From olms0025 at umn.edu  Mon Jul  3 14:56:30 2023
From: olms0025 at umn.edu (Brian K. Olmsted)
Date: Mon, 3 Jul 2023 13:56:30 -0500
Subject: [labnetwork] Heidelberg alternatives?
Message-ID: <CAMNfp6-6YYL+VSx92HA0v1KGRQ_RGnvi4GeXMtNXnF5HuytZrA@mail.gmail.com>

Hi,

We are poised to buy a Heidelberg DWL 66+ but we have been having
an abysmal experience with field service from Heidelberg and their lack of
urgency / responsiveness has been deleteriously impacting our operations
and reputation for over a year now.

Before we move forward with adding a new Heidelberg tool I wanted to reach
out to the community to ask (1) if anyone uses a 3rd party for field
service on Heidelberg direct-write tools that they would recommend, and (2)
if there are alternative manufacturers anyone has experience with that they
would recommend?

Thanks,

Brian K. Olmsted
Associate Director of Laboratory Operations
University of Minnesota | Minnesota Nano Center
cse.umn.edu/mnc
612.626.3287
olms0025 at umn.edu
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From tobi at stanford.edu  Mon Jul  3 16:27:07 2023
From: tobi at stanford.edu (Tobi Beetz)
Date: Mon, 3 Jul 2023 20:27:07 +0000
Subject: [labnetwork] Heidelberg alternatives?
In-Reply-To: <CAMNfp6-6YYL+VSx92HA0v1KGRQ_RGnvi4GeXMtNXnF5HuytZrA@mail.gmail.com>
References: <CAMNfp6-6YYL+VSx92HA0v1KGRQ_RGnvi4GeXMtNXnF5HuytZrA@mail.gmail.com>
Message-ID: <BY5PR02MB68832667155F85779D9C747CA729A@BY5PR02MB6883.namprd02.prod.outlook.com>

Hi Brian ? I can highly recommend Durham Magneto Optics as we?ve had the exact opposite experience working with them.

We bought our first DWL tool from them a few years ago. I was initially skeptical and had urged our staff to consider adding a Heidelberg. We ended up with the Durham and have been absolutely thrilled with their responsiveness and collaboration. The tool has been a huge success with our community, and we added another one last year (365nm and 385nm). Some of our users use the Heidelbergs at SNF and the ML3s at SNSF as they have some complementary features. More info on the tool at https://snsf.stanford.edu/facilities/fab/fcr/ml3 . There is also a section below on the website that has tons of additional info that might be interesting to dig through. Finally, the price of an ML3 is another huge plus ?

Cheers,

Tobi

Tobi Beetz, Ph.D.
Associate Director, Stanford Nano Shared Facilities, Stanford University, http://snsf.stanford.edu<http://snsf.stanford.edu/>

From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Brian K. Olmsted
Sent: Monday, July 3, 2023 11:57 AM
To: Lab Network (labnetwork at mtl.mit.edu) <labnetwork at mtl.mit.edu>
Subject: [labnetwork] Heidelberg alternatives?

Hi,

We are poised to buy a Heidelberg DWL 66+ but we have been having an abysmal experience with field service from Heidelberg and their lack of urgency / responsiveness has been deleteriously impacting our operations and reputation for over a year now.

Before we move forward with adding a new Heidelberg tool I wanted to reach out to the community to ask (1) if anyone uses a 3rd party for field service on Heidelberg direct-write tools that they would recommend, and (2) if there are alternative manufacturers anyone has experience with that they would recommend?

Thanks,

Brian K. Olmsted
Associate Director of Laboratory Operations
University of Minnesota | Minnesota Nano Center
cse.umn.edu/mnc<http://cse.umn.edu/mnc>
612.626.3287
olms0025 at umn.edu<mailto:olms0025 at umn.edu>

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From carver at stanford.edu  Mon Jul  3 17:23:55 2023
From: carver at stanford.edu (Thomas Eugene Carver)
Date: Mon, 3 Jul 2023 21:23:55 +0000
Subject: [labnetwork] Heidelberg alternatives?
In-Reply-To: <BY5PR02MB68832667155F85779D9C747CA729A@BY5PR02MB6883.namprd02.prod.outlook.com>
References: <CAMNfp6-6YYL+VSx92HA0v1KGRQ_RGnvi4GeXMtNXnF5HuytZrA@mail.gmail.com>
 <BY5PR02MB68832667155F85779D9C747CA729A@BY5PR02MB6883.namprd02.prod.outlook.com>
Message-ID: <CC25EEC6-C9BB-4074-8190-401491DDF2CC@stanford.edu>

Hi Brian,

Yes, we?ve had great luck with our two ML3 machines.   About the only benefit of the larger Heidelbergs have is their speed of writing.   The DMO ML3 machines we have are super versatile and do a really nice job of direct writing.  We do a lot of work with small chips and even tiny slivers of oddball materials.  The ML3 doesn?t have a vacuum chuck, so it can work with any size little chip, but also works on up to 8? square.   We have people who work with full wafers too, even though they could write them faster on the Heidelbergs across the street.   The ML3 makes much smoother shallow angle lines, curves, circles, etc.  We never really see any hint of ?stair-stepping? (pixelization) in the written patterns, like you do on the Heidelbergs.  Even a very small ring comes out perfectly round.  People doing things like optical waveguides with long gentle curves have great results on the ML3.   We also have a lot of people doing things like making molds for micro-fluidic devices, where keeping the sidewalls of the channels as smooth as possible is very important to them.  And we have a lot of people working with 2D materials, where it?s important to be able to align an array of contact fingers very carefully to a difficult-to-see flake.  The ?virtual aligner? feature makes it easy to verify that the alignment was done perfectly by placing a transparent purple digitally rendered image of the pattern you?re about to write over the microscope image.  They?re able to design custom patterns like that right at the machine, and write them, all in one session.    We have about 150 people trained on the machines.    Both 365nm and 385nm work for general lithography on broadband resists.   But the people who work with SU-8 use the 365nm machine because 365nm exposes SU-8 about 20x faster than 385nm (SU-8 is very narrow band and optimized for 365nm).

I?m happy to answer any questions you might have about the ML3s.   We?ve been really happy with them.  And DMO is the best company I have ever dealt with.   Even though they?re in England, they answer all my questions promptly and thoroughly.  They?ve even taken suggestions I?ve had on improving their software, which they incorporated into their latest software versions to make the machines work even better than when we got our first machine.   Their sales and service is technically supposed to be done by Quantum Design out of San Diego.  But the machines have been so reliable that the only real service was done remotely by DMO, or done in person by DMO when they were here to install our second machine.  If you buy a machine though, you would buy it through Quantum Design (their USA distributor).

The only complaints I?ve heard about the DMO machines are that they are a little slow when doing full wafers, and that the software home screen is kind of bland, ?not elegant? as one user put it.   Apparently Heidelberg has a fancier looking home screen with nicer graphics.   I don?t care about how fancy the home screen is though, as long as it works.  And it usually works great.   We?ve never had a machine down for more than about a day.   We?ve never had any sort of mechanical issues with either machine.  It?s always been just small software-related problems, that they were able to either tell us how to fix, or fix it for us remotely using ?TeamViewer? from England while we?re sleeping.

The ML3s are pretty sensitive to vibration.   If you?re on a second floor of a building like we are, you?ll want to mount the machine as close to a support column as possible.  And you?ll definitely need the floating optical bench option.   The best bet would be to have it in a basement or ground floor though on solid concrete.   The machine will only write if it senses a certain level of stability.  If they?re doing a jackhammer downstairs, it will stop writing intermittently.   Or if someone leans something that?s jiggling on the floating optical bench it will stop writing.  I also had to line the inside of both machines with vibration damping peel-n-stick material to stop the panels from resonating like drum heads due to the rumble from our HEPA filters in the ceiling.   DMO saw how well that material worked after I installed it on the insides of our panels, and said they?d probably be installing that on all future machines they make.   If you ever need some of that material though, it?s called ?Dynamat Xtreme?.  You just cut it to shape with scissors, peel off the backing paper, and use a roller to press it out flat onto the sheet metal panels.  It?s a viscoelastic material which absorbs vibrations by converting them to heat.  It really works great at keeping sheet metal panels from resonating.

Good luck,
Tom




Thomas Carver
Flexible Cleanroom Lab Manager
Stanford Nano Shared Facilities
carver at stanford.edu



On Jul 3, 2023, at 1:27 PM, Tobi Beetz <tobi at stanford.edu> wrote:

Hi Brian ? I can highly recommend Durham Magneto Optics as we?ve had the exact opposite experience working with them.

We bought our first DWL tool from them a few years ago. I was initially skeptical and had urged our staff to consider adding a Heidelberg. We ended up with the Durham and have been absolutely thrilled with their responsiveness and collaboration. The tool has been a huge success with our community, and we added another one last year (365nm and 385nm). Some of our users use the Heidelbergs at SNF and the ML3s at SNSF as they have some complementary features. More info on the tool athttps://snsf.stanford.edu/facilities/fab/fcr/ml3 . There is also a section below on the website that has tons of additional info that might be interesting to dig through. Finally, the price of an ML3 is another huge plus ?

Cheers,

Tobi

Tobi Beetz, Ph.D.
Associate Director, Stanford Nano Shared Facilities, Stanford University, http://snsf.stanford.edu<http://snsf.stanford.edu/>

From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Brian K. Olmsted
Sent: Monday, July 3, 2023 11:57 AM
To: Lab Network (labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>) <labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>>
Subject: [labnetwork] Heidelberg alternatives?

