From rlc12 at cornell.edu Mon May 1 11:18:37 2023 From: rlc12 at cornell.edu (Rebecca Lee Vliet) Date: Mon, 1 May 2023 15:18:37 +0000 Subject: [labnetwork] REMINDER: Registration is open for the June 2023 CNF TCN Short Course Message-ID: Please post the attached flyer as well as share the announcement below with other members of the scientific communities. Thank you! CNF Technology & Characterization at the Nanoscale (CNF TCN) IN-PERSON Short Course June 6, 2022 - June 9, 2023 The CNF TCN will be held in-person Tuesday, June 6, 2023 - Friday, June 10, 2023. Each day offers lectures and laboratory demonstrations designed to impart a broad understanding of the science and technology required to undertake research in nanoscience. TCN is an ideal way for faculty, students, post docs and staff members to rapidly come up to speed in many of the technologies that users of the CNF need to employ. Members of the high tech business community will also find it an effective way to learn best practices for success in a nanofab environment. Attendance is open to the general scientific community. Note: The short course does not replace the three part training required to become a user of our facility. To become a CNF user, please visit the "Getting Started" link (https:cnf.cornell.edu/howto) on the CNF website. For more information and to register visit: https://cnf.cornell.edu/education/tcn [Text Description automatically generated] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.jpg Type: image/jpeg Size: 146975 bytes Desc: image001.jpg URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: REGISTER_JUNE-2023.jpg Type: image/jpeg Size: 146975 bytes Desc: REGISTER_JUNE-2023.jpg URL: From jdthompson at princeton.edu Mon May 1 13:45:25 2023 From: jdthompson at princeton.edu (Jeff Thompson) Date: Mon, 1 May 2023 13:45:25 -0400 Subject: [labnetwork] Job Opening at Princeton Message-ID: Dear Labnetwork members, Princeton University is seeking an inaugural Director to design, commission, and manage a new Quantum Cleanroom. As part of a broader investment in support of Princeton's world-leading research in quantum devices and materials, Princeton plans to construct a new cleanroom tailored to the exacting requirements of this field, supporting the fabrication of electronic and photonic devices in a wide range of materials including silicon, III-Vs, diamond, two-dimensional materials, and superconductors. The key aims of the facility are to maintain a high level of cleanliness and process control, and flexibility to meet the future needs of this rapidly changing field. This cleanroom will coexist with the general-purpose Micro-Nano Fabrication Center (MNFC) cleanroom housed in the Princeton Materials Institute. Successful candidates will have a strong vision for all aspects of the Quantum Cleanroom and deep technical knowledge of cleanroom processes and infrastructure. Excellent leadership and interpersonal skills will help foster a positive and productive culture for the Quantum Cleanroom, including effective relationships between the staff, student and postdoctoral researchers, external users, faculty, and administrators. The Director will work closely with faculty committees on the design of the facility and setting policies and priorities. The job posting is available at the link below, and I am available to answer any questions about the position. https://puwebp.princeton.edu/AcadHire/apply/application.xhtml?listingId=29165 Sincerely, Jeff Thompson Associate Professor Princeton University B328 Engineering Quadrangle Princeton, NJ 08544 (609) 258-6124 https://sites.google.com/site/thompsonlabq/home -------------- next part -------------- An HTML attachment was scrubbed... URL: From gilheart at rice.edu Mon May 1 16:10:47 2023 From: gilheart at rice.edu (Timothy J Gilheart) Date: Mon, 1 May 2023 15:10:47 -0500 Subject: [labnetwork] Fwd: [2023 Rice SIMS Workshop] Surface Analysis tutorials day at Rice University - Sept. 12-14, 2023 References: <010f01d97c66$c6e3b320$54ab1960$@rice.edu> Message-ID: Greetings Labnetwork colleagues, Please see below for the official announcement about the Surface Analysis and SIMS workshop we are hosting in at Rice in September, in partnership with the North American SIMS Society. Please share with students, faculty, and other colleagues who may be interested. ? Tim Gilheart, PhD (he/him) Director of Operations Shared Equipment Authority (SEA) | Rice University https://research.rice.edu/sea/ Mobile: 832-341-5488 | gilheart at rice.edu Office: 713-348-3159 | SST 016 > Greetings everyone, > > We are happy to share that the Shared Equipment Authority at Rice University is organizing a Surface Analysis tutorials day, on September 12, 2023, followed by a two-days workshop on SIMS techniques (D-SIMS, NanoSIMS and ToF-SIMS). > > The Surface Analysis tutorials day will be the perfect opportunity for students and for other SEA users to learn more about Scanning Probe Microscopy, XPS and Auger Electron Spectroscopy, Electron Microscopy, SIMS and X-ray techniques. > > 8 experts will present practical aspects of Surface Analysis and discuss in detail about the capabilities and the applications of these techniques. > > Students can present their work during the poster session with student awards totaling $5,000. They will have a chance to meet with experts from both academia and industry. > > Two vendors will be providing seminar and demo only for registered participants on September 11,2023: > > A software seminar is offered by Thermo Fisher Scientific for learning more about the brand-new Nexsa XPS instrument. > A demonstration is offered by Park Systems for discovering the latest features on the Park NX40 AFM instrument. > > In addition, a SIMS workshop (Sept. 13-14) is proposed for both experts and users to discover more about the applications of the SIMS techniques in Materials Science, in Polymer & Organic chemistry, in Medical & Bioengineering, and in Geology & Culture heritage. > > Abstract? deadline: June 1, 2023. Please use the link below to submit your abstract. > ? > Registration for general attendance is now open. Please use the link below to register for the meeting. > > !!! Go to Online Registration !!! > > Best regards, > > Tanguy > ?------------------------------------------------------------------------------------------------------------------------------- > Tanguy Terlier, Ph.D. > Research Scientist | ToF-SIMS Instrument Manager > Office +1-713-348-7831 ? Lab +1-713-348-6826 ? Mobile +1-832-998-1280 > Rice University SEA-MS 126 ? 