[labnetwork] ITO deposition

[Shimon Eliav]

Hi Iulian,

We have a multi target, multi user Sputtering System. We do ITO deposition with no problem.
From our experience we recommend you "to go easy" on power (DC or RF) in order not to melt the Indium bonding to the Copper Back Plate or to crack the ITO target itself.
Regards,

Shimon
The Hebrew University of Jerusalem
The Unit for Nano Fabrication
ISRAEL

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Iulian Codreanu
Sent: Tuesday, 9 April 2019 19:55
To: Fab Network <labnetwork at mtl.mit.edu>
Subject: [labnetwork] ITO deposition

Dear Colleagues,

We have received a number of requests to provide ITO deposition capabilities. We have a sputterer but are concerned with the low melting points for Indium and Tin.  I am under the impression that ITO needs a dedicated deposition system. What is your experience/advice?

Thank you,

Iulian

--
iulian Codreanu, Ph.D.
Director of Operations, Nanofabrication Facility University of Delaware Harker ISE Lab, Room 163
221 Academy Street
Newark, DE 19716
302-831-2784
http://udnf.udel.edu


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork