[labnetwork] Thermal conductivity in plasma chamber

[Bob Hamilton]

The Microlab has been using thermal grease, CGR7016, 
Cool-Grease 7016, 50gram jar available from: 
http://www.aitechnology.com/store/

This grease is used in an STS/Bosch Si etch process. I have 
no information to offer about its interactions with SiO2.

We also make our own thermal paste from Santovac V 
(polyphenol ether) and aluminum powder for use in our 
ionmill. Santovac V has an exceptionally low vapor pressure 
and is soluble in acetone, post-milling (perhaps boron 
ntirde would be a better additive than aluminum)? Also, a 
thin film of Santovac may be enough without a filler.

http://www.2spi.com/catalog/vac/santovac-5-vacuum-grease.shtml


Bob Hamilton

Robert Hamilton
University of California at Berkeley
Nanolab Equipment Engineering Manager
Rm406 Cory Hall
Berkeley, CA 94720-1770
510-642-2716
510-642-2916 (Fax)
510-325-7557 (Cell)
bob at silicon2.eecs.berkeley.edu



On 8/16/2010 1:52 PM, Daniel Lloyd wrote:
> Hi all,
>
> I currently use a vacuum grease to promote thermal conductivity in a RIE chamber but unfortunately it seems to react badly with fused silica (SiO2). This results in a dirty film being left on the surface of the substrate which is very hard (verging on impossible) to remove). Can anyone suggest a replacement which won't cause this problem?
>
> Thanks,
>
> Daniel
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork