[labnetwork] Metals in DRIE chamber

[Peter Lomax]

I believe it depends on the metals and how easy they are to remove from the chamber rather than coat it.

For a long time we didn't allow any metals - after somebody used Al as a mask and caused endless problems with grassing from the contamination.  We currently try not allow metals if possible but have occasionally used Cr as a mask and not seen any issues.

Best regards

Peter

From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Hadi Esmaeilsabzali
Sent: 26 April 2024 17:25
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Metals in DRIE chamber

This email was sent to you by someone outside the University.
You should only click on links or attachments if you are certain that the email is genuine and the content is safe.

For those who operate a DRIE system (specifically SPTS Rapier), I am wondering what your policy is with regard to allowing metallized wafers inside the chamber? Generally, SPTS recommends against any metal, particularly as the mask, in their Rapier DRIE system (though metals may be used as the etch stop). How do you go about wafers with some (say >5% total surface area) metal features that are coated with enough photoresist to avoid exposure to the plasma and contaminate the chamber? This should be safe in theory, but do you have any experience with this approach in practice?



Any feedback is greatly appreciated!



Regards,

Hadi



Hadi Esmaeilsabzali, PhD

4D LABS, Simon Fraser University

The University of Edinburgh is a charitable body, registered in Scotland, with registration number SC005336. Is e buidheann carthannais a th' ann an Oilthigh Dh?n ?ideann, cl?raichte an Alba, ?ireamh cl?raidh SC005336.
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20240429/7fdeb69e/attachment.html>