[labnetwork] Dicing sapphire wafer

[Vahid R. Adineh]

Dear Ningzhi,

Regarding your inquiry about sapphire cutting, our current practice
involves setting a depth of <0.2mm per cut (e.g., 3-pass cuts for a 0.5mm
thickness sapphire wafer) with a spindle revolution of 15K and a cutting
speed of 1 mm/s. To minimise blade vibrations, we utilise blades with
smaller outer diameters, specifically the P1A851 SDC320R10MB01 (52x0.3x40)
for sapphire wafers.

We are currently equipped with the DAD3350, which incorporates automatic
blade dressing. However, in the past, when using the DAD321, we were
performing manual blade dressing after every 5 cuts. This involved
unloading the sapphire wafer after 5 cuts, performing the blade dressing on
a dressing board installed on a separate tape, reloading the sapphire
wafer, and then resuming the dicing process.

I hope this information proves helpful to you.

Thank you,
Vahid


On Sat, Jul 15, 2023 at 10:42 PM Deng, Jiangdong <jdeng at cns.fas.harvard.edu>
wrote:

> 1mm/s is too fast for sapphire. Typically we use 0.1 or 0.2 mm/s and 20k
> RPM. Blade thickness should be 0.3 mm ( no thinner than 0.2 mm). Please
> also check the disco service, and they usually will give you very good
> suggestions.
>
> -JD @ CNS of Harvard
>
> Sent from my iPhone
>
> > On Jul 14, 2023, at 7:55 PM, Ningzhi Xie <nzxie at uw.edu> wrote:
> >
> > 
> > Dear College,
> >
> > I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to
> dice a 460μm sapphire (Al2O3) wafer. It seems the wafer is too hard that I
> get into trouble of frequently breaking the dicing blade. I have tried
> lowing the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut
> into half of the wafer (230μm) but still got the blade broken. I am
> wondering if you have any good suggestions on sapphire wafer dicing.
> >
> > Thank you very much.
> >
> > Best regards,
> > Ningzhi Xie
> > Department of Electrical and Computer Engineering
> > University of Washington
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