[labnetwork] Sapphire substrates: precision scribe & break

[Vito Logiudice]

Dear Colleagues,

I would appreciate hearing from anyone whom might be able to share some insights on how to reliably scribe & break sapphire substrates. We’re attempting to help out a couple of research groups here with such a requirement.

We’ve had success with our water-cooled dicing saw but it appears this approach leads to unacceptable materials issues. We thus find ourselves having to resort to some sort of precision (& repeatable) scribe and break technique/setup which will result in consistently smooth sidewalls.

Thank you for any insights on procedures you may be using or equipment vendors you have worked with whom might be able to help.

Best regards,
Vito
--
Vito Logiudice  P.Eng.
Director of Operations, Quantum NanoFab
University of Waterloo
Lazaridis QNC 1207
200 University Avenue West
Waterloo, ON           Canada N2L 3G1
Tel.: (519) 888-4567  ext. 38703
Email: vito.logiudice at uwaterloo.ca<mailto:vito.logiudice at uwaterloo.ca>
Website: https://fab.qnc.uwaterloo.ca

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