[labnetwork] Flip Chip Bonding needs

[julia.aebersold at louisville.edu]

We also have flip chip bonding capabilities.  50kg seems quite a bit and would crush most silicon and/or glass substrates.

Cheers!

Julia Aebersold, Ph.D.
Cleanroom Manager
Micro/Nano Technology Center
University of Louisville
Shumaker Research Building, Room 233
2210 South Brook Street
Louisville, KY  40292

502-852-1572
http://louisville.edu/micronano/

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Michael Khbeis
Sent: Tuesday, March 14, 2017 7:55 AM
To: Kamal Yadav <kamal.yadav at gmail.com>
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Flip Chip Bonding needs

Kamal

We can accommodate. What type of bond?

Best,
Dr. Michael Khbeis
Washington Nanofab Facility
University of Washington
Fluke Hall, Box 352143
(O) 206.543.5101<tel:206.543.5101>
(C) 443.254.5192<tel:443.254.5192>
khbeis at uw.edu<mailto:khbeis at uw.edu>

On Mar 13, 2017, at 2:17 PM, Kamal Yadav <kamal.yadav at gmail.com<mailto:kamal.yadav at gmail.com>> wrote:
Dear All,

Kindly let me know if you know or if you can provide flip chip bonding services at a University cleanroom or similar, on the west coast preferably [due to our own location], but we are open to other places as well.

Bonding force required: Around 50 Kg
Die Size: 5 mm to 35 mm.
Alignment: 5 micron or better.

--
Thanks,
Kamal

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