[labnetwork] Project Feasibility for RIE

[Fouad Karouta]

Hi Esta,

First I have to say I haven't worked directly with the materials you named.
But in general for materials #1 and 4 as they are pure hydrocarbons you can etch them with O2 plasma. This should remove all organic materials.
For B-containing material you need to add something like fluoride (CHF3 or equivalent) to O2, you may need to look for an optimum mixture ratio.
The one with silver would be the trickiest: if I were you I would try Cl2+O2, hoping you get AgClO3 as an etching product which is volatile.

My simple approach to RIE in general is to look at possible etching products and their melting, boiling temperatures and take the gas which gives you the lowest temperature (this must definitely be below 500°C).
As an example etching InP in Cl2- chemistry results in an etching product of InCl3 which has a melting point of 583°C at 1 atm. We know in RIE you need to heat the table to something like 150-200°C and at pressure like 4 mTorr then nCl3 becomes volatile. You may want to look at a tutorial paper I published 2 years ago: http://iopscience.iop.org/article/10.1088/0022-3727/47/23/233501

Good luck,
Fouad Karouta

*************************************
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Australian National Fabrication Facility
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From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Abelev, Esta
Sent: Friday, 14 October 2016 3:53 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Project Feasibility for RIE

Hi,

I would like to introduce myself, I am Esta Abelev a Technical Director of Nanoscale Fabrication facility at University of Pittsburgh.
Recently, I received request to etch following materials (see below table), that I have never worked with. I wanted to ask the community if somebody have an experience with those materials and how the best way to etch it.

Need to etch the polymer electrolyte (salt concentration is 2.5 mM based on the volume of Ionic liquid. And PEGDA/IL is 60/40 wt.%) on the silicon substrate except those areas protected by metal. The chemical formulas for these materials are as follows:

Name


Chemical Formula


Polyethylene glycol dicrylate


CH2CHCO(C2H4O)nCOOCHCH2


1-butyl-3-methylimiadazolium tetrafluoroborate


C8H15BF4N2


Silver tetrafluoroborate


AgBF4


2-Hydroxy-2-methylpropiophenone


C10H12O2


Thank you, Esta

.........................................................................................................................................................................................
Dr. Esta Abelev

Technical Director of PINSE/NFCF
Petersen Institute of NanoScience and Engineering (PINSE)
Nanoscale Fabrication and Characterization Facility (NFCF<http://www.nano.pitt.edu/facilities>)
University of Pittsburgh
636 Benedum Hall
3700 O'Hara Street
Pittsburgh, PA 15261

Phone: 412-383-4096
Email: eabelev at pitt.edu<mailto:eabelev at pitt.edu>
Office: M104 Benedum Hall
http://www.nano.pitt.edu


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