[labnetwork] Ion Milling

[Matthew Moneck]

Hi All,

We would be happy to offer assistance as well if needed.  In regards to removal rates, we typically see polymers and resists (mostly novolac resin based resists) etch at roughly twice the rate of Ni (sometimes up to 2.5x faster depending on the resist).

Best Regards,

Matt

--
Matthew T. Moneck, Ph.D.
Executive Manager, Claire & John Bertucci Nanotechnology Laboratory
Electrical and Computer Engineering | Carnegie Mellon University
5000 Forbes Ave., Pittsburgh, PA 15213-3890
T: 412.268.5430
F: 412.268.3497
www.ece.cmu.edu<http://www.ece.cmu.edu/>
nanofab.ece.cmu.edu

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Dennis Slafer
Sent: Wednesday, May 22, 2019 5:01 PM
To: Paolini, Steven <spaolini at cns.fas.harvard.edu>; hathaway at cns.fas.harvard.edu
Cc: labnetwork at mtl.mit.edu; B. Diane Martin <diane at microcontinuum.com>
Subject: Re: [labnetwork] Ion Milling

Hi Steve and Mac,

Thanks for the quick response to Tom's question (and thanks Tom!).

We are trying to etch 18nm of Ni on a 4-in silicon wafer that has a polymer mask to define the areas from which we want to remove the Ni.  The mask is a UV-cured polymer, and I was also wondering if you have a feel for the relative rates of removal of the Ni vs the polymer mask.

Much thanks in advance--Dennis






+++++++++++++++++

Hi Tom,

At Harvard, we have an ion beam etcher.  What is the material to be etched?


Mac
Mac Hathaway
Senior Process and Systems Engineer
Harvard Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA  02138
617-495-9012

On Wed, May 22, 2019 at 4:18 PM Paolini, Steven <spaolini at cns.fas.harvard.edu<mailto:spaolini at cns.fas.harvard.edu>> wrote:
We got one! Has Ar and O2 milling capability. Have him contact me.

Steve Paolini
Principal Equipment Engineer
Harvard University Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA 02138
617- 496- 9816
spaolini at cns.fas.harvard.edu<mailto:spaolini at cns.fas.harvard.edu>
www.cns.fas.harvard.edu<http://www.cns.fas.harvard.edu>

From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu> <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Ferraguto, Thomas S
Sent: Wednesday, May 22, 2019 11:47 AM
To: 'labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>' <labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>>
Cc: Dennis Work <dennis.slafer at microcontinuum.com<mailto:dennis.slafer at microcontinuum.com>>
Subject: [labnetwork] Ion Milling

Colleagues,

I have a customer that needs dry etch 18nm. We can’t use our ICP for the process. Does anyone have an Ion Mill Tool that could provide him the service.

Regards

Tom Ferraguto


--
Dr. W. Dennis Slafer

President & CTO
MicroContinuum, Inc.
www.microcontinuum.com<http://www.microcontinuum.com>
57 Smith Place
Cambridge, MA 02138

o: 617.354.1092
c: 781.635.7032
f: 617.354.1107
dennis.slafer at microcontinuum.com<mailto:dennis.slafer at microcontinuum.com>
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