[labnetwork] Thick, high purity copper plating source (UNCLASSIFIED)

[Charles Ellis]

Mike,

You may also want to try a technique we have used in the past to generate
similar structures- we DRIE holes in silicon and then fill with copper,
polish the surface, and then remove the silicon.  You can get very tight
tolerances on these holes using the Bosch process - We have made very high
aspect ratio structures for people needing ion milling mask structures.
One of the grad students published on this technique (
http://etd.auburn.edu/etd/bitstream/handle/10415/2681/Adanur,%20Emir%20Thes
is%20Final.pdf?sequence=2 ).

Hope this helps - 

Charles Ellis..
Auburn University
334-750-0734


On 4/5/13 8:11 AM, "Benard, William L CIV USARMY ARL (US)"
<william.l.benard.civ at mail.mil> wrote:

>Classification: UNCLASSIFIED
>Caveats: NONE
>
>Mike,
>
>I don't know whether they can meet extreme purity requirements, but I
>have had 
>very good experience in the past working with Dave Roberts, now at
>Silicon 
>Valley Wafer Plating (http://www.waferplating.com/).  He knows his stuff
>and 
>has been willing to engage on challenging plating projects.
>
>
>Best regards,
>
>William
>
>William Benard Ph.D.
>Cleanroom Manager
>U.S. Army Research Laboratory
>Sensors and Electron Devices Directorate (RDRL-SEG)
>2800 Powder Mill Road
>Adelphi, MD, 20783-1473
>Phone: 301-394-1322
>Cell: 240-753-2510
>Fax: 301-394-1074
>E-mail: william.l.benard.civ at mail.mil
>
>
>
>
>-----Original Message-----
>From: labnetwork-bounces at mtl.mit.edu
>[mailto:labnetwork-bounces at mtl.mit.edu]
>On Behalf Of Michael Khbeis
>Sent: Thursday, April 04, 2013 10:22 AM
>To: labnetwork at mtl.mit.edu
>Subject: [labnetwork] Thick, high purity copper plating source
>
>Dear Colleagues,
>
>We have a researcher working on a DOE program that will require
>structures 
>that are 1mm thick and have lateral dimension tolerances <10um in high
>purity 
>copper. There is a source claiming this capability online, but they have
>been 
>unresponsive. I was wondering if anyone could recommend a source short of
>outsourcing a LIGA process.
>
>Gratefully,
>
>Dr. Michael Khbeis
>Associate Director
>Microfabrication Facility (MFF)
>University of Washington
>Fluke Hall, Box 352143
>(O) 206.543.5101
>(C) 443.254.5192
>khbeis at uw.edu
>
>Classification: UNCLASSIFIED
>Caveats: NONE
>
>