[labnetwork] Ion Milling
Youry Borisenkov
yb2471 at columbia.edu
Thu May 23 11:22:09 EDT 2019
Hi,
Usually a good guess would be 1:1 ratio. Metalls are usually etched faster,
in IBM, than resists. However, an important issue is the lateral
dimensions, if they are smaller than 100nm you will get a redeposition
issues. You will get Nickel on your resist sidewalls.
Regards,
Youry
On Wed, May 22, 2019, 23:20 Ferraguto, Thomas S <Thomas_Ferraguto at uml.edu>
wrote:
> Colleagues,
>
>
>
> I have a customer that needs dry etch 18nm. We can’t use our ICP for the
> process. Does anyone have an Ion Mill Tool that could provide him the
> service.
>
>
>
> Regards
>
>
>
> Tom Ferraguto
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