[labnetwork] TEL tools

[Flückiger Philippe]

Dear Vicky,

EPFL has installed a UNITY Me Plasma Etch System with one DRM chamber and one SCCM chamber for etching SiO2 & Si3N4.
The DRM chamber is configured for 100mm wafers and the SCCM chamber is configured for 200mm wafers.
Robot configuration needs to be changed between 100mm wafers and 200mm wafers.
However 100mm wafers & 150mm wafers can be processed in the 200mm SCCM chamber by using pocket wafers (with the robot in the 200mm wafer configuration).
The tool was installed this summer and we are building our experience in this matter right now.
We will keep you posted.

With my very best regards,
Philippe

Dr Philippe Flückiger
Director of Operations
http://cmi.epfl.ch/
Phone +41 21 693 6695

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Vicky Diadiuk
Sent: lundi 16 octobre 2017 19:58
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] TEL tools

Hi,
 Does anybody have Tokyo Electron machines in a shared facility?
If so, can they be made to accept wafers & samples smaller than 8” (e.g. by using handle-wafers)?

Any insights would be highly appreciated.
Thx,
 Vicky


Dr. Vicky Diadiuk
Associate Director, Fab Operations
Microsystems Technology Laboratories
Massachusetts Institute of Technology
Room 39-219
Cambridge, MA 02139
Tel: 617-253-0731
diadiuk at mit.edu<mailto:diadiuk at mit.edu>
http://www.mtl.mit.edu



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