[labnetwork] EBeam Lithography on Glass substrates

[Matthew Moneck]

Hi Aju,

We have commonly used Al as a conductive layer on top of PMMA on glass (removal is typically done with minimal damage by using dilute AZ400K photoresist developer).  However, 5nm seems to be on the thin side.  Al can form native oxide that is up to 3-4nm thick.  Therefore, I would confirm the answer to Mark's question of whether or not the 5nm Al layer is conductive.  We typically sputter deposit films that are 10-20nm thick for our applications.

Best Regards,

Matt

-- 
Matthew T. Moneck, Ph.D.
Executive Manager, Carnegie Mellon Nanofabrication Facility
Electrical and Computer Engineering | Carnegie Mellon University
5000 Forbes Ave., Pittsburgh, PA 15213-3890
T: 412.268.5430
F: 412.268.3497
www.ece.cmu.edu
nanofab.ece.cmu.edu


-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mark K Mondol
Sent: Monday, August 21, 2017 5:04 PM
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Aju:

1. Be 100% certain the layer is conductive and connected to ground in the tool.

2. Every time they write on glass, do the same exposure on Si, if the problem shows up on both Si and glass the issue is not the insulating substrate.

3. Al etch can damage PMMA; not always in a repeatable way. Does your process include etching the Al (I have found Transene CR-7 chrome etch to be compatible with PMMA and ZEP, so usually use Cr not Al as the conductive layer).

Regards,

Mark K MOndol

--
Mark K Mondol
Assistant Director NanoStructures Laboratory And Facility Manager Scanning Electron Beam Lithography Facility Bldg 36  Room 229 www.rle.mit.edu/sebl mondol at mit.edu office - 617-253-9617 cell - 617-224-8756


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