[labnetwork] SU-8 Thickness Uniformity

[Christopher Raum]

Hi John,

You may need multiple spin speeds to first spread and then coat the
surface, followed by a final short high-speed spin to minimize edge bead.

-Chris
--
R&D Engineer 3
Experimental Cosmology Group
Radio Astronomy Lab
University of California, Berkeley
151 LeConte Hall
Berkeley, CA, 94720

On Aug 16, 2017 5:27 PM, "John Sam Soon" <jsamsoon at eng.ucsd.edu> wrote:

> Hello
> We've been running uniformity thickness tests of SU8-2025 on 4 in prime Si
> wafers (measured with a mechanical profilometer), and have gotten results
> around 13% (Max-Min/(Max+min)). Far from Microchem's reported 5%). I wanted
> to reach out to the community as to:
> 1) What are some of the uniformity numbers that other users are getting?
> and
> 2) for those getting good uniformity, are there any process control tips
> that can be shared?
>
>
> --
> Nicholas Sam-Soon
> Microfabrication Process Engineer
> Calit2 Qualcomm Institute
> UC San Diego
> http://nano3.calit2.net/
> Email: jsamsoon at ucsd.edu
>
>
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