[labnetwork] SU-8 Thickness Uniformity

John Sam Soon jsamsoon at eng.ucsd.edu
Thu Aug 17 12:45:42 EDT 2017


We are following the manufacturer's recommendation for processing, but not
doing EBR. This is taken into consideration during measurement however.  We
don't have edge bead or uniformity issues if we use dry film.
Nic

On Wed, Aug 16, 2017 at 5:39 PM, Chito Kendrick <cekendri at mtu.edu> wrote:

> Can you add how you are applying the SU-8 and does your calculation
> include the edge bead or are you using an edge bead remover.
>
> I am also interested in this as I have a biochip company work in my lab
> that is try to get an edge bead free film without just cutting it off as
> they are losing to many devices in there mind. Currently, been looking at
> using a screen printer and also there was a paper on spraying edge bead
> remover on the SU-8 after spinning to get a edge bead free film.
>
> Chito Kendrick
>
> On 8/16/2017 3:55 PM, John Sam Soon wrote:
>
> Hello
> We've been running uniformity thickness tests of SU8-2025 on 4 in prime Si
> wafers (measured with a mechanical profilometer), and have gotten results
> around 13% (Max-Min/(Max+min)). Far from Microchem's reported 5%). I wanted
> to reach out to the community as to:
> 1) What are some of the uniformity numbers that other users are getting?
> and
> 2) for those getting good uniformity, are there any process control tips
> that can be shared?
>
>
> --
> Nicholas Sam-Soon
> Microfabrication Process Engineer
> Calit2 Qualcomm Institute
> UC San Diego
> http://nano3.calit2.net/
> Email: jsamsoon at ucsd.edu
>
>
>
> _______________________________________________
> labnetwork mailing listlabnetwork at mtl.mit.eduhttps://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
> --
> Chito Kendrick Ph.D. <https://sites.google.com/site/chitokendrickphd/>
>
> Managing Director of the Microfabrication Facility
> Research Assistant Professor
> Electrical and Computer Engineering
> Michigan Technological University
> Room 436 M&M Building
> 1400 Townsend Dr.
> Houghton, Michigan 49931-1295
>
> 814-308-4255 <(814)%20308-4255>
>
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>
>


-- 
Nicholas Sam-Soon
Microfabrication Process Engineer

Calit2 Qualcomm Institute
UC San Diego
http://nano3.calit2.net/
Email: jsamsoon at ucsd.edu
Phone: (714) 248-6050
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