[labnetwork] Looking for cleaning advice - post wire-saw - removingslurry from wafers

[Carsen Kline]

Keeping the wafers wet, as Chito said, is key. I used to work with lab 
members who had good results using solid PVA foam sponges to remove 
tough CMP slurry from delicate wafers. The foam is quite soft when wet 
but traps the small particles effectively without causing further damage.

Good luck!

On 8/15/2017 4:53 PM, Chito Kendrick wrote:
> Can you apply a coating before dicing? I normally have old 1827 around 
> that users can use as a pre-dice coating. Also never let the samples 
> dry out before rinsing and then removing the 1827 in acetone.
>
> Chito Kendrick
> ------------------------------------------------------------------------
> From: Gavin, Frank <mailto:fgavin at wafabintl.com>
> Sent: ‎8/‎15/‎2017 19:33
> To: labnetwork at mtl.mit.edu <mailto:labnetwork at mtl.mit.edu>
> Subject: [labnetwork] Looking for cleaning advice - post wire-saw - 
> removingslurry from wafers
>
> I am looking for a process to clean post wire sawing Silicon Carbide 
> substrates.  The material being cleaning is SiC substrates and the 
> abrasive that needs to be removed is a synthetic glycol based fluid 
> mixed with diamond powder.  During the wire sawing process there is 
> also kerf from the SiC as well as the steel cord wire that abrades as 
> well.  It is a very aggressive process and heavy solids need to be 
> removed.  Operators are spending the day hand wiping wafers.  Any 
> advice is welcomed.
>
> Best Regards,
>
> FRANK GAVIN, Sales Eng.
>
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-- 
Carsen Kline
Lab Operations Manager
Stanford Nanofabrication Facility
Paul G. Allen Bldg 131
Stanford, CA  94305
(650)724-8214
carsen at stanford.edu
http://snf.stanford.edu

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