Hi,

We are poised to buy a Heidelberg DWL 66+ but we have been having an abysmal experience with field service from Heidelberg and their lack of urgency / responsiveness has been deleteriously impacting our operations and reputation for over a year now.

Before we move forward with adding a new Heidelberg tool I wanted to reach out to the community to ask (1) if anyone uses a 3rd party for field service on Heidelberg direct-write tools that they would recommend, and (2) if there are alternative manufacturers anyone has experience with that they would recommend?

Thanks,

Brian K. Olmsted
Associate Director of Laboratory Operations
University of Minnesota | Minnesota Nano Center
cse.umn.edu/mnc<http://cse.umn.edu/mnc>
612.626.3287
olms0025 at umn.edu<mailto:olms0025 at umn.edu>

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From Peter.Lomax at ed.ac.uk  Tue Jul  4 04:47:49 2023
From: Peter.Lomax at ed.ac.uk (Peter Lomax)
Date: Tue, 4 Jul 2023 08:47:49 +0000
Subject: [labnetwork] Heidelberg alternatives?
In-Reply-To: <BY5PR02MB68832667155F85779D9C747CA729A@BY5PR02MB6883.namprd02.prod.outlook.com>
References: <CAMNfp6-6YYL+VSx92HA0v1KGRQ_RGnvi4GeXMtNXnF5HuytZrA@mail.gmail.com>
 <BY5PR02MB68832667155F85779D9C747CA729A@BY5PR02MB6883.namprd02.prod.outlook.com>
Message-ID: <PAVPR05MB990458AEE104F9B64253A5F3C82EA@PAVPR05MB9904.eurprd05.prod.outlook.com>

Hi Brian,

The same here for Durham Magneto Optics ? we have had a really good relationship with them over the last 5 years and the tool has proved very popular and versatile including grey scale litho, back side alignment and we have had the optics and light sources upgraded to improve the feature size.

Best

Peter

From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Tobi Beetz
Sent: 03 July 2023 21:27
To: Brian K. Olmsted <olms0025 at umn.edu>; Lab Network (labnetwork at mtl.mit.edu) <labnetwork at mtl.mit.edu>
Cc: Thomas Eugene Carver <carver at stanford.edu>
Subject: Re: [labnetwork] Heidelberg alternatives?

This email was sent to you by someone outside the University.
You should only click on links or attachments if you are certain that the email is genuine and the content is safe.
Hi Brian ? I can highly recommend Durham Magneto Optics as we?ve had the exact opposite experience working with them.

We bought our first DWL tool from them a few years ago. I was initially skeptical and had urged our staff to consider adding a Heidelberg. We ended up with the Durham and have been absolutely thrilled with their responsiveness and collaboration. The tool has been a huge success with our community, and we added another one last year (365nm and 385nm). Some of our users use the Heidelbergs at SNF and the ML3s at SNSF as they have some complementary features. More info on the tool at https://snsf.stanford.edu/facilities/fab/fcr/ml3 . There is also a section below on the website that has tons of additional info that might be interesting to dig through. Finally, the price of an ML3 is another huge plus ?

Cheers,

Tobi

Tobi Beetz, Ph.D.
Associate Director, Stanford Nano Shared Facilities, Stanford University, http://snsf.stanford.edu<http://snsf.stanford.edu/>

From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Brian K. Olmsted
Sent: Monday, July 3, 2023 11:57 AM
To: Lab Network (labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>) <labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>>
Subject: [labnetwork] Heidelberg alternatives?

Hi,

We are poised to buy a Heidelberg DWL 66+ but we have been having an abysmal experience with field service from Heidelberg and their lack of urgency / responsiveness has been deleteriously impacting our operations and reputation for over a year now.

Before we move forward with adding a new Heidelberg tool I wanted to reach out to the community to ask (1) if anyone uses a 3rd party for field service on Heidelberg direct-write tools that they would recommend, and (2) if there are alternative manufacturers anyone has experience with that they would recommend?

Thanks,

Brian K. Olmsted
Associate Director of Laboratory Operations
University of Minnesota | Minnesota Nano Center
cse.umn.edu/mnc<http://cse.umn.edu/mnc>
612.626.3287
olms0025 at umn.edu<mailto:olms0025 at umn.edu>

The University of Edinburgh is a charitable body, registered in Scotland, with registration number SC005336. Is e buidheann carthannais a th? ann an Oilthigh Dh?n ?ideann, cl?raichte an Alba, ?ireamh cl?raidh SC005336.
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From sergilendi at lsu.edu  Tue Jul  4 09:19:10 2023
From: sergilendi at lsu.edu (Sergi Lendinez)
Date: Tue, 4 Jul 2023 13:19:10 +0000
Subject: [labnetwork] Heidelberg alternatives?
In-Reply-To: <PAVPR05MB990458AEE104F9B64253A5F3C82EA@PAVPR05MB9904.eurprd05.prod.outlook.com>
References: <CAMNfp6-6YYL+VSx92HA0v1KGRQ_RGnvi4GeXMtNXnF5HuytZrA@mail.gmail.com>
 <BY5PR02MB68832667155F85779D9C747CA729A@BY5PR02MB6883.namprd02.prod.outlook.com>
 <PAVPR05MB990458AEE104F9B64253A5F3C82EA@PAVPR05MB9904.eurprd05.prod.outlook.com>
Message-ID: <CH0P221MB0283C3657620D84395CDF5F6CA2EA@CH0P221MB0283.NAMP221.PROD.OUTLOOK.COM>

Hi Brian,

I can also vouch for DMO. Here at LSU we have an ML3 and we are very happy with it. A very useful feature is that you can switch between lenses during one exposure run, so if alignment is taken care of -which can be done automatically through the software- writing time can be reduced. Backside alignment is also nice. And their customer support is outstanding, which I find really hard to find these days.

Regards,
Sergi
________________________________
From: labnetwork <labnetwork-bounces at mtl.mit.edu> on behalf of Peter Lomax <Peter.Lomax at ed.ac.uk>
Sent: Tuesday, July 4, 2023 3:47:49 AM
To: Tobi Beetz <tobi at stanford.edu>; Brian K. Olmsted <olms0025 at umn.edu>; Lab Network (labnetwork at mtl.mit.edu) <labnetwork at mtl.mit.edu>
Cc: Thomas Eugene Carver <carver at stanford.edu>
Subject: Re: [labnetwork] Heidelberg alternatives?

You don't often get email from peter.lomax at ed.ac.uk. Learn why this is important<https://aka.ms/LearnAboutSenderIdentification>

Hi Brian,



The same here for Durham Magneto Optics ? we have had a really good relationship with them over the last 5 years and the tool has proved very popular and versatile including grey scale litho, back side alignment and we have had the optics and light sources upgraded to improve the feature size.



Best



Peter



From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Tobi Beetz
Sent: 03 July 2023 21:27
To: Brian K. Olmsted <olms0025 at umn.edu>; Lab Network (labnetwork at mtl.mit.edu) <labnetwork at mtl.mit.edu>
Cc: Thomas Eugene Carver <carver at stanford.edu>
Subject: Re: [labnetwork] Heidelberg alternatives?



This email was sent to you by someone outside the University.

You should only click on links or attachments if you are certain that the email is genuine and the content is safe.

Hi Brian ? I can highly recommend Durham Magneto Optics as we?ve had the exact opposite experience working with them.



We bought our first DWL tool from them a few years ago. I was initially skeptical and had urged our staff to consider adding a Heidelberg. We ended up with the Durham and have been absolutely thrilled with their responsiveness and collaboration. The tool has been a huge success with our community, and we added another one last year (365nm and 385nm). Some of our users use the Heidelbergs at SNF and the ML3s at SNSF as they have some complementary features. More info on the tool at https://snsf.stanford.edu/facilities/fab/fcr/ml3 . There is also a section below on the website that has tons of additional info that might be interesting to dig through. Finally, the price of an ML3 is another huge plus ?



Cheers,



Tobi



Tobi Beetz, Ph.D.

Associate Director, Stanford Nano Shared Facilities, Stanford University, http://snsf.stanford.edu<http://snsf.stanford.edu/>



From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Brian K. Olmsted
Sent: Monday, July 3, 2023 11:57 AM
To: Lab Network (labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>) <labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>>
Subject: [labnetwork] Heidelberg alternatives?



Hi,



We are poised to buy a Heidelberg DWL 66+ but we have been having an abysmal experience with field service from Heidelberg and their lack of urgency / responsiveness has been deleteriously impacting our operations and reputation for over a year now.



Before we move forward with adding a new Heidelberg tool I wanted to reach out to the community to ask (1) if anyone uses a 3rd party for field service on Heidelberg direct-write tools that they would recommend, and (2) if there are alternative manufacturers anyone has experience with that they would recommend?



Thanks,


Brian K. Olmsted

Associate Director of Laboratory Operations

University of Minnesota | Minnesota Nano Center

cse.umn.edu/mnc<http://cse.umn.edu/mnc>

612.626.3287

olms0025 at umn.edu<mailto:olms0025 at umn.edu>



The University of Edinburgh is a charitable body, registered in Scotland, with registration number SC005336. Is e buidheann carthannais a th? ann an Oilthigh Dh?n ?ideann, cl?raichte an Alba, ?ireamh cl?raidh SC005336.
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From beaudoin at physics.ubc.ca  Tue Jul  4 17:31:31 2023
From: beaudoin at physics.ubc.ca (Beaudoin, Mario)
Date: Tue, 4 Jul 2023 14:31:31 -0700
Subject: [labnetwork] Heidelberg MLA150 SU-8 Exposure Dose
In-Reply-To: <SA1PR01MB6544488F2AF7FBED45495CE2F322A@SA1PR01MB6544.prod.exchangelabs.com>
References: <SA1PR01MB6544488F2AF7FBED45495CE2F322A@SA1PR01MB6544.prod.exchangelabs.com>
Message-ID: <54d391c6-cbee-2f77-6b0f-504f7ef7253f@physics.ubc.ca>

We experience the same thing with our instrument.

