[labnetwork] FW: Flip Chip Bonding needs

Wed Mar 15 12:51:03 EDT 2017

ALL FINETECH BONDERS –

University of Santa Barbara
Microtek San Diego – contract manufacture
Quickpak San Diego  - contract manufacturer
Jabil AOC norther California – contract manufacturer
University of Michigan

And some more…..

Arizona State University

Cal Tech

Case Western

Clemson University (Stock NH PO 5720)

Cleveland Clinic

Colorado State

Cornell University

Ecole Polytechnique  (Queens Univ)

Ecole Polytechnique (Univ. of Montreal)

Ecole technology superior (ETS)

Georgia Tech - NRC / MIRC (Stock AZ)

Georgia Tech - PRC

Georgia Tech - PRC (stock)

Harvard University - MA

Johns Hopkins

Kent State/Hanna

Maryland Procurement Office - MD

Massachussetts Institute of Technology (MIT)

Notre Dame

Penn State University (Donated)

Purdue

Purdue

Rensselaer Polytechnic

Stanford University - SLAC

University of Alaska - Fairbanks

University of Alberta - Edmonton, Canada

University of Arizona

University of CA - Berkeley

University of CA - Davis

University of CA - Santa Barbara

University of Calgary (ACAMP)

University of Central Florida

University of Connecticut

University of Illinois

University of Lousiville

University of Maryland

University of Massachusetts Amherst

University of N. Carolina -  Chapel Hill

University of N. Carolina -  Charlotte

University of S. Carolina

University of Sherbrooke (IBM - C2MI)

University of Sherbrooke (IBM - C2MI)

University of Virginia (was HVVI)

University of Washington

University of Waterloo

University of Waterloo, Canada

Regards,
Robert Avila
(')480.231.7902 mobile
(')480-893-1630 office
finetechusa.com<http://www.finetechusa.com/> •

From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Robert Avila
Sent: Tuesday, March 14, 2017 9:16 AM
To: julia.aebersold at louisville.edu<mailto:julia.aebersold at louisville.edu>; Michael Khbeis <khbeis at uw.edu<mailto:khbeis at uw.edu>>; Kamal Yadav <kamal.yadav at gmail.com<mailto:kamal.yadav at gmail.com>>
Cc: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] Flip Chip Bonding needs

Good to see Dr. Khbeis and others respond.

Finetech has die bonders installed at many Universities…to name a few and my apologies for those I missed –

University of Arizona,
University of Arizona State
Cal Berkeley
Cal Davis
Stanford
Cal Tech
University of Washington
University of Louisville
University of Colorado State
University of Alaska
University of Alberta
University of Arkansas
University of S.Florida
MIT
Harvard
Rice

Regards,
Robert Avila
(')480.231.7902 mobile
(')480-893-1630 office
finetechusa.com<http://www.finetechusa.com/> •

From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of julia.aebersold at louisville.edu<mailto:julia.aebersold at louisville.edu>
Sent: Tuesday, March 14, 2017 7:25 AM
To: Michael Khbeis <khbeis at uw.edu<mailto:khbeis at uw.edu>>; Kamal Yadav <kamal.yadav at gmail.com<mailto:kamal.yadav at gmail.com>>
Cc: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] Flip Chip Bonding needs

We also have flip chip bonding capabilities.  50kg seems quite a bit and would crush most silicon and/or glass substrates.

Cheers!

Julia Aebersold, Ph.D.
Cleanroom Manager
Micro/Nano Technology Center
University of Louisville
Shumaker Research Building, Room 233
2210 South Brook Street
Louisville, KY  40292

502-852-1572
http://louisville.edu/micronano/

From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Michael Khbeis
Sent: Tuesday, March 14, 2017 7:55 AM
To: Kamal Yadav <kamal.yadav at gmail.com<mailto:kamal.yadav at gmail.com>>
Cc: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] Flip Chip Bonding needs

Kamal

We can accommodate. What type of bond?

Best,
Dr. Michael Khbeis
Washington Nanofab Facility
University of Washington
Fluke Hall, Box 352143
(O) 206.543.5101<tel:206.543.5101>
(C) 443.254.5192<tel:443.254.5192>
khbeis at uw.edu<mailto:khbeis at uw.edu>

On Mar 13, 2017, at 2:17 PM, Kamal Yadav <kamal.yadav at gmail.com<mailto:kamal.yadav at gmail.com>> wrote:
Dear All,

Kindly let me know if you know or if you can provide flip chip bonding services at a University cleanroom or similar, on the west coast preferably [due to our own location], but we are open to other places as well.

Bonding force required: Around 50 Kg
Die Size: 5 mm to 35 mm.
Alignment: 5 micron or better.

--
Thanks,
Kamal

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