk%3D&reserved=0 -------------- next part -------------- A non-text attachment was scrubbed... Name: ADT_7100_securing_jigs.pdf Type: application/pdf Size: 323874 bytes Desc: ADT_7100_securing_jigs.pdf URL: From shimonel at savion.huji.ac.il Tue Nov 30 09:12:08 2021 From: shimonel at savion.huji.ac.il (Shimon Eliav) Date: Tue, 30 Nov 2021 14:12:08 +0000 Subject: [labnetwork] Software and drivers for K&S 7100-4D Dicing Saw In-Reply-To: References: Message-ID: Hi Kevin, We have a set of those brackets, see picture below. Let's be in touch to close the delivery details. Regards, Shimon [cid:image001.jpg at 01D7E604.6A1BBF60] -----Original Message----- From: labnetwork [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Kevin M McPeak Sent: Tuesday, 30 November 2021 5:27 To: labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Software and drivers for K&S 7100-4D Dicing Saw Dear Colleagues, Thanks to everyone who provided input on obtaining new software/hardware for the K&S/ADT 7100 dicing saw. Our latest challenge is shipping the saw from Sandia National Lab to Baton Rouge, LA. ADT recommends installing two yellow securing jigs (see attached pdf) before we ship the 7100. Unfortunately, ADT doesn't have these jigs in stock and it will take 6 weeks to build them, which is longer then the DOE is willing to store the tool. By chance does anyway have these yellow jigs lying around that we could borrow? I will pay for shipping both ways. Fingers crossed! Regards, Kevin ________________________________________ From: labnetwork > on behalf of Kevin M McPeak > Sent: Thursday, November 11, 2021 4:46 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Software and drivers for K&S 7100-4D Dicing Saw Dear Colleagues, The LSU nanofabrication facility is getting a K&S 7100-4D Dicing Saw from the DOE equipment donation program. Unfortunately, the DOE is removing the hard drive per their privacy rules. I have reached out to KNS by phone and email but so far I have not had any luck getting a response. Do you any of you have a good contact at KNS that I could ask about getting software and drivers for this tool? Thanks! Regards, Kevin -- Kevin M. McPeak Associate Professor | LSU Dept. of Chemical Engineering 225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Fmtl.mit.edu%2Fmailman%2Flistinfo.cgi%2Flabnetwork&data=04%7C01%7Ckmcpeak%40lsu.edu%7Cac88533ec96848827db508d9a5787b99%7C2d4dad3f50ae47d983a09ae2b1f466f8%7C0%7C0%7C637722759156630260%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C2000&sdata=d4BXo3bxrJHH6WkbJV3IM%2B30EfPUqJTidjFaXXJzDJk%3D&reserved=0 -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.jpg Type: image/jpeg Size: 65985 bytes Desc: image001.jpg URL: From janney.9 at osu.edu Tue Nov 30 09:33:58 2021 From: janney.9 at osu.edu (Janney, Peter J.) Date: Tue, 30 Nov 2021 14:33:58 +0000 Subject: [labnetwork] Need dry pump service. In-Reply-To: References: Message-ID: Try Advaco Best regards, Peter Janney [The Ohio State University] Peter Janney Lab Services Coordinator Nanotech West Lab 100 Science Village, 1381 Kinnear Road, Columbus, OH 43212 614-688-4213 Office 614-753-3926 Cell From: labnetwork On Behalf Of James Mitchell Sent: Monday, November 29, 2021 5:51 PM To: Fab Network Subject: [labnetwork] Need dry pump service. We have a dry pump that has failed and would like to know if anyone knows someone who can service it. It is currently making a loud bearing sound and is shut down. We would like to have it serviced by someone locally if possible. Here is the tag info: [cid:image002.jpg at 01D7E5CD.64BF8B50] Thanks, Jim James Mitchell Specialty Trades Technician Dept. of Electrical and Computer Engineering NCSU Nanofabrication Facility MRC RM243A Box 7911 2410 Campus Shore Dr., Raleigh, NC 27606 jtmitch5 at ncsu.edu Desk: 919-515-5394 Cell: 919-717-7325 [https://docs.google.com/uc?export=download&id=1wEnuxEKmYrE8wihsULSXEFOKuDnyUWXs&revid=0B6IsvvpTMVVfNlZ5cGRoRGhzSy9TVklabnlnMFZWdzdqYm00PQ] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 3605 bytes Desc: image001.png URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image002.jpg Type: image/jpeg Size: 1612752 bytes Desc: image002.jpg URL: