[labnetwork] DC sputtering of ITO

[Janney, Peter J.]

Are you bead blasting all your shields and shutter.  We have 3” targets and use a 100W max power.  I suspect that you should be a little lower than that.  We get our targets from Kurt J. Lesker.  They could give you a recommendation for you 2 “.  You could deposit an adhesion layer of Ti on your shields before using the ITO.

Best regards,
Peter Janney

[The Ohio State University]
Peter Janney
Lab Services Coordinator
Nanotech West Lab
100 Science Village, 1381 Kinnear Road, Columbus, OH 43212
614-688-4213 Office
614-753-3926 Cell
janney.9 at osu.edu<mailto:janney.9 at osu.edu> nanotech.osu.edu<http://nanotech.osu.edu/>

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Chang, Long
Sent: Tuesday, October 11, 2016 7:25 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] DC sputtering of ITO

Hi All,

We have a DC magnetron sputtering system using 2” diameter targets.  We’ve been observing many shorts due to severe flaking.  The student is using a recipe developed by her predecessor which uses 100W of DC power and 5 mTorr of Ar.  Does anyone know what steps should be taken to avoid/reduce flaking when DC sputtering ITO?  I suspect that the student is using too much power.

Thanks,
Long Chang
Nanofab Manager
University of Houston
3605 Cullen Blvd, Entrance 14
Room E1007A, SERC Bldg 545
Houston, TX 77204-5062
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