Mario

On 2023-06-22 10:28 a.m., Hollingshead, Dave wrote:
> [*CAUTION:* Non-UBC Email]
>
> Dear Labnetwork,
>
> We have found that exposure of SU-8 on our MLA150 tool (using the 
> 375nm laser) seems to require very high doses. Even thin ~500nm thick 
> films (using SU-8 2000.5) have required doses on the order of 
> 1200mJ/cm^2 to fully expose. This is 15-20x the recommended dosage 
> from both the datasheet and what we estimate is the exposure dose used 
> on our filtered contact aligners. Thicker films follow the same trend, 
> but not necessarily in a linear fashion (5?m films require ~2000mJ/cm^2 ).
>
> I am sure the bump from 365nm to 375nm plays a role, but the magnitude 
> of the change seems excessive. FWIW, our other negative resists (eg. 
> nLOF2020) seem to expose properly at reasonable doses.
>
> Has anyone else experienced this? Does anyone have an explanation or 
> any processing suggestions for using SU-8 with an MLA?
>
> Thanks,
>
> -Dave
>
> *Dave Hollingshead*
> Manager, Research Operations
>
> *The Ohio State University*
> Nanotech West Labs
> Suite 100, 1381 Kinnear Rd, Columbus, OH 43212
> 614.292.1355 Office
> hollingshead.19 at osu.edu <mailto:hollingshead.19 at osu.edu> / 
> nanotech.osu.edu <http://nanotech.osu.edu>
>
> Pronouns: he/him/his
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
-- 
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From tucsonr at illinois.edu  Wed Jul  5 09:37:40 2023
From: tucsonr at illinois.edu (Richelson, Tucson)
Date: Wed, 5 Jul 2023 13:37:40 +0000
Subject: [labnetwork] No water flow? - AccuThermo AW610M RTP
Message-ID: <MW4PR11MB582296CB00BAD874034C0FC9D92FA@MW4PR11MB5822.namprd11.prod.outlook.com>

Hello everyone,

We have a AW610 RTP and we noticed that the pyrometer coolant water wasn't flowing. We disconnected the chiller bath and tested it separately and confirmed that it was pumping water. Has anyone else experience this? Any suggestions on how to fix this?

https://allwin21.com/accuthermo-aw-610/


Best,
Tucson Richelson
-------------------------------------------------------------------------
Nick Holonyak, Jr. Micro and Nanotechnology Lab (HMNTL)
University of Illinois
Rm 2118, MC-249
208 North Wright St. Urbana, IL 61801
Office: +1 (217) 244-5138
Web: http://mntl.illinois.edu/
Schedule training: https://book.ms/b/Training2 at uillinoisedu.onmicrosoft.com
Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure.

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From logshappill at gmail.com  Wed Jul  5 12:31:54 2023
From: logshappill at gmail.com (Leslie George)
Date: Wed, 5 Jul 2023 09:31:54 -0700
Subject: [labnetwork] No water flow? - AccuThermo AW610M RTP
In-Reply-To: <MW4PR11MB582296CB00BAD874034C0FC9D92FA@MW4PR11MB5822.namprd11.prod.outlook.com>
References: <MW4PR11MB582296CB00BAD874034C0FC9D92FA@MW4PR11MB5822.namprd11.prod.outlook.com>
Message-ID: <7DC3F9D7-3B32-45FD-80EF-2FF066A81B89@gmail.com>

Hi Tucson,

The cooling lines on these tools are know to gunk up over time. I suspect you?ll need to undo the fittings to check for blockages. ALLWIN has a solid support team that can guide you through the process. 

Also, I thought the chiller was meant to cool just the door assembly and not the internal components. Forgive me if I?m wrong but it could be that the house cooling loop is what feeds the pyrometer.

Good luck!

-Leslie

> On Jul 5, 2023, at 6:59 AM, Richelson, Tucson <tucsonr at illinois.edu> wrote:
> 
> ?
> Hello everyone,
>  
> We have a AW610 RTP and we noticed that the pyrometer coolant water wasn?t flowing. We disconnected the chiller bath and tested it separately and confirmed that it was pumping water. Has anyone else experience this? Any suggestions on how to fix this?
>  
> https://allwin21.com/accuthermo-aw-610/
>  
>  
> Best,
> Tucson Richelson
> -------------------------------------------------------------------------
> Nick Holonyak, Jr. Micro and Nanotechnology Lab (HMNTL)
> University of Illinois
> Rm 2118, MC-249
> 208 North Wright St. Urbana, IL 61801
> Office: +1 (217) 244-5138
> Web: http://mntl.illinois.edu/
> Schedule training: https://book.ms/b/Training2 at uillinoisedu.onmicrosoft.com
> Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure.
>  
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From tucsonr at illinois.edu  Thu Jul  6 10:10:57 2023
From: tucsonr at illinois.edu (Richelson, Tucson)
Date: Thu, 6 Jul 2023 14:10:57 +0000
Subject: [labnetwork] No water flow? - AccuThermo AW610M RTP
In-Reply-To: <7DC3F9D7-3B32-45FD-80EF-2FF066A81B89@gmail.com>
References: <MW4PR11MB582296CB00BAD874034C0FC9D92FA@MW4PR11MB5822.namprd11.prod.outlook.com>
 <7DC3F9D7-3B32-45FD-80EF-2FF066A81B89@gmail.com>
Message-ID: <MW4PR11MB58228D8D81B653D5DC95CB40D92CA@MW4PR11MB5822.namprd11.prod.outlook.com>

Hello Leslie,

I blew some N2 through the lines and some milky water came out. It seems to be pumping fine now. If it fails again I?ll try that.

I?ve read and re-read the manual. This is still all new to me and I might still be wrong but here?s what I?ve learned so far.
There are three cooling systems. One is water (from the house) to cool the oven. One is N2 to cool the quartz isolation tube. And lastly is water (from a chiller bath) to cool the pyrometer.

I did reach out to Allwin and they got back to me, so thank you for your good suggestion, and thank you for responding!





From: Leslie George <logshappill at gmail.com>
Sent: Wednesday, July 5, 2023 11:32 AM
To: Richelson, Tucson <tucsonr at illinois.edu>
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] No water flow? - AccuThermo AW610M RTP

Hi Tucson,

The cooling lines on these tools are know to gunk up over time. I suspect you?ll need to undo the fittings to check for blockages. ALLWIN has a solid support team that can guide you through the process.

Also, I thought the chiller was meant to cool just the door assembly and not the internal components. Forgive me if I?m wrong but it could be that the house cooling loop is what feeds the pyrometer.

Good luck!

-Leslie


On Jul 5, 2023, at 6:59 AM, Richelson, Tucson <tucsonr at illinois.edu<mailto:tucsonr at illinois.edu>> wrote:
?
Hello everyone,

We have a AW610 RTP and we noticed that the pyrometer coolant water wasn?t flowing. We disconnected the chiller bath and tested it separately and confirmed that it was pumping water. Has anyone else experience this? Any suggestions on how to fix this?

https://allwin21.com/accuthermo-aw-610/<https://urldefense.com/v3/__https:/allwin21.com/accuthermo-aw-610/__;!!DZ3fjg!7YDEmFcEMtSywQUEDyf83DpbQSSpTRHfEloZaaXgShqRnVRujAFQokk9RcnIpk-PZvxn9YjQ60ffYkI6mHAHZ0Q$>


Best,
Tucson Richelson
-------------------------------------------------------------------------
Nick Holonyak, Jr. Micro and Nanotechnology Lab (HMNTL)
University of Illinois
Rm 2118, MC-249
208 North Wright St. Urbana, IL 61801
Office: +1 (217) 244-5138
Web: http://mntl.illinois.edu/
Schedule training: https://book.ms/b/Training2 at uillinoisedu.onmicrosoft.com<https://urldefense.com/v3/__https:/book.ms/b/Training2 at uillinoisedu.onmicrosoft.com__;!!DZ3fjg!7YDEmFcEMtSywQUEDyf83DpbQSSpTRHfEloZaaXgShqRnVRujAFQokk9RcnIpk-PZvxn9YjQ60ffYkI6Ct7gIHo$>
Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure.

_______________________________________________
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From info at fabsurplus.com  Thu Jul  6 09:22:10 2023
From: info at fabsurplus.com (Stephen Howe)
Date: Thu, 06 Jul 2023 15:22:10 +0200
Subject: [labnetwork] Scammers operating out of New York
Message-ID: <1ef8709d0633602539e941da351771d60ead46a1.camel@fabsurplus.com>

Dear Lab Network,

Hope you are all well.

As an FYI, please be aware that there is a gang of internet based
fraudsters operating in your area. 
They are targetting such sectors as Semiconductor, healthcare, machine-
tooling and other high tech areas.
The way they work is they advertise tools which really exist in the
market place, which they don't own. When you send them a payment, they
just pocket the money via mule bank accounts and move on.
They are able to do this due to they are well protected by banking
privacy laws.
They have been operating since 2018 in the semiconductor sector. I have
advised the FBI repeatedly about many specific criminal activities of
this group, but the FBI did not take any actions to my knowledge ,
hence these individuals continue to operate scam companies and continue
to rip off businesses and individuals in the New York , Mid-West and
New England area.
So, due to this alarming development, before you purchase any used
semiconductor equipment or spare parts, it is necessary to check
physically the machinery and confirm the ownership before to proceed to
purchase it.
I attach one news article published in internet about these scammers
from 2019 (They continue to operate freely in USA. ).

