[labnetwork] Question about DC sputtering of zinc

Chang, Long lvchang at Central.UH.EDU
Wed Feb 1 14:02:00 EST 2023


Hi All,

Does anyone have a list of banned materials for sputtering they can share? I made a list over the years through discussions on labnetwork whenever a new material gets requested, see attached photo. It’ll be nice to have a publicly searchable database, similar to this google sheet (https://docs.google.com/spreadsheets/d/1z0iyCsDUTpi6nkhtIxSp_rSMKGF4jeiqGbVRfnF5CRk).

Thanks,
Long
[cid:DDECC2FB-B7D7-4A97-BBFD-B712E4A2427F]
On Feb 1, 2023, at 9:20 AM, Michael Yakimov <yakimom at sunypoly.edu<mailto:yakimom at sunypoly.edu>> wrote:

I would also ask if process goal can be achieved with zinc compound, like ZnO.

Thanks

Mike



________________________________
From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> on behalf of Shawn Wagoner <swagone at gmu.edu<mailto:swagone at gmu.edu>>
Sent: Wednesday, February 1, 2023 7:22 AM
To: Malhotra, Sandra Guy <sandra.malhotra at tamu.edu<mailto:sandra.malhotra at tamu.edu>>; Fab Network <labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>>
Subject: Re: [labnetwork] Question about DC sputtering of zinc

I would not allow Zinc in any system I ran at Binghamton University.  I would not even allow it in the cleanroom.  It represents a significant contamination risk for shared use facilities.  If I were fortunate enough to have two systems, one clean and one “dirty”, I might consider it in the dirty system.  Its vapor pressure is so high I am not sure there is much you can do to cover it up with Ti.



Shawn



From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Malhotra, Sandra Guy
Sent: Monday, January 30, 2023 4:40 PM
To: Fab Network <labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>>
Subject: [labnetwork] Question about DC sputtering of zinc



Howdy All from AggieFab,
We have a user who requested permission to sputter zinc in our shared Lesker PVD75 DC sputtering tool.  On the Lesker website, there is the following note:



"This material has a relatively high vapor pressure at low temperatures which can cause ppm level contamination in the chamber and subsequent films. Careful consideration should be taken before this material is used in any deposition system. For this reason, some users prefer to use only dedicated vacuum chambers for deposition."



I'd like to ask the group if they allow zinc depositions in their shared tools if they follow it by a thorough paste with another material, like Ti? Or if this material is prohibited because it is problematic.



Thanks in advance for any inputs you may have.



Best,



Sandra G. Malhotra, Ph.D.  |  Technical Lab Manager



AggieFab Nanofabrication Facility
https://aggiefab.tamu.edu/<https://urldefense.com/v3/__https://nam11.safelinks.protection.outlook.com/?url=https*3A*2F*2Faggiefab.tamu.edu*2F&data=05*7C01*7Cswagone*40gmu.edu*7C701883f7c7244957be4108db03237a96*7C9e857255df574c47a0c00546460380cb*7C0*7C0*7C638107223189605602*7CUnknown*7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0*3D*7C2000*7C*7C*7C&sdata=Qvwl9IyHCzbpDHi*2BTs1FZrY65j79ftUQV83kJBELqLg*3D&reserved=0__;JSUlJSUlJSUlJSUlJSUlJSUlJSUl!!LkSTlj0I!Aesqckjzk4BJyH4BTgx7gpd2zSbcvoD0aNb_4EiUCkoLdUYfIvVH6gEOcN2-6xdSIojkXl2Q3CtgiyRTh1NKZUsvgQ$>
Department of Electrical & Computer Engineering, College of Engineering | Texas A&M University
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ph: 979.845.3199  |  sandra.malhotra at tamu.edu<mailto:sandra.malhotra at tamu.edu>
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