[labnetwork] Deep Reactive Ion Etch Problems

[Aebersold,Julia W.]

Pallavi, make sure you have performed a decent chamber clean before processing and that your photoresist is completely developed.  Both problems among others will contribute significantly to grass.


Cheers!


Julia Aebersold, Ph.D.

Manager, Micro/Nano Technology Center

University of Louisville

2210 South Brook Street

Shumaker Research Building, Room 233

Louisville, KY  40292

(502) 852-1572

http://louisville.edu/micronano/<http://louisville.edu/micronano>


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From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> on behalf of Pallavi Sharma <pnsharma at unm.edu>
Sent: Monday, July 27, 2020 12:02 PM
To: labnetwork at mtl.mit.edu <labnetwork at mtl.mit.edu>
Subject: [labnetwork] Deep Reactive Ion Etch Problems


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Hello all,

I am having problem with anisotropic etching of silicon by Deep Reactive ion etch. Grass or black silicon is the issue all the time, attaching some of the SEM pictures of the sample. Every recipe I tried to fine tune result in grass formation, even as the process initiates in tool wafer surface starts to turn brown and ultimately black. I tried varying SF6 gas flow, Bias power, Substrate temperature but every time I see is highly dense grass with no clean surface.
Any help will be greatly appreciated.

Thank you,
Pallavi

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