[labnetwork] Dicing GaAs wafers

[Fouad Karouta]

Dear John,

For dicing III-V semiconductors you need to filter out the saw residues to avoid sending to the drain any As, P or Sb containing elements.
Probably you can talk with your dicer supplier about options.

Regards,
Fouad Karouta

*************************************
Manager ANFF ACT Node
Australian National Fabrication Facility
Research School of Physics and Engineering
L. Huxley Building (#56), Mills Road, Room 4.02
Australian National University
ACT 2601, Canberra, Australia
Tel: + 61 2 6125 7174
Mob: + 61 451 046 412
Email: fouad.karouta at anu.edu.au<mailto:fouad.karouta at anu.edu.au>
http://anff-act.anu.edu.au/



From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Nibarger, John (Fed)
Sent: Thursday, 4 July 2019 7:22 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Dicing GaAs wafers

Dear Colleagues,
We have some users who would like to use a dicing saw that is currently used to cut glass and sapphire to cut GaAs wafers as well. We’re worried about the safety aspects of both tool contamination and dealing with the waste water effluent. The dicing saw that we are using is a DISCO DAD3220. Does anyone have any thoughts or experience on this?
Thanks,
John

John P. Nibarger, Ph.D.
Manager, Boulder Micro-fabrication Facility
Microfabrication Group Leader (687.10)
National Institute of Standards and Technology
325 Broadway, MS 687.10
Boulder, CO  80305
303-497-4575 (phone)
303-497-3042 (fax)
john.nibarger at nist.gov<mailto:john.nibarger at nist.gov>

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