[labnetwork] Dicing glass/quartz or alumina with Disco DAD3240 saw
Beaudoin, Mario
beaudoin at physics.ubc.ca
Thu Sep 9 16:52:38 EDT 2021
We are having issues with cutting glass/quartz or alumina wafers with
our Disco DAD3240 dicing saw
We’re using composite Thermocarbon blades @ 20K rpm and tried feed
speeds ranging between 0.5-5 mm/sec. Sample thickness varies but even
for thinner ones (500-700 um) we’re having a problem that the blade
breaks. Looks like the blade trajectory is bending during the cut and
this causes catastrophic damage to the blade. Why this bending occurs is
not clear. Maybe the problem is in the blue tape we use to secure
samples, but we don’t observe any apparent displacement of the sample on
the film.
Anyone else having similar issues? Any suggestions?
Regards,
Mario
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