[labnetwork] Looking for cleaning advice - post wire-saw - removingslurry from wafers

[Chito Kendrick]

Can you apply a coating before dicing? I normally have old 1827 around that users can use as a pre-dice coating. Also never let the samples dry out before rinsing and then removing the 1827 in acetone.

Chito Kendrick 

-----Original Message-----
From: "Gavin, Frank" <fgavin at wafabintl.com>
Sent: ‎8/‎15/‎2017 19:33
To: "labnetwork at mtl.mit.edu" <labnetwork at mtl.mit.edu>
Subject: [labnetwork] Looking for cleaning advice - post wire-saw - removingslurry from wafers

I am looking for a process to clean post wire sawing Silicon Carbide substrates.  The material being cleaning is SiC substrates and the abrasive that needs to be removed is a synthetic glycol based fluid mixed with diamond powder.  During the wire sawing process there is also kerf from the SiC as well as the steel cord wire that abrades as well.  It is a very aggressive process and heavy solids need to be removed.  Operators are spending the day hand wiping wafers.  Any advice is welcomed.
 
Best Regards,
FRANK GAVIN, Sales Eng.

6161 Industrial Way, Livermore CA 94551
(925) 455-5252 ext 2420  Fax: (925) 455-5351


 


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