[labnetwork] Dicing glass/quartz or alumina with Disco DAD3240 saw

[Morrison, Richard H., Jr]

How much of the blade is exposed? Try a different HUB size for less blade exposure.

Rick


Richard Morrison
PMTS
Draper Laboratory
555 Technology Square
Cambridge Ma  02139
Office: 617-258-3420
Cell: 508-930-3461



From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Beaudoin, Mario
Sent: Thursday, September 9, 2021 4:53 PM
To: labnetwork at mtl.mit.edu; Blednov, Andrey <andrey.blednov at ubc.ca>
Subject: [labnetwork] Dicing glass/quartz or alumina with Disco DAD3240 saw

We are having issues with cutting glass/quartz or alumina wafers with our Disco DAD3240 dicing saw

We’re using composite Thermocarbon blades @ 20K rpm and tried feed speeds ranging between 0.5-5 mm/sec. Sample thickness varies but even for thinner ones (500-700 um) we’re having a problem that the blade breaks. Looks like the blade trajectory is bending during the cut and this causes catastrophic damage to the blade. Why this bending occurs is not clear. Maybe the problem is in the blue tape we use to secure samples, but we don’t observe any apparent displacement of the sample on the film.

Anyone else having similar issues?  Any suggestions?

Regards,

Mario
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