104 Keith-Wiess Geological Lab > P.O. Box 1892 ? Houston, TX 77251-1892 ? https://research.rice.edu/sea/ ? http://simslab.rice.edu > ------------------------------------------------------------------------------------------------------------------------------- -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 27744 bytes Desc: not available URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image002.png Type: image/png Size: 96639 bytes Desc: not available URL: From scholvin at mit.edu Fri May 5 16:24:31 2023 From: scholvin at mit.edu (Jorg Scholvin) Date: Fri, 5 May 2023 20:24:31 +0000 Subject: [labnetwork] High temperature oxidation/anneal furnaces Message-ID: Hi Labnetwork: MIT.nano is looking to explore oxidation/anneal capabilities at 1500C (possibly even up to 2000C) for 6 and 8" wafers - to go beyond our regular 1100C furnaces range. Does anyone have similar systems in their lab that they can recommend? Both small batch or single wafer would be fine. Thanks! -Jorg -------------- next part -------------- An HTML attachment was scrubbed... URL: From info at fabsurplus.com Mon May 8 08:30:00 2023 From: info at fabsurplus.com (Stephen Howe) Date: Mon, 08 May 2023 14:30:00 +0200 Subject: [labnetwork] Manual requested for an STS 320 PC etcher Message-ID: <8fa3264bb9b721c2f1e0d0c3997cec8c28cc8f5c.camel@fabsurplus.com> Dear Lab Members, I am the owner of an STS 320 PC etching system. It has come to me without a manual. I was wondering if anyone could send me a copy of the operation and maintenance manual ? Thanks in advance. Yours sincerely, SDI Fabsurplus Italia SRL Stephen Howe Company Owner email: info at fabsurplus.com Mobile (Italy) : +39 335-710-7756 Mobile (USA) : +1 830-388-1071 WWW.FABSURPLUS.COM Your Marketplace for Used Semiconductor Equipment -------------- next part -------------- An HTML attachment was scrubbed... URL: From deolivei at ualberta.ca Tue May 9 16:13:24 2023 From: deolivei at ualberta.ca (Gustavo de Oliveira Luiz) Date: Tue, 9 May 2023 14:13:24 -0600 Subject: [labnetwork] Strange "sample memory" with LOR 5B In-Reply-To: References: Message-ID: Hello everyone, I just wanted to bring an update on this issue of ghosts when reworking wafers with LOR 5B, as well as give everyone a summary of the information the community provided since some of the replies seem to have been addressed to me only. *TL;DR: To get rid of the ghosts, O2 RIE for 5 min works but a barrel plasma asher for 20 min does not.* First the summary and some comments: - Some people suggested that developers may indeed etch the substrate and cause defects. While this may be true, and I saw that myself, this is not such an extensive problem and we don't see this as a problem when working on multi-layer projects. - Travis Massey brought up the issue of developer residue being trapped and not properly rinsed from the undercut region on lift-off masks. Again, I don't believe this is the problem, but I do think that this is worth paying attention to when developing this kind of recipe. We should think about longer rinsing steps to make sure that the developer is completely washed away from these harder to reach areas. - Dave Hollingshead suggested that local heating from the laser in DWL could cause surface modifications. This may be the case, but as my update below will show, at least in my case the issue is not irreversible. On the other hand, the fact that I also have this issue when using a contact aligner tells me that the issue may not be local heating, but it may still be some other surface modification due to interaction with light. And this must be something related to LOR 5B, since we don't observe this on our standard AZ1512 process. - A few people suggested that something in the lithography process may be changing the reflectivity of the substrate+resist layers. Everything points in this direction, however I was not able to determine what is causing this. Suggested solutions were O2 plasma (see my update below) and deposition of a 20 nm BARC layer before reworking samples. - Finally I'd like to address the effect that a few have reported regarding the hydrophobicity of the wafer after stripping resist, to which there was even a TikTok post about (neat!). We see that behavior after stripping the resist from a sample and rinsing it with water. Our understanding of this effect is that the exposure and development of the photoresist removes HMDS from the substrate, rendering the exposed areas hydrophilic while the remaining areas are still hydrophobic as HMDS is still there. At least in our case, a 15 min piranha (3:1) cleaning procedure is enough to get rid of the remaining HMDS and the whole sample becomes hydrophilic again. This is definitely not the cause of the ghosts we are observing and, even if HMDS was not completely removed, we apply HMDS again as part of the rework and this should make the surface uniform again. I hope I have covered all, or at least most of, the comments I got back. Now my update: - A 5 min O2 RIE step removed whatever it is from the surface of my wafers. My procedure was: strip LOR 5B/AZ 1512 with Remover PG (always new, so no water or other contamination), piranha clean for 15 min and O2 RIE for 5 min (P = 100 mT, RF = 200 W). - Since our RIE only supports one sample at a time, I tried doing a batch O2 ashing on a barrel plasma system. To our surprise, it did NOT work. After 20 min at 250?C, 600 W of RF power and 1.4 Torr, the ghosts were still there. I am sorry for the long message, but I thought that it would be useful to have a summary of the responses here for anyone looking for information about this. Cheers, -- Gustavo de Oliveira Luiz, PhD Applications/Research Specialist nanoFAB, University of Alberta +1 (780) 619-1463 On Fri, Mar 24, 2023 at 3:57?PM Gustavo de Oliveira Luiz < deolivei at ualberta.ca> wrote: > Hi everyone, > > First of all, thank you for the comments so far. If anyone else has more > information or suggestions about this, please keep them coming. I just > wanted to clarify some things and add a bit more detail on this issue. > > Travis Massey mentioned one thing that caught my attention, which was the > etching at the rims of the mask patterns, where developer may have been > trapped at after the undercut step with MF-319. Indeed, I observed this > kind of thing on a Si (no oxide) wafer where I measured up to a few 100 nm > trenches following the edges of my mask pattern. However this was very > sparse throughout the wafer, while the marks I've shown cover the whole > surface and I could not find anything correlating to this large scale > effect (I used our optical profilometer for this). But interesting that > liquid being trapped under the overhang of a lift-off mask can cause this, > which means we need to be more careful with the rinse steps. > > Dave Hollingshead suggested the MLA150 laser causing surface > modifications. Unfortunately