[labnetwork] Lincoln Laboratory wafer fab engineering position
Pulver, Daniel - 0835 - MITLL
Daniel.Pulver at ll.mit.edu
Wed Oct 27 16:28:51 EDT 2021
Labnetwork:
We have an opening on our process engineering team to help us develop and
build prototypes in CMOS, CCD imaging, photonic, superconductor, quantum,
and micromechanical integrated circuit technologies for national security
interests.
Teamwork, curiosity, and US citizenship are required. This is an on-site
position in Lexington, MA. We have some flexibility for candidate experience
levels.
https://careers.ll.mit.edu/job/Lexington-Assistant-Staff-Microfabrication-Pr
ocess-Engineer-MA-02420/806000700/
Dan Pulver
Microelectronics Laboratory Manager
MIT Lincoln Laboratory
Daniel.pulver at ll.mit.edu <mailto:Daniel.pulver at ll.mit.edu>
781.981.1716 office
781.540.3906 mobile
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20211027/123ac90c/attachment.html>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: smime.p7s
Type: application/pkcs7-signature
Size: 5537 bytes
Desc: not available
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20211027/123ac90c/attachment.p7s>
More information about the labnetwork
mailing list