[labnetwork] RIE through Silicon

[N P Vamsi Krishna]

Hi Long,
I do this routinely in an OXFORD RIE tool by bonding to a carrier wafer
using a crystal bond that is dissolved in hot water after the etch is done.
I have used various other methods of temporary bonding like resist, cool
grease, 3M conductive paste, and Fomblin oil. But, I find crystal bond 555
is much better.

Also, people have used QuickStick™ 135 Temporary Mounting Wax or 509-clear
which can be dissolved in Acetone. Also, using the 509- clear I have seen
people preparing a spin coatable solution by dissolving it in PGMEA.

Thanks & br,
vamsi


___________________________________________________

N.P.  Vamsi Krishna, PhD

*Staff Scientist*

Pritzker School of Molecular Engineering, *The University of Chicago *

*Resident **Associate*

Center for Nanoscale Materials, *Argonne National Laboratory *

Phone: 1 (331) 757-8565

On Tue, Apr 12, 2022 at 6:37 AM Jeremy Upham <jupham at gmail.com> wrote:

> I think your plan could work, so I'm not sure that I see the problem
>
> In my experience the carbon in the PR can contribute to the plasma
> chemistry and affect the etch, so I tend to use vacuum grease as a
> thermally conducting binder between the etched sample and the backing wafer
> instead. Though your system may well work for your recipe.
>
> Hope that helps,
>
> Jer Upham PhD
> Senior Lab Manager / Research Scientist
> Quantum Photonics Group
> University of Ottawa
> Tel.: 1 (613) 562-5800 ext 7325
>
>
> On Mon, Apr 11, 2022 at 6:54 PM Chang, Long <lvchang at central.uh.edu>
> wrote:
>
>> *Attention : courriel externe | external email*
>> Hi Guys,
>>
>> I have an Oxford RIE with backside Helium. I want to etch through the
>> silicon wafer (380um thick). The largest pattern is a 1mm diameter circle.
>> My plan is to ride the 4” sample wafer on a 4" carrier wafer with PR. Does
>> anyone have a good solution to this problem?
>>
>> Thanks,
>> Long
>>
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>


-- 

___________________________________________________

N.P.  Vamsi Krishna, PhD

*Staff Scientist*

Pritzker School of Molecular Engineering, *The University of Chicago *

*Resident **Associate*

Center for Nanoscale Materials, *Argonne National Laboratory *

Phone: 1 (331) 757-8565
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