[labnetwork] Metals in DRIE chamber

[Hadi Esmaeilsabzali]

For those who operate a DRIE system (specifically SPTS Rapier), I am wondering what your policy is with regard to allowing metallized wafers inside the chamber? Generally, SPTS recommends against any metal, particularly as the mask, in their Rapier DRIE system (though metals may be used as the etch stop). How do you go about wafers with some (say >5% total surface area) metal features that are coated with enough photoresist to avoid exposure to the plasma and contaminate the chamber? This should be safe in theory, but do you have any experience with this approach in practice?


Any feedback is greatly appreciated!


Regards,

Hadi


Hadi Esmaeilsabzali, PhD

4D LABS, Simon Fraser University
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