I had the same issues when working with a > contact aligner, so I guess that this is not the case. > > Malcom Hathaway suggested a change in the substrate reflectivity, which is > my current hypothesis. However this seems to affect both Si and oxide, > since I see this effect on both cases, so this may be in fact a case of > chemicals sticking to the surface and not coming out even during long > piranha baths. I have AFM and other surface characterization options > planned, it is a matter of finding a good time to have it done now. > > Thank you all again for the suggestions and references. I'll make sure to > post an update here if I have anything useful. > > Best, > -- > Gustavo de Oliveira Luiz, PhD > Applications/Research Specialist > nanoFAB, University of Alberta > > On Fri, Mar 24, 2023 at 3:21?PM Hathaway, Malcolm R < > hathaway at cns.fas.harvard.edu> wrote: > >> Hi Gustavo, >> >> Another thought (from a non-photo-expert, for sure!): >> >> It may be the prior photo steps are changing the reflectivity of the >> silicon (or aluminum, on Travis's samples), especially as it shows up as >> having an effect on dose. Surface roughening? A very thin chemical >> residue? >> >> Perhaps an AFM scan would be revealing... >> >> >> Mac Hathaway >> Harvard CNS >> >> ------------------------------ >> *From:* labnetwork on behalf of Massey, >> Travis >> *Sent:* Friday, March 24, 2023 2:30 PM >> *To:* Gustavo de Oliveira Luiz ; >> labnetwork at mtl.mit.edu >> *Subject:* Re: [labnetwork] Strange "sample memory" with LOR 5B >> >> >> Hi Gustavo, >> >> >> >> I don?t have a definitive answer for you, and I?m certainly no chemist, >> but also consider the role of AZ Developer (another base) and reactions of >> NMP with residual water or alkaline solutions. >> >> >> >> First, the pair of alkaline developers *may* actually be enough to break >> through the relatively thin oxide created by the piranha, at which point >> the bases will start attacking the silicon. Second, if this is only >> happening with LOR, it?s also possible that residual liquid (likely >> alkaline) is being trapped under the AZ 1512 then reacting with the NMP. >> Spinning may not do a great job of removing this liquid trapped beneath the >> resist overhang. I suspect a bulk attack, though, since the residual >> patterns in the wafer reflect the resist pattern itself rather than the >> perimeters of the resist patterns. I haven?t noticed this before on SiO2, >> but NMP alone ? and especially water-contaminated NMP ? can attack some >> metals (Al, Cu, etc.). This paper suggests that acidic or alkaline >> contaminants in NMP may exacerbate the problem. I see these ghosts of >> previous patterns all the time in aluminum-coated wafers I pattern and >> reuse repeatedly for process development/characterization, and I?ve >> recently started seeing it on Ti as well ? no LOR, just an assortment of >> positive resists. >> >> https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9211805 >> >> >> >> >> Best, >> >> Travis Massey >> >> Center for Micro and Nanotechnology >> >> Lawrence Livermore National Laboratory >> >> >> >> *From:* labnetwork * On Behalf Of *Gustavo >> de Oliveira Luiz >> *Sent:* Friday, March 24, 2023 10:37 AM >> *To:* labnetwork at mtl.mit.edu >> *Subject:* [labnetwork] Strange "sample memory" with LOR 5B >> >> >> >> Hello everyone, >> >> >> >> While working on a recipe for LOR 5B/AZ 1512 in our automatic development >> system, I encountered some intriguing effects when reusing wafers for my >> tests. This could be a problem for our users when developing their own >> process, so we'd appreciate it if anyone could help us to understand what >> is going on. >> >> >> >> Below is a picture of a sample right before exposure, taken using our >> MLA150. The dark/bright features you see are NOT etched on the wafer (these >> wafers were never etched). The marks are from a previous lithography test. >> They become apparent after coating the sample with LOR 5B and even more >> after adding AZ 1512. And I don't see them when coating only with AZ 1512 >> (I reused wafers for that process development without any issues). >> >> And what is more intriguing is that these features affect >> exposure/development of my test mask. For instance, on a virgin sample I >> can expose and auto-develop with the same recipe (dose and development >> time) I use for the manual process. On a reused sample, the reisst stack >> behaves as if it were underexposed (a dose test made this very obvious). >> >> >> >> Here are the steps during my tests: >> >> 1. Piranha clean >> 2. HMDS prime on a YES oven >> 3. Spin-coat with LOR 5B/AZ 1512 (marks show up on a reused sample) >> 4. Expose using either a mask aligner or DWL >> 5. Auto-develop in our Laurell EDC-650 (resist seems underexposed >> over the marks) >> >> >> 1. AZ Developer 1:1 ? 90 s >> 2. Rinse (DI water) and dry (N2+spin) ? 60-120 s >> 3. MF-319 ? 5 s >> 4. Rinse (DI water) and dry (N2+spin) ? 60-120 s >> >> >> 1. Strip resist with Remover PG >> 2. Repeat all steps for every iteration >> >> At first I thought that this could actually be some etching of my Si >> wafers by MF-319, even though unlikely given the low TMAH concentration >> (and I'm not sure why that would affect exposure/development). But the >> sample in the image above has 2 ?m thermal oxide, so practically impervious >> to TMAH. Not to mention that the brightest crossing marks come from testing >> a recipe where TMAH was not used at all. This must be some strange >> interaction between LOR 5B and the sample surface, which I'd expect to be >> practically reset after piranha and HMDS priming. >> >> >> >> My search for more information regarding LOR 5B and it's sensitivity to >> surface conditions has proven fruitless so far. And requiring a brand new >> sample for every iteration can get expensive quite quickly. We'd appreciate >> it if you could point us to some references where this was discussed in any >> form, or if you know of a method to avoid this from happening. >> >> >> >> I'm sorry for the long email, and thank you in advance for any comments. >> >> >> >> Best regards, >> >> -- >> Gustavo de Oliveira Luiz, PhD >> Applications/Research Specialist >> nanoFAB, University of Alberta >> +1 (780) 619-1463 >> > -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 1204197 bytes Desc: not available URL: From sostrow at stanford.edu Tue May 9 21:29:56 2023 From: sostrow at stanford.edu (Sara Ostrowski) Date: Wed, 10 May 2023 01:29:56 +0000 Subject: [labnetwork] Stanford University - Job opening - Scanning Probe Microscopy Support Scientist In-Reply-To: References: Message-ID: Hello Labnetwork members, Stanford University (Stanford Nano Shared