[labnetwork] dicing III-V materials

[Janet Teshima]

Hi Kurt,
As Fouad mentioned, III-V materials cleave very easily so it may be a good option for you, simple and quick. At LatticeGear we have worked to develop methods and tools that minimize particulate generation during the cleaving process while creating clean samples. The trick is that instead of sawing or scribing we make a small indent that does not generate airborne particles. Attached is a technical note we wrote with the University of Sydney where we measured particulates before and after cleaving. Let me know if you have any comments or questions.

Janet
LatticeGear, LLC
lg at latticegear.com <mailto:lg at latticegear.com>
15201 NW Greenbrier Parkway Suite C-7
Beaverton, OR 97006
503-828-0040


> On Nov 30, 2018, at 5:10 PM, Fouad Karouta <fouad.karouta at anu.edu.au> wrote:
> 
> Hi Kurt,
> You should consider having a kind of filter and treat the solid waste as hazardous and dispose off correctly.
> Note III-V are easy to cleave hence am not sure the reason behind to use a diving saw.
> Best regards 
> Fouad Karouta
> 
> On 1 Dec 2018, at 11:59 am, Kurt Kupcho <kurt.kupcho at wisc.edu <mailto:kurt.kupcho at wisc.edu>> wrote:
> 
>> Hi all
>>  
>> We have a few dicing saws here that we are starting to get requests for dicing materials like InAs, InP, InGaAsP, etc.  My question is about safety during dicing, like worries about airborne particles being breathed in.  Our saws have water spray and exhaust to mitigate this but normally meant for Si is this sufficient for the III-V materials as well?  My other question is the waste water with wafer dust.  If you do allow dicing of these III-V materials what do you do if anything about the water with wafer dust going down the drain?  Anything?  Some sort of trap?
>>  
>> Your responses are much appreciated!
>>  
>> Thank you - Kurt  
>>  
>>  
>> ---------------------------------------------------
>> Kurt Kupcho
>> Process Engineer/Safety Officer
>>  
>> NFC
>> 1550 Engineering Drive
>> ECB Room 3110
>> Madison, WI  53706
>>  
>> E:  kurt.kupcho at wisc.edu <mailto:kurt.kupcho at wisc.edu>
>> T:  608-262-2982
>>  
>> <image001.png>
>>  
>> _______________________________________________
>> labnetwork mailing list
>> labnetwork at mtl.mit.edu <mailto:labnetwork at mtl.mit.edu>
>> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork <https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork>
> <image001.png>_______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu <mailto:labnetwork at mtl.mit.edu>
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork <https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork>
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20181201/c67d973d/attachment.html>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: Ax-in-Action_Cleanroom Cleaving & Particles v053118.pdf
Type: application/pdf
Size: 1013872 bytes
Desc: not available
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20181201/c67d973d/attachment.pdf>
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20181201/c67d973d/attachment-0001.html>