[labnetwork] FW: Vacuum Wafer Bonder and Acoustic Imaging

[Rob Santilli]

Dear Leonard

AML's BONDCENTRE can do this - however we are in Oxford, UK.

If still interested please complete the attached form as far as you can and then we can quote

Regards
Rob Santilli


From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu> [mailto:labnetwork-bounces at mtl.mit.edu]<mailto:[mailto:labnetwork-bounces at mtl.mit.edu]> On Behalf Of Olona, Leonard E.
Sent: Wednesday, December 11, 2013 12:53 PM
To: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: [labnetwork] Vacuum Wafer Bonder and Acoustic Imaging

Dear Labnetwork colleagues,
We would like to find some cleanroom sources that have the capability to do the 3 inch wafer transfer bonding under vacuum environment and acoustic image scanning.
Thank you,

-Len

Leonard E. Olona
University Cleanroom Manager
University of Oklahoma
110 West Boyd Street Rm 550
Norman, Oklahoma  73019
D: +1- 405 325-4374
C: +1- 405 630-9068
F: +1- 405 325-7066


Applied Microengineering Ltd (AML)
U8 Library Avenue, Harwell Oxford, Didcot, Oxfordshire, OX11 0SG, UK
DL +44 1235 434340   Fax +44 1235 833 935  SB +44 1235 833934
SKYPE  robaml
www.aml.co.uk<http://www.aml.co.uk/>
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