[labnetwork] Chips on a EVG 620

[Kevin Owen]

We have a 620 but only use it for bond alignment. We do occasionally run
into this on the our MA-6, our best recommendation is to put the process
chip in the right spot on the chuck for the mask level they want to use and
then put several other pieces of equal thickness around the chuck to even
it out.

-Kevin

On Wed, Feb 17, 2016 at 12:42 PM, Mark Giulio Chiappa <mark.chiappa at ntnu.no>
wrote:

> Hi Jacob,
>
> Here at NTNU NanoLab we have a solution. It's not very elegant but it is
> cheap, flexible and does work. We use low tac tape (I forget the brand but
> I can let you know if you want it) to cover the entire area of the vacuum
> chuck with a hole in it for where the user wants to place their chip.  That
> way the sample is held by system vacuum. The WEC works fine and we've had
> no complaints about the results.  If your users are really pushing it and
> have their chip very close to the perimeter of the chuck it may be smart to
> place a dummy chip or even two to avoid a bad WEC.
>
> We use the same trick with our MA6.
>
> Kind regards
> Mark
>
> Sent from my iPhone
>
> On 16 Feb 2016, at 17:41, Jacob Trevino <Jacob.Trevino at asrc.cuny.edu>
> wrote:
>
> Hello All,
>
> At the CUNY ASRC NanoFab, we have a EVG 620 mask aligner with 6” and 4”
> wafer tooling. We have a number of users who need to process chips of
> varying sizes. In some cases, users need the flexibility to move the chip
> across the mask. As I am sure you are familiar, many researchers have
> several chip layers across one photomask.
>
> It seems as though EVG’s tooling options for chips are fairly limited with
> less flexibility than I have seen with SUSS chucks in the past. I am
> curious what other EVG mask aligner owners do to accommodate users who need
> to perform lithography on chips. Have you made your own custom tooling? Any
> thoughts would be greatly appreciated.
>
> Best regards,
> Jacob
>
>
> --------------------------------
>
> *Jacob Trevino, PhD*
> NanoFabrication Facility Director
> The City University of New York (CUNY)
> Advanced Science Research Center (ASRC)
> Tel.  (212) 413-3310
>
> Cel.  (646) 629-1179
>
> Email: Jacob.Trevino at asrc.cuny.edu
>
> Web: http://asrc.cuny.edu/
>
>
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-- 
Kevin Owen
Senior Engineer in Research
Operations Group, Lurie Nanofabrication Facility
University of Michigan
(734) 545-4014
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