[labnetwork] Wafer specification requirement for RIE & DRIE cleaning recopies

[Fabien Dauzou]

Hi Srinivasa,

In the past we have been using alumina wafer carrier [1-2mm] to proceed with cleaning of RIE and DRIE.
You can also use standard wafer with a photoresist or certain coating (SiO2, Cr…) to avoid wafer consumption. It should be fine with the helium backside cooling.

Best regards, Bien cordialement,

Fabien Dauzou (Jr. Eng.)
R&D Process Engineer
fabien at edgehogtech.com<mailto:fabien at edgehogtech.com>
Mob: 438-868-1657
https://www.edgehogtech.com/
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From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> On Behalf Of Srinivasa Reddy
Sent: April 4, 2019 1:42 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Wafer specification requirement for RIE & DRIE cleaning recopies

HI,
I'm Srinivasa Reddy, Manger, Microfabrication Lab, Indian Institute of Technology, Madras, Chennai.
This is regarding Wafers specifications for Dummy wafers for RIE & DRIE process.
1. Some times we stick small prices to full 4 inch wafer and do the etching process.
Currently we are using Prime Wafers ( which costly) and I'm looking to replace with Mechanical grade or Test grade wafers.
2. We also do chamber cleaning runs with the wafers and this also consumes significant number of wafers. Here also want to replace the Prime wafer with Test or Mechanical grade wafer.

I've doubt about the Bending/Warping or TTV or backside roughness of the wafer and It may lead to higher helium leak rate and process may abort.
Could some one throw light on this issue


Thanks & Regards
Srinivasa Reddy Kuppireddi
Project Manager
Center for NEMS & Nano Photonics (CNNP)
ESB 225, Dept. of Electrical Engineering
Indian Institute of Technology(IIT) Madras
Chennai-600036, Indian
+91 44 2257 5493 (O)
+91 789 326 8010(M)
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