[labnetwork] wirebonder for shared academic facility

[Youry Borisenkov]

Hey!
Here at Columbia we recently (3–4 months ago) got our new TPT H80 wire
bonder.
It looks great so far. Can get both wedge or ball tools, can have both Au
and Al wires installed simultaneously so this gives flexibility. It has
many cool features that work.
I used to work with K&S bonders in the past, and it was a pain.
Please feel free to reach out if you have any questions.

Best,
Youry

On Thu, Sep 1, 2022 at 12:31 PM Peder Lenvik <plenvik at ucsb.edu> wrote:

> My previous employer has Palomar and it seemed pretty solid.
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> *Peder*
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> *From:* labnetwork <labnetwork-bounces at mtl.mit.edu> *On Behalf Of *Edmond
> Chow
> *Sent:* Wednesday, August 31, 2022 1:08 PM
> *To:* Fab Network <labnetwork at mtl.mit.edu>
> *Subject:* [labnetwork] wirebonder for shared academic facility
>
>
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> We are looking to purchase a new wire bonder for our multi-user facility.
> We currently have one old K&S 4524AD ball bonder. However, it has been
> difficult to maintain as the tool is prone to be messed up by inexperienced
> users, whom we have encountered often in our lab.
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> We are seeking advice for a more user-friendly wire bonder, which can
> better tolerate some operator error without messing up the machine too
> badly.
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> Thank you in advance.
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> --
>
> Edmond Chow
>
> *Nick Holonyak, Jr. Micro and Nanotechnology Lab (HMNTL)*
>
> *University of Illinois*
> Rm 2300, MC-249
>
> 208 North Wright St. Urbana, IL 61801
> <https://www.google.com/maps/search/208+North+Wright+St.+Urbana,+IL+61801?entry=gmail&source=g>
>
> Email: echow at illinois.edu
>
> Web: http://mntl.illinois.edu/
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