I had to shut down my operations in the USA due to I was defrauded by
these people.

My opinion is that law enforcement in the USA needs to do something to
shut down these people's scam operations, which are damaging the
reputation of the New York area across the world.

Yours sincerely,

SDI Fabsurplus Italia SRL
Stephen Howe
Company Owner
email: info at fabsurplus.com
Mobile (Italy) : +39 335-710-7756
WWW.FABSURPLUS.COM
Your Marketplace for Used Semiconductor Equipment




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From rrand at ucdavis.edu  Thu Jul  6 14:11:22 2023
From: rrand at ucdavis.edu (Ryan R Anderson)
Date: Thu, 6 Jul 2023 18:11:22 +0000
Subject: [labnetwork] UC Davis Center for Nano-Micro Manufacturing job
 opening
Message-ID: <BY5PR08MB634381A92D24D655F066E4F9B42CA@BY5PR08MB6343.namprd08.prod.outlook.com>

Dear Lab Network community,


The Center for Nano-Micro Manufacturing at UC Davis has an open position for a Process/Equipment Engineer.  This position primarily oversees equipment and takes care of users in our photolithography and wafer/die bonding process areas with responsibilities extending into other areas of the facility as well.  The full job description including responsibilities, required knowledge, skills and experience can be found here<https://careerspub.universityofcalifornia.edu/psp/ucdavis/EMPLOYEE/HRMS/c/HRS_HRAM.HRS_APP_SCHJOB.GBL?Page=HRS_APP_JBPST&JobOpeningId=55702&PostingSeq=1&SiteId=7&languageCd=ENG&FOCUS=Applicant>.



Looking forward to hearing from anyone that might be interested!

Thank you

Ryan Anderson
Manager, Center for Nano-MicroManufacturing
1209 Kemper Hall
University of California Davis
One Shields Avenue
Davis, CA 95616
Phone: 530-601-3943
Email: rrand at ucdavis.edu<mailto:rrand at ucdavis.edu>
https://cnm2.ucdavis.edu/


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From James.Grant at glasgow.ac.uk  Fri Jul  7 10:50:54 2023
From: James.Grant at glasgow.ac.uk (James Grant)
Date: Fri, 7 Jul 2023 14:50:54 +0000
Subject: [labnetwork] SPTS Rapier Module - Laser/White Light
 Interferometry
In-Reply-To: <LO2P302MB00436C6F8CB76006661B3048B0A79@LO2P302MB0043.GBRP302.PROD.OUTLOOK.COM>
References: <LO2P302MB0043867A07D47A9DBB41821BB0DA9@LO2P302MB0043.GBRP302.PROD.OUTLOOK.COM>
 <LO2P302MB00436C6F8CB76006661B3048B0A79@LO2P302MB0043.GBRP302.PROD.OUTLOOK.COM>
Message-ID: <LO2P302MB00430FA728B03828BD99A6B9B02DA@LO2P302MB0043.GBRP302.PROD.OUTLOOK.COM>

Hello,

6 months later, thought it only correct to inform the community that we successfully installed an Intellemetrics LEP  system on our Rapier. Many thanks to those who helped us along the way!

[cid:image004.png at 01D9B0EA.DED70690]

[A screenshot of a graph  Description automatically generated with low confidence]

Cheers,

James

Dr. James Paul Grant
Research Engineer in Plasma Processing

Plasma Processing Group
james.grant at glasgow.ac.uk<mailto:james.grant at glasgow.ac.uk>

 [cid:image001.png at 01D9B0EA.797EA8C0]
      www.JWNC.gla.ac.uk<http://www.jwnc.gla.ac.uk/>
[cid:image002.png at 01D9B0EA.797EA8C0]  LinkedIn.com/company/JWNC
[cid:image003.png at 01D9B0EA.797EA8C0]  @UofG_JWNC<https://twitter.com/uofg_jwnc>

From: James Grant
Sent: Sunday, February 19, 2023 10:49 AM
To: labnetwork at mtl.mit.edu
Subject: RE: SPTS Rapier Module - Laser/White Light Interferometry

Hello all,

Been almost two weeks since I posted this and believe we have come to some conclusions. Many thanks to all those who contributed. Tyndall and EPFL people were especially helpful.


  1.  We had a lot of back and forth with SPTS. They said that while they could see benefit of laser interferometry for our application, they currently did not offer the hardware to mount laser interferometry endpoint systems to the Rapier. We asked them to quote to so do, but they were unwilling. Fair enough.
  2.  I don't think the folks at Tyndall will mind me mentioning the challenges they have faced in getting laser interferometry on their SPTS Synapse module working. I understand the issue is spot stability and wobble, thought to be cased by heat from chamber walls - they Synapse walls are heated to 130oC. It's thought this won't be a problem on the Rapier as chamber walls are only heated to 55oC. Let's hope so.
  3.  We sent pictures and some dimensions of the pre-drilled holes at the top of our Rapier to Intellemetrics, our preferred laser endpoint system vendor. They believe it possible to mount a LEP 500 unit to the tool with not too much trouble.

Hope summary information is useful.

Cheers,

James

Dr. James Paul Grant
Research Engineer in Plasma Processing

Plasma Etch Group
james.grant at glasgow.ac.uk<mailto:james.grant at glasgow.ac.uk>

 [cid:image001.png at 01D9B0EA.797EA8C0]
      www.JWNC.gla.ac.uk<http://www.jwnc.gla.ac.uk/>
[cid:image002.png at 01D9B0EA.797EA8C0]  LinkedIn.com/company/JWNC
[cid:image003.png at 01D9B0EA.797EA8C0]  @UofG_JWNC<https://twitter.com/uofg_jwnc>

From: James Grant
Sent: 06 February 2023 14:38
To: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: SPTS Rapier Module - Laser/White Light Interferometry

Hello,

Hoping the community can feedback on their experiences.

In 2019 we purchased an SPTS Rapier DSiE tool. As well as doing Bosch processing we also require the tool to do mixed process etching. Quite a few of our users, on our other Si etch tools (OIPT Estrelas and STS Multiplex), use mixed process to etch SOI materials or a-Si on fused silica substrates. These systems have Intellemetrics LEP 410/500 red laser interferometer units for the purpose of end-point detection.

When we purchased the Rapier, SPTS did tell us that a laser end-point system could not be used. They encouraged us instead to use the Claritas OES system on the tool, however when we pointed out our typical use scenario (small substrate size, low % open area) they admitted that the Claritas would struggle to differentiate when to end-point. Our preferred laser interferometer vendor, Intellemetrics, say they have sold LEP 500 red laser interferometer units to SPTS but cannot say on what systems they have been used.

We have found that EPFL use white light interferometry<https://www.epfl.ch/research/facilities/cmi/equipment/etching/spts-rapier/> end-point detection on their Rapier module - have contacted Phillipe Fluckiger separately.

My question to the community is has anyone used a laser interferometry system on an SPTS Rapier? If so, could they feedback with their experiences. Apologies I'm asking such an open question!

Cheers,

James

Dr. James Paul Grant
Research Engineer in Plasma Processing

Plasma Processing Group
james.grant at glasgow.ac.uk<mailto:james.grant at glasgow.ac.uk>

 [cid:image001.png at 01D9B0EA.797EA8C0]
      www.JWNC.gla.ac.uk<http://www.jwnc.gla.ac.uk/>
[cid:image002.png at 01D9B0EA.797EA8C0]  LinkedIn.com/company/JWNC
[cid:image003.png at 01D9B0EA.797EA8C0]  @UofG_JWNC<https://twitter.com/uofg_jwnc>

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From jonathanr at science.xyz  Mon Jul 10 12:40:16 2023
From: jonathanr at science.xyz (Jonathan Reeder)
Date: Mon, 10 Jul 2023 09:40:16 -0700
Subject: [labnetwork] Vendors or contractors that can evap Mg
Message-ID: <CAF=xtrtUDt06Xi8u8RNLdB3aHxRs+-k3hAwTY11BBGWr3RvtQw@mail.gmail.com>

I'm looking to get ~20x 4" wafers coated with Mg and having trouble finding
a vendor or academic cleanroom that has a tool that allows high vapor
pressure materials like Mg or Zn. Any leads where this could be done? LGA
thin films can't do it, and ideally somewhere local to the bay area would
be great but not necessary.

Thanks,
Jonathan
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From agah at vt.edu  Tue Jul 11 11:50:00 2023
From: agah at vt.edu (Masoud Agah)
Date: Tue, 11 Jul 2023 11:50:00 -0400
Subject: [labnetwork] VAST Job Opps: Microfabrication-Process Engineers
Message-ID: <CAH1UHX_bT8HbgbA-ZKGYR8ab3MK29Ouo-5oXkBhWdup1kvU_5w@mail.gmail.com>

Job Opportunity Announcement
Virginia Alliance for Semiconductor Technology (VAST)
Microfabrication-Semiconductor Process Engineers

Reporting to the VAST Associate Director of Operations, the VAST
Microfabrication - Semiconductor Process Engineers will be located at VAST
Headquarter in Arlington or one of the VAST partner institutions. VAST
process engineers will:

- Design and develop process flows and perform micro/nano fabrication or
characterization for private and public entities in collaboration with the
VAST management team
- Work with facilities managers and staff across the alliance in Virginia
to develop virtual training modules to VAST-standards
- Travel across the Commonwealth of Virginia as needed to perform assigned
tasks within the cleanroom and material characterization facilities
- Be responsible for creating hands-on training modules for different
workforce development programs
- Train veterans, adult learners, and other stakeholders as instructed
within the VAST facilities and execute the Fast Track to Semiconductor
Careers and other workforce programs
- Generate and provide data as needed to be integrated within the VAST
cloud-based facilities management system
- Implement the unified VAST multimedia documentation for safety training,
tool training, site-specific policies, and recipe repository
- Work with core groups to create an inventory of semiconductor and
nanotechnology tools and equipment within the VAST nodes and beyond in the
Commonwealth of Virginia
- Gather information and prepare reports as instructed related to the use
of the facilities and workforce training programs
- Work closely with faculty, students, and staff at partner universities to
meet the needs and goals set by the VAST leadership team

Potential candidates need to pay particular attention to the primary
location of the opportunity when applying for this position.

