[labnetwork] Wafer specification requirement for RIE & DRIE cleaning recopies

[Srinivasa Reddy]

HI,
I'm Srinivasa Reddy, Manger, Microfabrication Lab, Indian Institute of
Technology, Madras, Chennai.
This is regarding Wafers specifications for Dummy wafers for RIE & DRIE
process.
1. Some times we stick *small prices* to f*ull 4 inch wafer* and do the
etching process.
Currently we are using *Prime Wafers* ( which costly) and I'm looking to
replace with Mechanical grade or Test grade wafers.
2. We also do chamber cleaning runs with the wafers and this also consumes
significant number of wafers. Here also want to replace the Prime wafer
with Test or Mechanical grade wafer.

I've doubt about the Bending/Warping or TTV or backside roughness of the
wafer and It may lead to higher helium leak rate and process may abort.
Could some one throw light on this issue


Thanks & Regards
Srinivasa Reddy Kuppireddi
Project Manager
Center for NEMS & Nano Photonics (CNNP)
ESB 225, Dept. of Electrical Engineering
Indian Institute of Technology(IIT) Madras
Chennai-600036, Indian
+91 44 2257 5493 (O)
+91 789 326 8010(M)
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20190404/c120c158/attachment.html>