[labnetwork] Sloped Sidewalls for Photoresist

[Tony Whipple]

Hello Sa'ad;

As Robert said, using a stepper would be a large help. We have used SPR-955
before and was able to have nice vertical sidewalls at half micron lines,
but was with a stepper.
One other item that we did was a post exposure bake, which was done between
your steps 6 and 7.  If limited to a contact aligner, then hard or vacuum
contact are worth
trying if you have not already done that.
Good luck, Tony W.

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On Thu, Dec 17, 2020 at 12:56 PM Sa'ad H <saad_m_hassan at hotmail.com> wrote:

> Good Morning Everyone,
>
> I trust everyone is well. I have been working on defining lithographic
> features that are lines separated by trenches both of which are 800nm wide.
>
> I am getting adequate resolution, i.e, the lines are very close to spec.
> But the sidewalls slope significantly as can be seen in the attached
> picture.
>
> My wafer is fabricated as follows:
>
>    1.  Bare Silicon Wafer
>    2. HMDS
>    3. Backside Antireflective Coating (XHiRC-16)
>    4. SPR-955 - 6000 rpm spin - PR thickness - 800nm
>    5. Bake 90 Celsius for 90 seconds
>    6. Exposure - 125 mJ/cm2 in a contact aligner
>    7. Development 1 minute with ultrasonic
>
>
>
>
>
>
>
> Does anyone know how I can achieve nice vertical sidewalls?
>
>
> Cheers,
> Sa'ad
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