Facilities, http://snsf.stanford.edu) has a job opening for a Scanning Probe Microscopy (SPM) Support Scientist, specifically someone with experience on biological samples (cells, proteins, tissues, etc). If possible, would you be willing to help spread the word? ________________________________ The Stanford Nano Shared Facilities (SNSF) and the Cell Sciences Imaging Facility (CSIF) are seeking a Scanning Probe Microscopy (SPM) Support Scientist to help operate and support users of the facilities' Scanning Probe Microscopes. The SPM Support Scientist will provide training and support to researchers, maintain, and optimize the microscope operation, work closely with equipment vendors, implement advanced techniques, assist and advise users on specimen preparation and data analysis, provide proof-of-concept service, support manuscript preparation and engage in research activities. Duties will include the creation and design of extensive training and online/in-person teaching material including videos, electronic content, and interactive tools for the development of a centralized teaching platform that is accessible for all levels of scientific expertise. The SPM Support Scientist will work to direct the coordination of multiple scanning probe instruments across the Stanford Nano Shared Facilities (SNSF) and the Cell Science and Imaging Facility (CSIF). A successful candidate will manage the day-to-day operations, and maintenance of the instruments and foster a sense of community between users from various technical backgrounds (School of Engineering, School of Medicine, etc). The SPM Support Scientist will develop key relationships across various user facilities that provide awareness of the technique and create an inclusive environment to teach, train, and support SPM across Stanford. More details available at https://careersearch.stanford.edu/jobs/scanning-probe-microscopy-support-scientist-21438 ________________________________ Thanks and Best Regards, Sara Sara G. Ostrowski Ph.D. Associate Director nano at stanford | Stanford University 140D Paul G. Allen Building 330 Jane Stanford Way, Stanford CA 94305 Email: sostrow.stanford.edu Phone: +1.650.725.0293 Website: nano at stanford -------------- next part -------------- An HTML attachment was scrubbed... URL: From rlc12 at cornell.edu Wed May 10 15:53:22 2023 From: rlc12 at cornell.edu (Rebecca Lee Vliet) Date: Wed, 10 May 2023 19:53:22 +0000 Subject: [labnetwork] Job Opening: Senior Nanotechnology Process Engineer @ CNF-Cornell Message-ID: The Cornell NanoScale Facility has a job opening for a Senior Nanotechnology Process Engineer. Details are available here: https://cornell.wd1.myworkdayjobs.com/en-US/CornellCareerPage/details/Research-Support-Specialist-III_WDR-00036766-1?q=associate+chemical. Please share this with your research community Thank you! Ron Olson CNF Director of Operations -------------- next part -------------- An HTML attachment was scrubbed... URL: From cmurray at ferrologix.com Thu May 11 15:51:22 2023 From: cmurray at ferrologix.com (Coleman Murray) Date: Thu, 11 May 2023 12:51:22 -0700 Subject: [labnetwork] Looking for method to do lithography on copper clad blanks Message-ID: Hello, I'm looking to translate a current process from a metalized glass wafer to a lower cost copper clad blank such as an FR4 or other copper clad PCB blank. I was wondering if anyone has experience in doing lithography on copper clad substrates. Lithography dimensions: 5?m feature size, 5?m line width. Resist height: 3.5?m to 7?m Best, Coleman Murray, PhD Chief Operating Officer Ferrologix, Inc. This email and any files transmitted with it are confidential and intended solely for the use of the individual or entity to whom they are addressed. If you have received this email in error please notify the system manager. This message contains confidential information and is intended only for the individual named. If you are not the named addressee you should not disseminate, distribute or copy this e-mail. Please notify the sender immediately by e-mail if you have received this e-mail by mistake and delete this e-mail from your system. If you are not the intended recipient you are notified that disclosing, copying, distributing or taking any action in reliance on the contents of this information is strictly prohibited. Virus-free.www.avast.com <#DAB4FAD8-2DD7-40BB-A1B8-4E2AA1F9FDF2> -------------- next part -------------- An HTML attachment was scrubbed... URL: From ryan.nicholl at fabric8labs.com Mon May 15 15:55:09 2023 From: ryan.nicholl at fabric8labs.com (Ryan Nicholl) Date: Mon, 15 May 2023 12:55:09 -0700 Subject: [labnetwork] Job Opening: Senior Nanofabrication Equipment Engineer Message-ID: Fabric8labs (3D additive manufacturing company based in San Diego, CA) has a job opening for a *Senior Nanofabrication Equipment Engineer*. Details are available here: Indeed Link . Please share with interested candidates. Thanks, Ryan Nicholl Senior Scientist, Fabric8labs. -------------- next part -------------- An HTML attachment was scrubbed... URL: From rlc12 at cornell.edu Mon May 15 16:36:34 2023 From: rlc12 at cornell.edu (Rebecca Lee Vliet) Date: Mon, 15 May 2023 20:36:34 +0000 Subject: [labnetwork] REMINDER: Register NOW June 2023 CNF TCN Short Course! - Deadline May 26th Message-ID: Please post the attached flyer as well as share the announcement below with other members of the scientific communities. Thank you! CNF Technology & Characterization at the Nanoscale (CNF TCN) IN-PERSON Short Course June 6, 2022 - June 9, 2023 The CNF TCN will be held in-person Tuesday, June 6, 2023 - Friday, June 10, 2023. Each day offers lectures and laboratory demonstrations designed to impart a broad understanding of the science and technology required to undertake research in nanoscience. TCN is an ideal way for faculty, students, post docs and staff members to rapidly come up to speed in many of the technologies that users of the CNF need to employ. Members of the high tech business community will also find it an effective way to learn best practices for success in a nanofab environment. Attendance is open to the general scientific community. Note: The short course does not replace the three part training required to become a user of our facility. To become a CNF user, please visit the "Getting Started" link (https:cnf.cornell.edu/howto) on the CNF website. For more information and to register visit: https://cnf.cornell.edu/education/tcn [Text Description automatically generated] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.jpg Type: image/jpeg Size: 146975 bytes Desc: image001.jpg URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: REGISTER_JUNE-2023.jpg Type: image/jpeg Size: 146975 bytes Desc: REGISTER_JUNE-2023.jpg URL: From wagner at princeton.edu Wed May 17 03:46:14 2023 From: wagner at princeton.edu (Sigurd Wagner) Date: Wed, 17 May 2023 03:46:14 -0400 Subject: [labnetwork] Deposition of hydrogenated amorphous silicon. Message-ID: Hi everyone, Do you know of a laboratory that can deposit layers of thin-film-transistor grade a-Si:H, for a fee ? A colleague of mine wants to do experiments with them. Unfortunately, I took down my own a-Si:H PECVD system some years ago. Sigurd Wagner. