[labnetwork] Dicing GaAs wafers

[Nibarger, John (Fed)]

Dear Colleagues,
We have some users who would like to use a dicing saw that is currently used to cut glass and sapphire to cut GaAs wafers as well. We’re worried about the safety aspects of both tool contamination and dealing with the waste water effluent. The dicing saw that we are using is a DISCO DAD3220. Does anyone have any thoughts or experience on this?
Thanks,
John

John P. Nibarger, Ph.D.
Manager, Boulder Micro-fabrication Facility
Microfabrication Group Leader (687.10)
National Institute of Standards and Technology
325 Broadway, MS 687.10
Boulder, CO  80305
303-497-4575 (phone)
303-497-3042 (fax)
john.nibarger at nist.gov<mailto:john.nibarger at nist.gov>

-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20190703/25187e14/attachment.html>