[labnetwork] Your favorite wafer bonder

[S. J. Ben Yoo]

Hi, Rob,

We have EVG501 wafer bonder and EVG 810 plasma activation tools plus a third vender wafer cleaning tool and another bonding strength test tool.

(Listed in our cleanroom equipment website: https://cnm2.ucdavis.edu/equipment ).

We are very happy with the tools, and the service & support from EVG have been great.

We purchased them in 2016 after a few years of demo testing at their facilities (paid fees to get custom bonding done and in some cases sent my students there for various testing).

At the time of purchase, I carefully looked into various other vendors’ tools, and we have been happy with our decision.

My students have been doing hydrophilic bonding between dissimilar materials (GaAs-Si, AlGaAs-Si, InP-Si, LiNbO3-Si) as well as Si-Si and SiO2-SiO2.  Some others have done anodic bonding (I try to avoid sodium for my projects so I don’t do anodic bonding).  I don’t allow polymers in the wafer bonding chamber, so no polymer bonding, but we do transfer printing with and without resin in another EVG tool.

Let me know if you need more info.  

Best,

-Ben

_______________________________________________________________________________

S. J. Ben Yoo
Joint Faculty LBL and UC Davis 
Distinguished Professor, Department of Electrical and Computer Engineering
Room 3110, Kemper Hall
Mail Code 1915
University of California
Davis, California 95616
Mobile: (510) 407-2457
Fax: (530) 752-8428
email: sbyoo at ucdavis.edu
home page: http://sierra.ece.ucdavis.edu
_______________________________________________________________________________ 

> On Sep 4, 2023, at 1:48 AM, Peter Lomax <Peter.Lomax at ed.ac.uk> wrote:
> 
> Hi,
>  
> We have a circa 20 year old Karl Suss anodic bonder, which can also do fusion bonding.  Generally works well, doesn’t have any alignment capability but has some tooling so you can align in a Karl Suss mask aligner then transfer to the bonder.
>  
> If I could improve it I would make it easier for doing stacks of three wafers – this is an option for Karl Suss but expensive – we can sort of get round it with conducting copper tape.
>  
> Support has been OK but seems to need something almost every time it is used!  Over the ast year has probably been used 20 times and just on the one project.
>  
> Cheers
>  
> Peter
>  
> From: labnetwork <labnetwork-bounces at mtl.mit.edu <mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Macdonald, Robert (GE Aerospace, US)
> Sent: 01 September 2023 19:24
> To: labnetwork at mtl.mit.edu <mailto:labnetwork at mtl.mit.edu>
> Subject: [labnetwork] Your favorite wafer bonder
>  
> This email was sent to you by someone outside the University.
> You should only click on links or attachments if you are certain that the email is genuine and the content is safe.
> Wafer bonding has advanced a great deal in the last twenty years. Industrial tools have incorporated many improvements in wafer handing and process capabilities.
>  
> But many of the bonders I encounter in University labs have not incorporated all those improvements.
>  
> I am wondering: What wafer bonder are you using in your facility? What vintage is it? How much use does it get? What types of bonds are you supporting (anodic, fusion, frit, polymer, etc)? What improvements to these tools would you like to see?
>  
> Thanks,
>  
> Rob
>  
> Robert MacDonald
> MEMS Engineer
> GE Research
> 1 Research Circle
> Niskayuna, NY 12309
> 518 312-5646
> Robert.macdonald at ge.com <mailto:Robert.macdonald at ge.com>
>  
> The University of Edinburgh is a charitable body, registered in Scotland, with registration number SC005336. Is e buidheann carthannais a th’ ann an Oilthigh Dhùn Èideann, clàraichte an Alba, àireamh clàraidh SC005336._______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu <mailto:labnetwork at mtl.mit.edu>
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork

-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20230904/05fbd621/attachment.html>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: smime.p7s
Type: application/pkcs7-signature
Size: 1689 bytes
Desc: not available
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20230904/05fbd621/attachment.p7s>