[labnetwork] Vacuum Wafer Bonder and Acoustic Imaging

[Alireza H.Mesgar]

Hi Leonard,

 

We have the capacity to do it in the microfabrication facility in Montreal
Polytechnic. We are equipped with a SUSS SB6 wafer bonder and a Sonoscan
acoustic microscope.

 

Best,

 

Alireza H. Mesgar

 

Associé de recherche/Research Associate

Laboratoire de Microfabrication (LMF)/Microfabrication Laboratory

Groupe de couche mince (GCM)/ Thin Film Research Laboratories

Département de Génie Physique/Engineering Physics Department 

École Polytechnique de Montréal

C.P. 6079,  succ. Centre-Ville

Montréal, Québec H3C 3A7 CANADA

Tél :  <tel:%28514%29340-4711> (514)340-4711 Extension/poste 7456

Fax :  <tel:%28514%29340-3218> (514)340-3218

 

 

 

From: Olona, Leonard E. [mailto:len.olona at ou.edu] 
Sent: 11 décembre 2013 12:53
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Vacuum Wafer Bonder and Acoustic Imaging

 

Dear Labnetwork colleagues, 

We would like to find some cleanroom sources that have the capability to do
the 3 inch wafer transfer bonding under vacuum environment and acoustic
image scanning. 

Thank you,

 

-Len

 

Leonard E. Olona

University Cleanroom Manager

University of Oklahoma

110 West Boyd Street Rm 550

Norman, Oklahoma  73019

D: +1- 405 325-4374

C: +1- 405 630-9068

F: +1- 405 325-7066

 

 

 

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