Primary Location:
Virginia Tech Node in Blacksburg, VA (Job No: 526285)
Virginia Commonwealth University in Richmond, VA (Job No: 562286)
Norfolk State University Node in Norfolk, VA (Job No: 562287)
University of Virginia Node in Charlottesville (Job No: 526288)

Careers at Virginia Tech
<https://careers.pageuppeople.com/968/cw/en-us/listing/>
careers.pageuppeople.com ? 2 min read
<https://careers.pageuppeople.com/968/cw/en-us/listing/>

Masoud Agah
Founding Director, Virginia Alliance for Semiconductor Technology (VAST)

Virginia Microelectronics Consortium (VMEC) Professor of Engineering
> The Bradley Dept. of Electrical and Computer Engineering
> Mechanical Engineering Department (Affiliate)
> Faculty Senate and University Council Member

Virginia Tech
Voice: (540) 231-2653
VT MEMS Lab <http://www.agah-lab.org>
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From nzxie at uw.edu  Fri Jul 14 19:08:20 2023
From: nzxie at uw.edu (Ningzhi Xie)
Date: Fri, 14 Jul 2023 16:08:20 -0700
Subject: [labnetwork] Dicing sapphire wafer
Message-ID: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>

Dear College,

I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice
a 460?m sapphire (Al2O3) wafer. It seems the wafer is too hard that I get
into trouble of frequently breaking the dicing blade. I have tried lowing
the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut into
half of the wafer (230?m) but still got the blade broken. I am wondering if
you have any good suggestions on sapphire wafer dicing.

Thank you very much.

Best regards,
Ningzhi Xie
Department of Electrical and Computer Engineering
University of Washington
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From jdeng at cns.fas.harvard.edu  Fri Jul 14 21:05:58 2023
From: jdeng at cns.fas.harvard.edu (Deng, Jiangdong)
Date: Sat, 15 Jul 2023 01:05:58 +0000
Subject: [labnetwork] Dicing sapphire wafer
In-Reply-To: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>
References: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>
Message-ID: <2EF2CE86-A2E7-4D73-9EFB-87B8B2DE66E2@cns.fas.harvard.edu>

1mm/s is too fast for sapphire. Typically we use 0.1 or 0.2 mm/s and 20k RPM. Blade thickness should be 0.3 mm ( no thinner than 0.2 mm). Please also check the disco service, and they usually will give you very good suggestions. 

-JD @ CNS of Harvard 

Sent from my iPhone

> On Jul 14, 2023, at 7:55 PM, Ningzhi Xie <nzxie at uw.edu> wrote:
> 
> ?
> Dear College,
> 
> I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice a 460?m sapphire (Al2O3) wafer. It seems the wafer is too hard that I get into trouble of frequently breaking the dicing blade. I have tried lowing the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut into half of the wafer (230?m) but still got the blade broken. I am wondering if you have any good suggestions on sapphire wafer dicing.
> 
> Thank you very much.
> 
> Best regards,
> Ningzhi Xie
> Department of Electrical and Computer Engineering
> University of Washington
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork

From demis at ucsb.edu  Fri Jul 14 21:50:45 2023
From: demis at ucsb.edu (Demis D. John)
Date: Fri, 14 Jul 2023 18:50:45 -0700
Subject: [labnetwork] Dicing sapphire wafer
In-Reply-To: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>
References: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>
Message-ID: <CAKrtPjoSPCGnJ+nb1x4sWWPHVTZ0X-csp1jgpp=mO-KqUO0MZQ@mail.gmail.com>

We commonly have that issue with thick (?400?m) sapphire.
Even with good water jet cooling (critical to check that alignment), large
grit blades (or the vitreous blades you're using), and slow cut speeds -
the blades still break every ~8-15 cuts (we got this many cuts per blade
with various experimentation).
Disco did say those vitreous blades are supposed to last longer than
resnoid, but we didn't have enough demo blades to really test it out
efficiently, and didn't yet find parameters where they are outlasting our
resnoid blades.

A common solution include half-cutting the wafer (going only halfway into
the wafer), then full-cutting the wafer on a separate pass.  We still have
to set the program to check the blade every 1-2 cuts, as it wears and
breaks eventually, and it takes a *very* long time to complete the wafer in
this way, so we just do full-cutting and change blades when it wears down
too much (via automatic checking on our ADT) - it was actually faster this
way for us, but I guess it potentially consumes the resnoid blades faster.
-- Demis (contact info <https://wiki.nanotech.ucsb.edu/wiki/Demis_D._John>)
*Reminder*: The NanoFab has a publications policy
<https://wiki.nanotech.ucsb.edu/wiki/Frequently_Asked_Questions#Publications_acknowledging_the_Nanofab>


On Fri, Jul 14, 2023 at 4:57?PM Ningzhi Xie <nzxie at uw.edu> wrote:

> Dear College,
>
> I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice
> a 460?m sapphire (Al2O3) wafer. It seems the wafer is too hard that I get
> into trouble of frequently breaking the dicing blade. I have tried lowing
> the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut into
> half of the wafer (230?m) but still got the blade broken. I am wondering if
> you have any good suggestions on sapphire wafer dicing.
>
> Thank you very much.
>
> Best regards,
> Ningzhi Xie
> Department of Electrical and Computer Engineering
> University of Washington
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From christophe.clement at polymtl.ca  Sat Jul 15 06:43:54 2023
From: christophe.clement at polymtl.ca (Christophe =?utf-8?Q?Cl=C3=A9ment?=)
Date: Sat, 15 Jul 2023 06:43:54 -0400 (EDT)
Subject: [labnetwork] Dicing sapphire wafer
In-Reply-To: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>
References: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>
Message-ID: <1298238230.16280351.1689417834636.JavaMail.zimbra@polymtl.ca>

Hi Ningzhi 
We dice sapphire wafer at Poly using a resinoid blade, grit size of 45 microns minimum (sometime 75 microns), cutting speed lower than your at 0.4 mm/s, spindle speed at 22 KRPM and we don't have issue. 
Sample thickness is the same as yours, and we cut it in one pass. 

Hope this help 
Best 
Chris 



Christophe Cl?ment 

Technicien laboratoire 

Laboratoire de microfabrication (LMF) 

Groupe des Couches Minces (GCM) [ http://www.gcmlab.ca/ | www.gcmlab.ca ] 


Ecole Polytechnique de Montr?al [ http://www.polymtl.ca/ | www.polymtl.ca ] 


D?partement de g?nie physique 

* 2900 Boulevard Edouard Monpetit 

Pavillon JAB 
Campus de l'Universit? de Montr?al 
Montr?al (Qu?bec) H3T 1J4 


8 [ mailto:christophe.clement at polymtl.ca | christophe.clement at polymtl.ca ] 


( 514 340 4711 #2417 

Fax : 514 340 5195 






De: "Ningzhi Xie" <nzxie at uw.edu> 
?: labnetwork at mtl.mit.edu 
Envoy?: Vendredi 14 Juillet 2023 19:08:20 
Objet: [labnetwork] Dicing sapphire wafer 

Dear College, 
I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice a 460?m sapphire (Al2O3) wafer. It seems the wafer is too hard that I get into trouble of frequently breaking the dicing blade. I have tried lowing the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut into half of the wafer (230?m) but still got the blade broken. I am wondering if you have any good suggestions on sapphire wafer dicing. 

Thank you very much. 

Best regards, 
Ningzhi Xie 
Department of Electrical and Computer Engineering 
University of Washington 

_______________________________________________ 
labnetwork mailing list 
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From v.r.adineh at gmail.com  Sun Jul 16 20:51:46 2023
From: v.r.adineh at gmail.com (Vahid R. Adineh)
Date: Mon, 17 Jul 2023 10:51:46 +1000
Subject: [labnetwork] Dicing sapphire wafer
In-Reply-To: <2EF2CE86-A2E7-4D73-9EFB-87B8B2DE66E2@cns.fas.harvard.edu>
References: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>
 <2EF2CE86-A2E7-4D73-9EFB-87B8B2DE66E2@cns.fas.harvard.edu>
Message-ID: <CABPY1FOEUmzbrU_0Ae7UOm8NPFKXQ+yu+XrqqE6KG9TiFoubsg@mail.gmail.com>

Dear Ningzhi,

Regarding your inquiry about sapphire cutting, our current practice
involves setting a depth of <0.2mm per cut (e.g., 3-pass cuts for a 0.5mm
thickness sapphire wafer) with a spindle revolution of 15K and a cutting
speed of 1 mm/s. To minimise blade vibrations, we utilise blades with
smaller outer diameters, specifically the P1A851 SDC320R10MB01 (52x0.3x40)
for sapphire wafers.

We are currently equipped with the DAD3350, which incorporates automatic
blade dressing. However, in the past, when using the DAD321, we were
performing manual blade dressing after every 5 cuts. This involved
unloading the sapphire wafer after 5 cuts, performing the blade dressing on
a dressing board installed on a separate tape, reloading the sapphire
wafer, and then resuming the dicing process.

I hope this information proves helpful to you.

Thank you,
Vahid


On Sat, Jul 15, 2023 at 10:42?PM Deng, Jiangdong <jdeng at cns.fas.harvard.edu>
wrote:

> 1mm/s is too fast for sapphire. Typically we use 0.1 or 0.2 mm/s and 20k
> RPM. Blade thickness should be 0.3 mm ( no thinner than 0.2 mm). Please
> also check the disco service, and they usually will give you very good
> suggestions.
>
> -JD @ CNS of Harvard
>
> Sent from my iPhone
>
> > On Jul 14, 2023, at 7:55 PM, Ningzhi Xie <nzxie at uw.edu> wrote:
> >
> > ?
> > Dear College,
> >
> > I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to
> dice a 460?m sapphire (Al2O3) wafer. It seems the wafer is too hard that I
> get into trouble of frequently breaking the dicing blade. I have tried
> lowing the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut
> into half of the wafer (230?m) but still got the blade broken. I am
> wondering if you have any good suggestions on sapphire wafer dicing.
> >
> > Thank you very much.
> >
> > Best regards,
> > Ningzhi Xie
> > Department of Electrical and Computer Engineering
> > University of Washington
> > _______________________________________________
> > labnetwork mailing list
> > labnetwork at mtl.mit.edu
> > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From hollingshead.19 at osu.edu  Mon Jul 17 10:58:39 2023
From: hollingshead.19 at osu.edu (Hollingshead, Dave)
Date: Mon, 17 Jul 2023 14:58:39 +0000
Subject: [labnetwork] Dicing sapphire wafer
In-Reply-To: <CABPY1FOEUmzbrU_0Ae7UOm8NPFKXQ+yu+XrqqE6KG9TiFoubsg@mail.gmail.com>
References: <CACHUCwJfbFp2ZJyZY8THMkeNuUff-FY-4fxgLNHzcYjm5S3+BQ@mail.gmail.com>
 <2EF2CE86-A2E7-4D73-9EFB-87B8B2DE66E2@cns.fas.harvard.edu>
 <CABPY1FOEUmzbrU_0Ae7UOm8NPFKXQ+yu+XrqqE6KG9TiFoubsg@mail.gmail.com>
Message-ID: <SA1PR01MB65449402854252833FB461E6F33BA@SA1PR01MB6544.prod.exchangelabs.com>

Hi Ningzhi,

We dice sapphire quite a bit. Our dicing owner had the following comments (we have an ADT 7122):

We have had good luck dicing sapphire with the following recipe:
Feed rate = 1mm/sec
Spindle Speed = 18krpm
Cut depth = 200um/pass.
I have not had great luck with Disco resin blades for dicing sapphire.  We typically use ADT or Asahi resin blades.

A couple questions:
What is the OD of the blade?
Is the spray water positioned correctly on the blade as it is cutting?  (not enough cooling, too much heat = increased blade load and wear)
Is the substrate round or rectangular?  Substrate diameter/dimensions?
How far outside the substate edge does the blade begin the cutting process?  (typical is 10mm)

-Dave
Dave Hollingshead
Manager, Research Operations

The Ohio State University
Nanotech West Labs
Suite 100, 1381 Kinnear Rd, Columbus, OH 43212
614.292.1355 Office
hollingshead.19 at osu.edu<mailto:hollingshead.19 at osu.edu> / nanotech.osu.edu<http://nanotech.osu.edu>

Pronouns: he/him/his


From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Vahid R. Adineh
Sent: Sunday, July 16, 2023 20:52
To: Ningzhi Xie <nzxie at uw.edu>
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Dicing sapphire wafer

Dear Ningzhi, Regarding your inquiry about sapphire cutting, our current practice involves setting a depth of <0.?2mm per cut (e.?g.?, 3-pass cuts for a 0.?5mm thickness sapphire wafer) with a spindle revolution of 15K and a cutting speed of

Dear Ningzhi,

Regarding your inquiry about sapphire cutting, our current practice involves setting a depth of <0.2mm per cut (e.g., 3-pass cuts for a 0.5mm thickness sapphire wafer) with a spindle revolution of 15K and a cutting speed of 1 mm/s. To minimise blade vibrations, we utilise blades with smaller outer diameters, specifically the P1A851 SDC320R10MB01 (52x0.3x40) for sapphire wafers.

We are currently equipped with the DAD3350, which incorporates automatic blade dressing. However, in the past, when using the DAD321, we were performing manual blade dressing after every 5 cuts. This involved unloading the sapphire wafer after 5 cuts, performing the blade dressing on a dressing board installed on a separate tape, reloading the sapphire wafer, and then resuming the dicing process.

I hope this information proves helpful to you.

Thank you,
Vahid


On Sat, Jul 15, 2023 at 10:42?PM Deng, Jiangdong <jdeng at cns.fas.harvard.edu<mailto:jdeng at cns.fas.harvard.edu>> wrote:
1mm/s is too fast for sapphire. Typically we use 0.1 or 0.2 mm/s and 20k RPM. Blade thickness should be 0.3 mm ( no thinner than 0.2 mm). Please also check the disco service, and they usually will give you very good suggestions.

-JD @ CNS of Harvard

Sent from my iPhone

> On Jul 14, 2023, at 7:55 PM, Ningzhi Xie <nzxie at uw.edu<mailto:nzxie at uw.edu>> wrote:
>
> ?
> Dear College,
>
> I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice a 460?m sapphire (Al2O3) wafer. It seems the wafer is too hard that I get into trouble of frequently breaking the dicing blade. I have tried lowing the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut into half of the wafer (230?m) but still got the blade broken. I am wondering if you have any good suggestions on sapphire wafer dicing.
>
> Thank you very much.
>
> Best regards,
> Ningzhi Xie
> Department of Electrical and Computer Engineering
> University of Washington
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork<https://urldefense.com/v3/__https:/mtl.mit.edu/mailman/listinfo.cgi/labnetwork__;!!KGKeukY!1p8_UUGS7UAWqbkMwafHz-Mkod679hyisNIOY86TQ1HQs7z-3UgFT38HxAxrDQSdcTCAL-gLWsXcaL4Fet12apF1zQ$>
_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork<https://urldefense.com/v3/__https:/mtl.mit.edu/mailman/listinfo.cgi/labnetwork__;!!KGKeukY!1p8_UUGS7UAWqbkMwafHz-Mkod679hyisNIOY86TQ1HQs7z-3UgFT38HxAxrDQSdcTCAL-gLWsXcaL4Fet12apF1zQ$>
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From hathaway at cns.fas.harvard.edu  Tue Jul 18 17:51:55 2023
From: hathaway at cns.fas.harvard.edu (Hathaway, Malcolm R)
Date: Tue, 18 Jul 2023 21:51:55 +0000
Subject: [labnetwork] TTIP Cylinder Overheated - Request for Advise
Message-ID: <MN2PR07MB6526683338D9DA35ACD0C64ECB38A@MN2PR07MB6526.namprd07.prod.outlook.com>

Hey all,

We (not CNS, but another lab) have an issue with a TTIP cylinder (Cambridge Nano/swagelok-style) which got over-heated to an unknown temp, whereupon the bottle acquired a bulge.  It was closed at the time, and so is still under pressure to an unknown degree.  The bottle label melted, for reference.

Questions:

Are the contents likely to be decomposition products?
Would these products be flammable or explosive?
Can a bottle burst under the flexural stress of slow depressurization?
Is there a safe way to depressurize?

We came up with the idea of attaching a second valve (these are all VCR), and alternating opening inner valve (then closing) and opening outer valve (then closing), to step-wise vent the bottle.  Has anyone heard of such a technique causing the bottle to burst along the way?

Suggestion welcome.


Mac

--

Mac Hathaway

Senior Process and Systems Engineer

Harvard Center for Nanoscale Systems

11 Oxford St.

Cambridge, MA  02138

617-495-9012

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From s.etienne at ucl.ac.uk  Wed Jul 19 04:29:09 2023
From: s.etienne at ucl.ac.uk (Etienne, Steve)
Date: Wed, 19 Jul 2023 08:29:09 +0000
Subject: [labnetwork] Job opportunity in London
Message-ID: <PA4PR01MB933115A90E879C3261C4E2ADB939A@PA4PR01MB9331.eurprd01.prod.exchangelabs.com>

Hi everyone,
I'd like to make you aware of this position available at UCL.
https://www.ucl.ac.uk/work-at-ucl/search-ucl-jobs/details?jobId=12592&jobTitle=Cleanroom+Manager

Best Regards
Steve

Stephen Etienne | Cleanroom Manager
I retire at end of July 2023, and my current email will become inactive.
Please use lcn.crteam at ucl.ac.uk<mailto:lcn.crteam at ucl.ac.uk> for ongoing communications.
London Centre for Nanotechnology | UCL | 17-19 Gordon Street | London | WC1H 0AH
Tel: +44 (0)207 679 2570 | www.london-nano.com<http://www.london-nano.com> lcn.crteam at ucl.ac.uk<mailto:lcn.crteam at ucl.ac.uk>

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From deonc69 at illinois.edu  Thu Jul 20 14:55:00 2023
From: deonc69 at illinois.edu (Collins, Deon)
Date: Thu, 20 Jul 2023 18:55:00 +0000
Subject: [labnetwork] TTIP Cylinder Overheated - Request for Advise
In-Reply-To: <MN2PR07MB6526683338D9DA35ACD0C64ECB38A@MN2PR07MB6526.namprd07.prod.outlook.com>
References: <MN2PR07MB6526683338D9DA35ACD0C64ECB38A@MN2PR07MB6526.namprd07.prod.outlook.com>
Message-ID: <DM6PR11MB31622313B095B7441827AA21D73EA@DM6PR11MB3162.namprd11.prod.outlook.com>

I would have the bottle disposed of ASAP. The structural integrity of the cylinder has been compromised.