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: wagner.vcf Type: text/vcard Size: 430 bytes Desc: not available URL: From beaudoin at physics.ubc.ca Wed May 17 13:52:38 2023 From: beaudoin at physics.ubc.ca (Beaudoin, Mario) Date: Wed, 17 May 2023 10:52:38 -0700 Subject: [labnetwork] Deposition of hydrogenated amorphous silicon. In-Reply-To: References: Message-ID: Contact Lino at the University of Waterloo.? Did some for me. Mario On 2023-05-17 12:46 a.m., Sigurd Wagner wrote: > [*CAUTION:* Non-UBC Email] > > Hi everyone, > > Do you know of a laboratory that can deposit layers of > thin-film-transistor grade a-Si:H, for a fee ? > > A colleague of mine wants to do experiments with them. Unfortunately, > I took down my own a-Si:H PECVD system some years ago. > > Sigurd Wagner. > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -- -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Mario Beaudoin SBQMI sig 2.jpg Type: image/jpeg Size: 21446 bytes Desc: not available URL: From rlc12 at cornell.edu Fri May 19 10:54:34 2023 From: rlc12 at cornell.edu (Rebecca Lee Vliet) Date: Fri, 19 May 2023 14:54:34 +0000 Subject: [labnetwork] Seats still available! June 2023 CNF TCN Short Course! - Register today! Message-ID: Please share the announcement below (post attached) with other members of the scientific communities. Thank you! CNF Technology & Characterization at the Nanoscale (CNF TCN) IN-PERSON Short Course June 6, 2022 - June 9, 2023 The CNF TCN will be held in-person Tuesday, June 6, 2023 - Friday, June 10, 2023. Each day offers lectures and laboratory demonstrations designed to impart a broad understanding of the science and technology required to undertake research in nanoscience. TCN is an ideal way for faculty, students, post docs and staff members to rapidly come up to speed in many of the technologies that users of the CNF need to employ. Members of the high tech business community will also find it an effective way to learn best practices for success in a nanofab environment. Attendance is open to the general scientific community. Note: The short course does not replace the three part training required to become a user of our facility. To become a CNF user, please visit the "Getting Started" link (https:cnf.cornell.edu/howto) on the CNF website. For more information and to register visit: https://cnf.cornell.edu/education/tcn [Text Description automatically generated] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.jpg Type: image/jpeg Size: 146975 bytes Desc: image001.jpg URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: REGISTER_JUNE-2023.jpg Type: image/jpeg Size: 146975 bytes Desc: REGISTER_JUNE-2023.jpg URL: From nuri.oncel at und.edu Fri May 19 12:10:38 2023 From: nuri.oncel at und.edu (Oncel, Nuri) Date: Fri, 19 May 2023 16:10:38 +0000 Subject: [labnetwork] UND is hiring Message-ID: Dear All, I am the director of UND's Nanofoundry. Our cleanroom is currently under construction and we are looking for a cleanroom specialist. I will be happy to answer any questions. Here is the link for the position. https://careers.und.edu/jobs/cleanroom-specialist-grand-forks-north-dakota-united-states I'd appreciate it if you could share this email and the link with interested parties. Best Nuri Professor Nuri Oncel, Ph.D. Interim Director of UND-NanoFoundry Department of Physics and Astrophysics University of North Dakota https://sites.google.com/view/oncel-research-group/group -------------- next part -------------- An HTML attachment was scrubbed... URL: From mmoneck at andrew.cmu.edu Mon May 22 21:59:28 2023 From: mmoneck at andrew.cmu.edu (Matthew Moneck) Date: Mon, 22 May 2023 21:59:28 -0400 Subject: [labnetwork] Nanofab Staff Openings at Carnegie Mellon Message-ID: Hi All, The Claire and John Bertucci Nanotechnology Laboratory at Carnegie Mellon University has two immediate job openings - one for a Nanofabrication Process Engineer, and one for a Nanofabrication Engineering Specialist . The *Nanofabrication Process Engineer* position is a hands-on role working with the lab?s Executive Director in the area of micro/nano-fabrication processing. Responsibilities will require experience with a variety of fabrication techniques and equipment, examples of which include lithography (electron-beam and photo), thin-film deposition (sputtering, evaporation, ALD, CVD, PECVD, etc.), wet and dry etching (especially plasma and ion beam etching), annealing, metrology, and more. Full details and a link to the application can be found at: https://cmu.wd5.myworkdayjobs.com/en-US/CMU/job/Nanofabrication-Process-Engineer_2019901 The *Nanofabrication Engineering Specialist *position is a versatile, hands-on role covering a multitude of process and equipment-related tasks to further the Nanofab mission to provide best-in-class services to a diverse set of researchers. More details and a link to the application can be found at: https://cmu.wd5.myworkdayjobs.com/en-US/CMU/job/Nanofabrication-Engineering-Specialist_2019861 Best Regards, Matt -- Matthew T. Moneck, Ph.D Executive Director, Claire & John Bertucci Nanotechnology Laboratory Electrical & Computer Engineering | Carnegie Mellon University 5000 Forbes Avenue, Pittsburgh, PA 15213-3890 Phone: 412-268-5430 ece.cmu.edu nanofab.ece.cmu.