[labnetwork] EXT: Re: Dicing glass/quartz or alumina with Disco DAD3240 saw

Macdonald, Robert (GE Research, US) robert.macdonald at ge.com
Fri Sep 10 08:15:32 EDT 2021


Usually this is an exposure issue, that is, to much place is exposed, not supported by the wafer. Contact thermocarbon or disco for recommendations. The deeper the cut the thicker the blade. There are formulas to guide you.

You should also replace your hubs frequently. If there is any ding or flaw on the hub it can cause breakage. The hub and blade should be wiped with non shedding wipes and ipa to remove any debris prior to mounting the blade in the hub.

Finally check water flow. You need the correct flow and and it should hit the blade correctly   Again blade vendor can provide guidance.

Aluminum and quartz cut very differently.  The former and some alumina containing glasses are very hard and difficult to cut. So a multi pass strategy is often recommended. But quartz in my experience can be cut more easily with less blade ware.

You should check the blade ware as you cut and this will inform how you handle that     Your tool let’s you adjust the cut height for blade ware as it cuts.

But my guess is blade support is insufficient based on what you wrote.

Sent from my iPhone

On Sep 10, 2021, at 7:50 AM, Miller, Suzanne <csmiller at anl.gov> wrote:


Are you cutting in slices?  I would only cut 100 to 150 microns per slice.  I would use a Diamond grit of at least 46 microns and 8 mil thick. Suzanne

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From: labnetwork <labnetwork-bounces at mtl.mit.edu> on behalf of Beaudoin, Mario <beaudoin at physics.ubc.ca>
Sent: Thursday, September 9, 2021 3:52:38 PM
To: labnetwork at mtl.mit.edu <labnetwork at mtl.mit.edu>; Blednov, Andrey <andrey.blednov at ubc.ca>
Subject: [labnetwork] Dicing glass/quartz or alumina with Disco DAD3240 saw

We are having issues with cutting glass/quartz or alumina wafers with our Disco DAD3240 dicing saw

We’re using composite Thermocarbon blades @ 20K rpm and tried feed speeds ranging between 0.5-5 mm/sec. Sample thickness varies but even for thinner ones (500-700 um) we’re having a problem that the blade breaks. Looks like the blade trajectory is bending during the cut and this causes catastrophic damage to the blade. Why this bending occurs is not clear. Maybe the problem is in the blue tape we use to secure samples, but we don’t observe any apparent displacement of the sample on the film.

Anyone else having similar issues?  Any suggestions?

Regards,

Mario

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