Deon D. Collins

FACILITY MANAGER
The Grainger College Of Engineering UIUC
Holonyak Micro & Nanotechnology Lab
208 N Wright St Rm. 1114 | MC-249
Urbana, IL 61801
217-300-7531 | deonc69 at illinois.edu<mailto:deonc69 at illinois.edu>


[cid:image001.png at 01D9BB11.CB783070]<http://illinois.edu/>

Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure.

Life is not about watching other people live it. It's about you living your own!

From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Hathaway, Malcolm R
Sent: Tuesday, July 18, 2023 4:52 PM
To: Labnetwork Mailing List <labnetwork at mtl.mit.edu>
Subject: [labnetwork] TTIP Cylinder Overheated - Request for Advise

Hey all,

We (not CNS, but another lab) have an issue with a TTIP cylinder (Cambridge Nano/swagelok-style) which got over-heated to an unknown temp, whereupon the bottle acquired a bulge.  It was closed at the time, and so is still under pressure to an unknown degree.  The bottle label melted, for reference.

Questions:

Are the contents likely to be decomposition products?
Would these products be flammable or explosive?
Can a bottle burst under the flexural stress of slow depressurization?
Is there a safe way to depressurize?

We came up with the idea of attaching a second valve (these are all VCR), and alternating opening inner valve (then closing) and opening outer valve (then closing), to step-wise vent the bottle.  Has anyone heard of such a technique causing the bottle to burst along the way?

Suggestion welcome.


Mac
--

Mac Hathaway

Senior Process and Systems Engineer

Harvard Center for Nanoscale Systems

11 Oxford St.

Cambridge, MA  02138

617-495-9012

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From hathaway at cns.fas.harvard.edu  Thu Jul 20 17:17:56 2023
From: hathaway at cns.fas.harvard.edu (Hathaway, Malcolm R)
Date: Thu, 20 Jul 2023 21:17:56 +0000
Subject: [labnetwork] TTIP Cylinder Overheated - Request for Advise
In-Reply-To: <DM6PR11MB31622313B095B7441827AA21D73EA@DM6PR11MB3162.namprd11.prod.outlook.com>
References: <MN2PR07MB6526683338D9DA35ACD0C64ECB38A@MN2PR07MB6526.namprd07.prod.outlook.com>
 <DM6PR11MB31622313B095B7441827AA21D73EA@DM6PR11MB3162.namprd11.prod.outlook.com>
Message-ID: <MN2PR07MB65264DF81E5485249E5A474CCB3EA@MN2PR07MB6526.namprd07.prod.outlook.com>

Hello All,

Thanks for all the good comments and suggestions.

As several of you (and our own EHS) suggested, we have entrusted the cylinder to our toxic waste removal company.  We are still a bit leery of sending out a potentially pressurized cylinder (albeit a small one) to be disposed of by possibly rough methods, but that is what was recommended.

If we hear any additional news about it's final disposition, I'll be sure to let everyone know.

Again, thanks for all the help and good recommendations.


Mac Hathaway
Harvard CNS
________________________________
From: Collins, Deon <deonc69 at illinois.edu>
Sent: Thursday, July 20, 2023 2:55 PM
To: Hathaway, Malcolm R <hathaway at cns.fas.harvard.edu>; Labnetwork Mailing List <labnetwork at mtl.mit.edu>
Subject: RE: TTIP Cylinder Overheated - Request for Advise


I would have the bottle disposed of ASAP. The structural integrity of the cylinder has been compromised.



Deon D. Collins

FACILITY MANAGER

The Grainger College Of Engineering UIUC
Holonyak Micro & Nanotechnology Lab
208 N Wright St Rm. 1114 | MC-249
Urbana, IL 61801
217-300-7531 | deonc69 at illinois.edu<mailto:deonc69 at illinois.edu>


[cid:image001.png at 01D9BB11.CB783070]<https://urldefense.proofpoint.com/v2/url?u=http-3A__illinois.edu_&d=DwMFAg&c=WO-RGvefibhHBZq3fL85hQ&r=TEMLD8-VsxCGtcVzmvpT5GFNSczskEKHzW6aYlttmIY&m=wKh5IaW_zJ47QtJc_gJB7KADU4iVKhTLPNvAJcBwib6sh6GCXl6dcFxtk6p2tW0l&s=1fiZOZKoqeq5dJhdI9XjRNy515EOWxbLNsIiebZ_GiQ&e=>

Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure.



Life is not about watching other people live it. It?s about you living your own!



From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Hathaway, Malcolm R
Sent: Tuesday, July 18, 2023 4:52 PM
To: Labnetwork Mailing List <labnetwork at mtl.mit.edu>
Subject: [labnetwork] TTIP Cylinder Overheated - Request for Advise



Hey all,

We (not CNS, but another lab) have an issue with a TTIP cylinder (Cambridge Nano/swagelok-style) which got over-heated to an unknown temp, whereupon the bottle acquired a bulge.  It was closed at the time, and so is still under pressure to an unknown degree.  The bottle label melted, for reference.

Questions:

Are the contents likely to be decomposition products?
Would these products be flammable or explosive?
Can a bottle burst under the flexural stress of slow depressurization?
Is there a safe way to depressurize?

We came up with the idea of attaching a second valve (these are all VCR), and alternating opening inner valve (then closing) and opening outer valve (then closing), to step-wise vent the bottle.  Has anyone heard of such a technique causing the bottle to burst along the way?

Suggestion welcome.


Mac

--

Mac Hathaway

Senior Process and Systems Engineer

Harvard Center for Nanoscale Systems

11 Oxford St.

Cambridge, MA  02138

617-495-9012


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From manuel.lozano at csic.es  Mon Jul 24 06:37:58 2023
From: manuel.lozano at csic.es (Manuel Lozano)
Date: Mon, 24 Jul 2023 12:37:58 +0200
Subject: [labnetwork] SiC wafers processed in AMI P500
Message-ID: <d761f2b0-0f69-435d-3bc1-4ce663c6ea95@csic.es>

Dear Colleagues,

we have an old Applied Materials P500 LPCVD that we use for SiO2 deposition. The robotic arm is intended for 6 inches wafers. We have been using it with 4 inches SiC wafers for many years using a pocket wafer, we etched a 4 inches pocket on a 6 inches Si wafer, and that worked perfectly.

We have now moved to 6 inches SiC wafers, therefore we do not need the pocket wafer more. Nevertheless, when we tried to process the wafers directly we discovered that the robotic arm does not recognize the presence of the wafer, as SiC is transparent, and refuses to load them.

We tried using different materials deposited in the backside to make the wafer opaque (resist, metal, polysilicon), but the result is not satisfactory as the quality of the surface is degraded.

The equipment is very old and it is not longer maintained by AMI, so we can not ask for reprogramming? the robot software.

Does any of you have experience with processing transparent wafer with robotic arms? Do you foresee any solution?

We will appreciate any suggestion

Best regards

Manuel


----------------------------------------------------------------------------------
Prof. Manuel Lozano
Centro Nacional de Microelectronica IMB-CNM (CSIC)
Campus UAB, C/ Til?lers, s/n
08193 Bellaterra, Barcelona, Spain
tel.: +34 93 594 77 00 ext. 2120
email: manuel.lozano at csic.es
----------------------------------------------------------------------------------


From Peter.Lomax at ed.ac.uk  Mon Jul 24 09:00:53 2023
From: Peter.Lomax at ed.ac.uk (Peter Lomax)
Date: Mon, 24 Jul 2023 13:00:53 +0000
Subject: [labnetwork] SiC wafers processed in AMI P500
In-Reply-To: <d761f2b0-0f69-435d-3bc1-4ce663c6ea95@csic.es>
References: <d761f2b0-0f69-435d-3bc1-4ce663c6ea95@csic.es>
Message-ID: <PAVPR05MB99046F4FE36DAF0387C101F9C802A@PAVPR05MB9904.eurprd05.prod.outlook.com>

Hi,

On our STS PECVD for transparent material we have to cheat and put a piece of tin foil over the sensor.

Best

Peter

-----Original Message-----
From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Manuel Lozano
Sent: 24 July 2023 11:38
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] SiC wafers processed in AMI P500

This email was sent to you by someone outside the University.
You should only click on links or attachments if you are certain that the email is genuine and the content is safe.

Dear Colleagues,

we have an old Applied Materials P500 LPCVD that we use for SiO2 deposition. The robotic arm is intended for 6 inches wafers. We have been using it with 4 inches SiC wafers for many years using a pocket wafer, we etched a 4 inches pocket on a 6 inches Si wafer, and that worked perfectly.

We have now moved to 6 inches SiC wafers, therefore we do not need the pocket wafer more. Nevertheless, when we tried to process the wafers directly we discovered that the robotic arm does not recognize the presence of the wafer, as SiC is transparent, and refuses to load them.

We tried using different materials deposited in the backside to make the wafer opaque (resist, metal, polysilicon), but the result is not satisfactory as the quality of the surface is degraded.

The equipment is very old and it is not longer maintained by AMI, so we can not ask for reprogramming  the robot software.