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From saba.sadeghi at uwaterloo.ca Tue May 23 12:53:39 2023 From: saba.sadeghi at uwaterloo.ca (Saba Sadeghi) Date: Tue, 23 May 2023 16:53:39 +0000 Subject: [labnetwork] UHV material Message-ID: Dear Labnetwork community, We machine our own substrate-holders in house for UHV and high-T deposition. I was wondering if you have recommendations for vendors that provide Inconel and molybdenum sheets, UHV grade? Thank you very much. Best regards, Saba Sadeghi IQC, University of Waterloo -------------- next part -------------- An HTML attachment was scrubbed... URL: From rlc12 at cornell.edu Wed May 24 13:30:27 2023 From: rlc12 at cornell.edu (Rebecca Lee Vliet) Date: Wed, 24 May 2023 17:30:27 +0000 Subject: [labnetwork] Seats still available! REGISTER NOW! CNF TCN Short Course! Message-ID: Good afternoon, We have a few seats remaining for the CNF TCN Short Course (06/07 - 06/10). Registration deadline is Friday, May 26th. Click here to REGISTER ________________________________ CNF Technology & Characterization at the Nanoscale (CNF TCN) IN-PERSON Short Course June 6, 2022 - June 9, 2023 The CNF TCN will be held in-person Tuesday, June 6, 2023 - Friday, June 10, 2023. Each day offers lectures and laboratory demonstrations designed to impart a broad understanding of the science and technology required to undertake research in nanoscience. TCN is an ideal way for faculty, students, post docs and staff members to rapidly come up to speed in many of the technologies that users of the CNF need to employ. Members of the high tech business community will also find it an effective way to learn best practices for success in a nanofab environment. Attendance is open to the general scientific community. Note: The short course does not replace the three part training required to become a user of our facility. To become a CNF user, please visit the "Getting Started" link (https:cnf.cornell.edu/howto) on the CNF website. For more information and to register visit: https://cnf.cornell.edu/education/tcn [Text Description automatically generated] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.jpg Type: image/jpeg Size: 146975 bytes Desc: image001.jpg URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: REGISTER_JUNE-2023.jpg Type: image/jpeg Size: 146975 bytes Desc: REGISTER_JUNE-2023.jpg URL: From ivleigh at umich.edu Wed May 24 14:24:32 2023 From: ivleigh at umich.edu (Jennifer Honeycutt) Date: Wed, 24 May 2023 14:24:32 -0400 Subject: [labnetwork] Customs and Duty Message-ID: Greetings, This email is to request any advice on customs and duty exemption for research equipment and supplies. Has anyone found a system that works? This has become a significant cause for concern during the past year or so. I have been in a purchasing role since 2008 and I have never encountered such inconsistencies, even with orders from the same supplier. I fear we are unnecessarily paying fees that could possibly be exempt, but haven't been able to find any straightforward answers. Any help would be greatly appreciated. Kind regards, -- Jennifer Honeycutt Purchasing Supervisor Electrical Engineering and Computer Science University of Michigan 1301 Beal Avenue | 5200 EECS Building Ann Arbor, MI 48109 | 734-615-6364 -------------- next part -------------- An HTML attachment was scrubbed... URL: From yxzhuphys245 at gmail.com Thu May 25 20:26:36 2023 From: yxzhuphys245 at gmail.com (Zhu Yunxuan) Date: Thu, 25 May 2023 19:26:36 -0500 Subject: [labnetwork] Question regarding amorphous Si deposition Message-ID: Hi everyone, Is there a way to deposit thick amorphous Si on several micrometres scale(~5um or above) but with a low processing temperature (<150 deg C)? PECVD is one possibility but the typical operating substrate temperature is too high (>200 deg C) which will destroy our device. Best regards, Longji Cui University of Colorado Boulder -------------- next part -------------- An HTML attachment was scrubbed... URL: From cg70 at rice.edu Fri May 26 12:03:30 2023 From: cg70 at rice.edu (Carlos Gramajo) Date: Fri, 26 May 2023 11:03:30 -0500 Subject: [labnetwork] Question regarding amorphous Si deposition In-Reply-To: References: Message-ID: Hi Zhu, I have done 1 ?m films of amorphous Si in an e-beam evaporation chamber. I had some issues with delamination when I was growing it. What I had to do was to slow down the rate of deposition. Unfortunately that means you have longer deposition times, therefore more exposure to radiative heat from the source. In that chamber we did not have a thermocouple on the sample holder and we didn't know what was the max temperature reached. It may be worth trying if you have a way to measure T and see if you can keep that in check by growing it in stages with cooling times in between. I hope this helps, Cheers, Carlos On Fri, May 26, 2023 at 6:57?AM Zhu Yunxuan wrote: > Hi everyone, > > Is there a way to deposit thick amorphous Si on several micrometres > scale(~5um or above) but with a low processing temperature (<150 deg C)? > PECVD is one possibility but the typical operating substrate temperature is > too high (>200 deg C) which will destroy our device. > > Best regards, > Longji Cui > > University of Colorado Boulder > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > > https://urldefense.com/v3/__https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork__;!!BuQPrrmRaQ!iEEe9-9D49oHAlx2fmI8df9fC8KZJ0unnifnDxhvfLmZv-NC19Mba9aHRcQkySO78VTunKanJAnd3vt_IgVk_tWbYPqw$ > -- Carlos Gramajo Cleanroom Research Scientist Shared Equipment Authority (SEA), Rice University Cell: 713-743-8115; Office: 713-348-8243; cg70 at rice.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From Peter.Lomax at ed.ac.uk Mon May 29 05:23:13 2023 From: Peter.Lomax at ed.ac.uk (Peter Lomax) Date: Mon, 29 May 2023 09:23:13 +0000 Subject: [labnetwork] Question regarding amorphous Si deposition In-Reply-To: References: Message-ID: Hi, We have deposited A-Si by PECVD with Argon, is OK for 1um but any thicker we started having stress delamination. Best regards Peter From: labnetwork On Behalf Of Carlos Gramajo Sent: 26 May 2023 17:04 To: Zhu Yunxuan Cc: labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Question regarding amorphous Si deposition This email was sent to you by someone outside the University. You should only click on links or attachments if you are certain that the email is genuine and the content is safe. Hi Zhu, I have done 1 ?m films of amorphous Si in an e-beam evaporation chamber. I had some issues with delamination when I was growing it. What I had to do was to slow down the rate of deposition. Unfortunately that means you have longer deposition times, therefore more exposure to radiative heat from the source. In that chamber we did not have a thermocouple on the sample holder and we didn't know what was the max temperature reached. It may be worth trying if you have a way to measure T and see if you can keep that in check by growing it in stages with cooling times in between. I hope this helps, Cheers, Carlos On Fri, May 26, 2023 at 6:57?AM Zhu Yunxuan > wrote: Hi everyone, Is there a way to deposit thick amorphous Si on several micrometres scale(~5um or above) but with a low processing temperature (<150 deg C)? PECVD is one possibility but the typical operating substrate temperature is too high (>200 deg C) which will destroy our device. Best regards, Longji Cui University of Colorado Boulder _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://urldefense.com/v3/__https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork__;!!BuQPrrmRaQ!iEEe9-9D49oHAlx2fmI8df9fC8KZJ0unnifnDxhvfLmZv-NC19Mba9aHRcQkySO78VTunKanJAnd3vt_IgVk_tWbYPqw$ -- Carlos Gramajo Cleanroom Research Scientist Shared Equipment Authority (SEA), Rice University Cell: 713-743-8115; Office: 713-348-8243; cg70 at rice.edu The University of Edinburgh is a charitable body, registered in Scotland, with registration number SC005336. Is e buidheann carthannais a th? ann an Oilthigh Dh?n ?ideann, cl?raichte an Alba, ?ireamh cl?raidh SC005336. -------------- next part -------------- An HTML attachment was scrubbed... URL: From joseph.losby at ucalgary.ca Mon May 29 12:13:46 2023 From: joseph.losby at ucalgary.ca (Joseph Losby) Date: Mon, 29 May 2023 16:13:46 +0000 Subject: [labnetwork] UPS' in your facility Message-ID: Hi Everyone, In the design of our facility, we are trying to gauge how others address uninterrupted power supply. We are considering having UPS' on our beam tools only. Would you consider having them for your pumps and control computers as well? What other tools do you have UPS' for? Cheers and thanks for your replies, Joe Joseph Losby, PhD Manager, qLab Operations [cid:d0583f6a-de60-44c9-af2b-dde85d983ce5] Quantum City?s qConnect 2023: Connecting quantum creators and users | Join us November 15-17, 2023 in Calgary, Alberta at Telus Convention Centre. Click here for more information. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Outlook-huvsblpf.jpg Type: image/jpeg Size: 13901 bytes Desc: Outlook-huvsblpf.jpg URL: From patricns at uw.edu Tue May 30 08:05:08 2023 From: patricns at uw.edu (N Shane Patrick) Date: Tue, 30 May 2023 07:05:08 -0500 Subject: [labnetwork] UPS' in your facility In-Reply-To: References: Message-ID: <46C940DE-9153-4F7C-B029-B8146A8D9D65@uw.edu> Hello Joseph, This is a question that we have recently been revisiting ourselves. There are several factors to consider such as the general stability of your power system, the sensitivity your tools have shown to poor quality power or brownouts/blackouts, the downtime created by such power events, the maintenance impact of such power events vs the maintenance and cost impacts of managing the UPSs, any restrictions or inventory requirement your institution may have on energy storage devices and their associated energy density and fire risks, etc. At WNF we have a large flywheel system that protects most research equipment against short duration (a few seconds) power events, with a couple of systems having their own separate UPSs - notably our EBL system has a 50kVA total system backup and our SEM has a battery backup system that specifically keeps its ion pumps running, but nothing else. We have recently begun evaluating the need to protect certain other critical system, particularly after a recent blackout appears to have killed a custom integrated CPU system that is costing us $7k and significant lead time to replace. So my answer is that it is prudent to evaluate each piece of equipment individually. There is no one-size-fits-all approach to most of this type equipment as the needs, benefits, and costs will vary. In our case, we were fortunate enough to include the flywheel system as part of a major remodel, and we are strongly considering additional protection for high value, high demand, and high impact systems. Given the power draw and general ease of recovery, I wouldn?t personally consider individual UPSs for things like roughing pumps. Other types of pumps might be reasonable, but you also need to consider the facilities side of the equation. If your pumps are connected to house facilities, like exhaust or cooling water, you will likely still shutdown the pumps due to protection modes when these services inevitably fail in a power outage. Almost no one has these types of facilities items backed up. Good luck. Hopefully you don?t have too many system to think about as it can get messy. N. Shane Patrick Manager, Lab Operations and Safety Electron Beam Lithography Washington Nanofabrication Facility (WNF) National Nanotechnology Coordinated Infrastructure (NNCI) University of Washington - NanoES Fluke Hall 129, Box 352143 (206) 221-1045 patricns at uw.edu http://www.wnf.washington.edu/ > On May 29, 2023, at 11:13 AM, Joseph Losby wrote: > > Hi Everyone, > > In the design of our facility, we are trying to gauge how others address uninterrupted power supply. > > We are considering having UPS' on our beam tools only. Would you consider having them for your pumps and control computers as well? What other tools do you have UPS' for? > > Cheers and thanks for your replies, > Joe > > Joseph Losby, PhD > Manager, qLab Operations > > > Quantum City?s qConnect 2023: Connecting quantum creators and users | Join us November 15-17, 2023 in Calgary, Alberta at Telus Convention Centre. Click here for more information. > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://urldefense.com/v3/__https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork__;!!K-Hz7m0Vt54!hWTUXbBPuX8SA-fJm5eTuDtEUX6tjHm47ERb7lRsM63-1yFHfzwWp_dyF0aQpNfBFQhAs8KwLc6MLOG79u9K_t9oKw$ -------------- next part -------------- An HTML attachment was scrubbed... URL: From gilheart at rice.edu Tue May 30 15:32:09 2023 From: gilheart at rice.edu (Timothy J Gilheart) Date: Tue, 30 May 2023 14:32:09 -0500 Subject: [labnetwork] Surface Analysis tutorials day at Rice University, on September 12, 2023 Message-ID: <54D1358B-276D-4C53-BF3A-15FE4D843E38@rice.edu> Greetings labnetwork colleagues, In conjunction with the SIMS workshop we are hosting at Rice in September in partnership with the North American SIMS society, there is an additional day focused on a variety of surface analysis methods. My colleague Tanguy is leading the effort for us and asked that I share the announcement below with the nanofab community. Discounts available for student and virtual registrants - please share with any colleagues or students who may be interested. Thanks! ? Tim Gilheart, PhD (he/him) Director of Operations Shared Equipment Authority (SEA) | Rice University https://research.rice.edu/sea/ Mobile: 832-341-5488 | gilheart at rice.edu Office: 713-348-3159 | SST 016 > Greetings everyone, > > Shared Equipment Authority at Rice University is organizing a Surface Analysis tutorials day, on September 12, 2023. > > The Surface Analysis tutorials day will be the perfect opportunity for students and for other SEA users to learn more about Scanning Probe Microscopy, UPS/XPS and Auger Electron Spectroscopy, Electron Microscopy (TEM and FIB-SEM), SIMS (DSIMS and ToF-SIMS) and X-ray techniques. > > Each expert will present practical aspects of Surface Analysis and discuss in detail about the capabilities and the applications of the different techniques. > > In addition, we will host a poster session where anyone can participate by