[labnetwork] RIE through Silicon
Aebersold,Julia W.
julia.aebersold at louisville.edu
Tue Apr 12 17:18:26 EDT 2022
We have been using crystal bond. It provides good thermal transfer and it cleans up well with solvents.
Cheers!
Julia Aebersold, Ph.D.
Manager, Micro/Nano Technology Center
University of Louisville
Shumaker Research Building, Room 233
2210 South Brook Street
Louisville, KY 40292
(502) 852-1572
http://louisville.edu/micronano/
From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Hao-Chieh Hsieh
Sent: Tuesday, April 12, 2022 2:54 PM
To: Chang, Long <lvchang at central.uh.edu>
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] RIE through Silicon
You don't often get email from hahsieh at ucsc.edu<mailto:hahsieh at ucsc.edu>. Learn why this is important<http://aka.ms/LearnAboutSenderIdentification>
CAUTION: This email originated from outside of our organization. Do not click links, open attachments, or respond unless you recognize the sender's email address and know the contents are safe.
Hi Long,
We used a vacuum grease to attach the silicon wafer to the Al carrier for DRIE etching in Utah nanofab . I was able to etch a 50x50um opneing through a standard 4-inch silicon wafer. Releasing is time-consuming by soaking overnight in xylene and final device came out pretty good. We can discuss more.
Thanks
Hao-Chieh
On Tue, Apr 12, 2022 at 11:22 AM Kamal Yadav <kamal.yadav at gmail.com<mailto:kamal.yadav at gmail.com>> wrote:
Hi Long,
Your PR will mostly char/ or burn, so cool grease is recommended but when you do a through silicon via, you may be exposing the cool grease to plasma and I am not sure what kind of damage it will bring to the devices/chamber. Of course exposing plasma to photoresist (if that works) is fine. Thanks
On Tue, Apr 12, 2022 at 9:07 AM Hollingshead, Dave <hollingshead.19 at osu.edu<mailto:hollingshead.19 at osu.edu>> wrote:
Hi Long,
We do this routinely with our DRIE system. As Jer mentioned, we typically use small drops of santovac 5 oil to adhere the two wafers together to provide thermal conduction. In our case we see etch rate changes or PR "burning" without a good thermal conductor between the samples.
-Dave
From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Jeremy Upham
Sent: Monday, April 11, 2022 23:08
Cc: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] RIE through Silicon
I think your plan could work, so I'm not sure that I see the problem In my experience the carbon in the PR can contribute to the plasma chemistry and affect the etch, so I tend to use vacuum grease as a thermally conducting binder between
I think your plan could work, so I'm not sure that I see the problem
In my experience the carbon in the PR can contribute to the plasma chemistry and affect the etch, so I tend to use vacuum grease as a thermally conducting binder between the etched sample and the backing wafer instead. Though your system may well work for your recipe.
Hope that helps,
Jer Upham PhD
Senior Lab Manager / Research Scientist
Quantum Photonics Group
University of Ottawa
Tel.: 1 (613) 562-5800 ext 7325
On Mon, Apr 11, 2022 at 6:54 PM Chang, Long <lvchang at central.uh.edu<mailto:lvchang at central.uh.edu>> wrote:
Attention : courriel externe | external email
Hi Guys,
I have an Oxford RIE with backside Helium. I want to etch through the silicon wafer (380um thick). The largest pattern is a 1mm diameter circle. My plan is to ride the 4" sample wafer on a 4" carrier wafer with PR. Does anyone have a good solution to this problem?
Thanks,
Long
_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork<https://nam11.safelinks.protection.outlook.com/?url=https%3A%2F%2Fmtl.mit.edu%2Fmailman%2Flistinfo.cgi%2Flabnetwork&data=04%7C01%7Cjulia.aebersold%40louisville.EDU%7C81104f87789d4ec2e1d108da1cc7965e%7Cdd246e4a54344e158ae391ad9797b209%7C0%7C0%7C637853940812796627%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C3000&sdata=FU9Drl2kylPbn93%2Fx4XFYqtkavRHoAqdSc3Nh%2BMP1g0%3D&reserved=0>
--
Thanks,
Kamal
_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork<https://nam11.safelinks.protection.outlook.com/?url=https%3A%2F%2Fmtl.mit.edu%2Fmailman%2Flistinfo.cgi%2Flabnetwork&data=04%7C01%7Cjulia.aebersold%40louisville.EDU%7C81104f87789d4ec2e1d108da1cc7965e%7Cdd246e4a54344e158ae391ad9797b209%7C0%7C0%7C637853940812796627%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C3000&sdata=FU9Drl2kylPbn93%2Fx4XFYqtkavRHoAqdSc3Nh%2BMP1g0%3D&reserved=0>
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20220412/bf076ab0/attachment.html>
More information about the labnetwork
mailing list