Does any of you have experience with processing transparent wafer with robotic arms? Do you foresee any solution?

We will appreciate any suggestion

Best regards

Manuel


----------------------------------------------------------------------------------
Prof. Manuel Lozano
Centro Nacional de Microelectronica IMB-CNM (CSIC) Campus UAB, C/ Til?lers, s/n
08193 Bellaterra, Barcelona, Spain
tel.: +34 93 594 77 00 ext. 2120
email: manuel.lozano at csic.es
----------------------------------------------------------------------------------

_______________________________________________
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From vk409 at soe.rutgers.edu  Mon Jul 24 13:12:18 2023
From: vk409 at soe.rutgers.edu (Vibhor Kumar)
Date: Mon, 24 Jul 2023 17:12:18 +0000
Subject: [labnetwork] Sparkles in the PECVD deposited amorphous silicon film
Message-ID: <DM6PR14MB3225B4BE50E5200039CE8A8CA702A@DM6PR14MB3225.namprd14.prod.outlook.com>

Dear labnetwork community,
We are trying to deposit a-si (~100 nm) with plasmatherm PECVD. We are using 10% silane. Our recipe worked fine in the past. But this time we started looking some "sparkles" in the deposited film (image attached). We cleaned the chamber with freon gas, but still the situation is the same.

Any suggestion/s will be highly appreciated.

Sincerely,
-Vibhor Kumar-
Research Associate,
School of Engineering,
Rutgers, The State University of New Jersey, NJ
USA.
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From clark at cnf.cornell.edu  Mon Jul 24 18:35:35 2023
From: clark at cnf.cornell.edu (Jeremy Clark)
Date: Mon, 24 Jul 2023 18:35:35 -0400
Subject: [labnetwork] Sparkles in the PECVD deposited amorphous silicon
 film
In-Reply-To: <DM6PR14MB3225B4BE50E5200039CE8A8CA702A@DM6PR14MB3225.namprd14.prod.outlook.com>
References: <DM6PR14MB3225B4BE50E5200039CE8A8CA702A@DM6PR14MB3225.namprd14.prod.outlook.com>
Message-ID: <8f205bc8-af15-d8b2-8d8e-820fd7a170ca@cnf.cornell.edu>

Hi Vibhor,


You should look under a microscope but these look like bubbles- either 
from poor adhesion or too much Hydrogen in the film (or both).


How did you clean your sample before deposition?

What is the underlying material, and is it possible it has changed?

Is possible that some part of the tool was changed recently?


Regards,

Jeremy Clark

Cornell Nanoscale Facility


On 7/24/23 13:12, Vibhor Kumar wrote:
> Dear labnetwork community,
> We are trying to deposit a-si (~100 nm) with plasmatherm PECVD. We are 
> using 10% silane. Our recipe worked fine in the past. But this time we 
> started looking some "sparkles" in the deposited film (image 
> attached). We cleaned the chamber with freon gas, but still the 
> situation is the same.
>
> Any suggestion/s will be highly appreciated.
>
> Sincerely,
> -Vibhor Kumar-
> Research Associate,
> School of Engineering,
> Rutgers, The State University of New Jersey, NJ
> USA.
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From odc1n08 at soton.ac.uk  Tue Jul 25 03:00:48 2023
From: odc1n08 at soton.ac.uk (Owain Clark)
Date: Tue, 25 Jul 2023 07:00:48 +0000
Subject: [labnetwork] Sparkles in the PECVD deposited amorphous silicon
 film
In-Reply-To: <8f205bc8-af15-d8b2-8d8e-820fd7a170ca@cnf.cornell.edu>
References: <DM6PR14MB3225B4BE50E5200039CE8A8CA702A@DM6PR14MB3225.namprd14.prod.outlook.com>
 <8f205bc8-af15-d8b2-8d8e-820fd7a170ca@cnf.cornell.edu>
Message-ID: <CWXP265MB4876A3F17E29916FC90C100DB003A@CWXP265MB4876.GBRP265.PROD.OUTLOOK.COM>

Looks like compressive stress.

Improve the sample pre-cleaning as suggested or try depositing onto SiO2 and the adhesion should improve.

O.

From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Jeremy Clark
Sent: 24 July 2023 23:36
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Sparkles in the PECVD deposited amorphous silicon film

CAUTION: This e-mail originated outside the University of Southampton.

Hi Vibhor,



You should look under a microscope but these look like bubbles- either from poor adhesion or too much Hydrogen in the film (or both).



How did you clean your sample before deposition?

What is the underlying material, and is it possible it has changed?

Is possible that some part of the tool was changed recently?



Regards,

Jeremy Clark

Cornell Nanoscale Facility


On 7/24/23 13:12, Vibhor Kumar wrote:
Dear labnetwork community,
We are trying to deposit a-si (~100 nm) with plasmatherm PECVD. We are using 10% silane. Our recipe worked fine in the past. But this time we started looking some "sparkles" in the deposited film (image attached). We cleaned the chamber with freon gas, but still the situation is the same.

Any suggestion/s will be highly appreciated.

Sincerely,
-Vibhor Kumar-
Research Associate,
School of Engineering,
Rutgers, The State University of New Jersey, NJ
USA.



_______________________________________________

labnetwork mailing list

labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>

https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From Peter.Lomax at ed.ac.uk  Tue Jul 25 04:36:59 2023
From: Peter.Lomax at ed.ac.uk (Peter Lomax)
Date: Tue, 25 Jul 2023 08:36:59 +0000
Subject: [labnetwork] Sparkles in the PECVD deposited amorphous silicon
 film
In-Reply-To: <DM6PR14MB3225B4BE50E5200039CE8A8CA702A@DM6PR14MB3225.namprd14.prod.outlook.com>
References: <DM6PR14MB3225B4BE50E5200039CE8A8CA702A@DM6PR14MB3225.namprd14.prod.outlook.com>
Message-ID: <PAVPR05MB9904EB4700CFEBB669F8B295C803A@PAVPR05MB9904.eurprd05.prod.outlook.com>

We add Argon to our recipe - can check the details if of interest.

Best

Peter

From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Vibhor Kumar
Sent: 24 July 2023 18:12
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Sparkles in the PECVD deposited amorphous silicon film

This email was sent to you by someone outside the University.
You should only click on links or attachments if you are certain that the email is genuine and the content is safe.
Dear labnetwork community,
We are trying to deposit a-si (~100 nm) with plasmatherm PECVD. We are using 10% silane. Our recipe worked fine in the past. But this time we started looking some "sparkles" in the deposited film (image attached). We cleaned the chamber with freon gas, but still the situation is the same.

Any suggestion/s will be highly appreciated.

Sincerely,
-Vibhor Kumar-
Research Associate,
School of Engineering,
Rutgers, The State University of New Jersey, NJ
USA.
The University of Edinburgh is a charitable body, registered in Scotland, with registration number SC005336. Is e buidheann carthannais a th' ann an Oilthigh Dh?n ?ideann, cl?raichte an Alba, ?ireamh cl?raidh SC005336.
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From danielboyd499 at yahoo.com  Wed Jul 26 11:09:01 2023
From: danielboyd499 at yahoo.com (Daniel Boyd)
Date: Wed, 26 Jul 2023 11:09:01 -0400
Subject: [labnetwork] JEOL JSM-5800LV Repair Help Needed
Message-ID: <911963863.843698.1690384275452@yahoo.com>

I am an undergraduate research student at Anderson University in South Carolina US and I am working on repairing a JEOL JSM-5800LV. The SEM was donated from FUJI Films lab and was operational just a few years ago and was replaced with a new system. The guy that picked up the machine cut all of the wires between the control unit and the microscope unit instead of unplugging cords and now I am trying to wire it back together. Most cables were labeled but many lost their labels in the moving process. I also was never given the key to start the machine making it very difficult to troubleshoot. I have tried looking online to buy a replacement but the model is so old I can not find it anywhere. If anyone could help me find a replacement key or perhaps have an old key to the same machine that I could copy that would be enormously helpful. Also any suggestions on how to repair the wires would be helpful. If someone has experience with the machine I can send some pictures if that would be helpful. Any advice or suggestions would be very appreciated.

Sent from Mail for Windows



-- 
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From rober074 at umn.edu  Thu Jul 27 10:54:09 2023
From: rober074 at umn.edu (Kevin Roberts)
Date: Thu, 27 Jul 2023 09:54:09 -0500
Subject: [labnetwork] Frontier Semiconductor FSM laser replacement
Message-ID: <CA+Bu-4qGCRSJzSX1VS2MMtaqpM5nvpzvHOM6HZfnks8v9ueLFw@mail.gmail.com>

Hello,

We have a 1998 FSM 900tc-vac stress measurement system. Its 750 nm laser
diode died recently, and its 810 nm laser diode died years ago.

I'd very much like to repair it however, and keep using it, as it is very
versatile, and something of a Cadillac model.

I was told years ago that if the last laser died, then we'd have to
consider the machine's life over, but I don't recall the details as to
'why'.

Has anyone ever replaced their laser diodes on a vintage FSM, and were you
successful in getting it to work again?

Also, does anyone have a good service person's contact at FSM? It's been
like 20 years since I've talked to service there, and I'm not sure who to
run my question by.

Thanks so much.

Regards,
Kevin

-- 

Kevin Roberts
Staff Scientist
Minnesota Nano Center
University of Minnesota
140 Physics & Nanotechnology Bldg.
115 Union St. SE
Minneapolis, MN 55455
rober074 at umn.edu
612-624-7092 direct
612-625-5012 fax
http://www.mnc.umn.edu

 <http://www.nnin.org/>
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