submitting an abstract. > > For students, we will offer multiple student awards. > > For more information, please visit the website, here . > For Users interested to use the brand-new Nexsa XPS instrument, a software seminar is offered by Thermo Fisher Scientific for learning more about the instrument. > For Users interested to discover more about Park NX20 and NX40 AFM instruments, demonstration is offered by Park Systems for discovering their latest features. > Abstract ? deadline: June 1, 2023. Please use the link below to submit your abstract. > > Registration for general attendance is still open. Please use the link below to register for the meeting. > > !!! Go to Online Registration !!! : https://signup.rice.edu/2023SIMSWorkshop/ > > ------------------------------------- > > > Best regards, > > Tanguy > > > ------------------------------------------------------------------------------------------------------------------------------- > Tanguy Terlier, Ph.D. > Research Scientist | ToF-SIMS Instrument Manager > Office +1-713-348-7831 ? Lab +1-713-348-6826 ? Mobile +1-832-998-1280 > Rice University SEA-MS 126 ? 104 Keith-Wiess Geological Lab > P.O. Box 1892 ? Houston, TX 77251-1892 ? https://research.rice.edu/sea/ ? http://simslab.rice.edu > ------------------------------------------------------------------------------------------------------------------------------- -------------- next part -------------- An HTML attachment was scrubbed... URL: From PeterGordon at cunet.carleton.ca Wed May 31 11:24:14 2023 From: PeterGordon at cunet.carleton.ca (Peter Gordon) Date: Wed, 31 May 2023 15:24:14 +0000 Subject: [labnetwork] Inficon IMM-200 data acquisition Message-ID: Hi all, I'm in the process of installing a couple of Inficon QCM instruments, but I've just discovered that data acquisition software is not included. Can anyone point me towards resources on this? I'm not having much luck with the search so far. I'm hoping there's an open-source option, but I'm game to write my own software if it comes to that. Cheers, Peter -------------- next part -------------- An HTML attachment was scrubbed... URL: From info at fabsurplus.com Wed May 31 14:48:41 2023 From: info at fabsurplus.com (Stephen Howe) Date: Wed, 31 May 2023 20:48:41 +0200 Subject: [labnetwork] Manual requested for an STS 320 PC etcher (2nd Request) Message-ID: Dear Lab members, I am the proud owner of the following STS 320PC tool:- https://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=79584 You can see many photos of it at the above link. The vintage seems to be around 1995. The equipment is functional, but it has come to me without any manuals. I was wondering if anyone can be so kind to send me any manuals for this old but very simple tool, so as I can then find a new home for it ? Please consider that it does help the environment when one re-cycles such expensive and costly to make fab equipment in this way. Here is a more detailed description about this tool, which has a DOS operating system:- SDI ID: 79584 Manufacturer: SPTS Model: 320 PC Description: Reactive Ion Etcher -Manual loading for laboratory use Version: UP TO 200 mm Vintage: 01.05.1995 Quantity: 1 Comments: -Manual loading -includes PC control system. -Software version 2.3.00 datalog -includes STS end-point detector -includes Leybold mechanical pump with oil mist filter. -includes Leybold turbo pump -Leybold turbo pump controller type: Turbotronix NT 151 / 361 -RF generator type: ENI ACG6 -Includes process module chiller type BETTA TECH CU500. COOLANT: GALDEN.(SEE SDI ID 106971) -Cathode diameter: 30 cm -Cathode area: 706.5 cm2 -RF forward power range: 10 to 600 watts -Chamber max pressure: 500 mtorr -Chamber base vacuum: 1mTorr -Substrate sizes: 2 to 8 inch and small fragments -Number of gas lines available: 8 Reactive Ion Etching is a technique which is used to selectively etch thin films in micro-electronic devices. It used both physical and chemical etching. An appropriate gas mixture needs to be selected to obtain the best process results. Etch rates can be adjusted by changing the electrode bias, RF power, chamber pressure and the gas flow rates. RIE can provide highly anisotropic surfaces. With the STS 320PC, recipes can be changed easily to allow the processing of new materials. POSSIBLE SUBSTRATE SIZES: 2 INCH, 4 INCH, 5, INCH, 6 INCH AND 8 INCH, FRAGMENTS GASES USED: CF4, O2, CHF3, SF6, CF4 + N2 SUBSTRATES THAT CAN BE ETCHED: SiO2, PolySilicon, SiN Yours sincerely, SDI Fabsurplus Italia SRL Stephen Howe Company Owner email: info at fabsurplus.com Mobile (Italy) : +39 335-710-7756 WWW.FABSURPLUS.COM -------------- next part -------------- An HTML attachment was scrubbed... URL: From mpleil at unm.edu Wed May 31 16:39:19 2023 From: mpleil at unm.edu (Matthias Pleil) Date: Wed, 31 May 2023 20:39:19 +0000 Subject: [labnetwork] LAM 490 etcher available Message-ID: Hello Lab Network Team, We have a LAM etcher up for bid - in case you are interested, we had it donated to us years ago, never installed it. Here is the online bid service with more details. The auction is now live for the UNM LAM490B Poly/Nitride Etcher. Auction ends 6/10/23 at 12:15PM MT. Kind Regards, Matthias Pleil, Ph.D. Director Manufacturing Engineering Program UNM MTTC Cleanroom Manager Research Professor & Senior Lecturer III of Mech. Eng - UNM PI - Support Center for Microsystems Education Find great curriculum at: www.scme-support.org (505)272-7157 Join the MNTeSIG Team at www.mntesig.net [cid:91567e30-cd9a-4ff5-92a8-60d46ab127e1] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Outlook-nc2xausn.png Type: image/png Size: 13711 bytes Desc: Outlook-nc2xausn.png URL: From delima1 at llnl.gov Wed May 31 17:30:04 2023 From: delima1 at llnl.gov (DeLima, Terri L.) Date: Wed, 31 May 2023 21:30:04 +0000 Subject: [labnetwork] Alternative wastewater treatment systems Message-ID: I'm interested in an alternative to our current wastewater retention system. Has anyone looked into wastewater treatment systems such as treat & recycle or zero discharge systems? * What type of alternative wastewater treatment system do you use? * How effective is the system at removing contaminants from wastewater? * How cost-effective is the system? * What challenges have you faced in implementing this alternative wastewater solution? Thank you for your time and consideration. I look forward to hearing from you soon. Sincerely, Terri DeLima Operations Manager Center for Micro/Nano Technology & Bioengineering Phone: 925-423-4526 Mobile: 925-315-0731 Email: delima1 at llnl.gov 7000 East Ave L-222 Livermore , CA 94550 Lawrence Livermore National Laboratory (LLNL) -------------- next part -------------- An HTML attachment was scrubbed... URL: