[labnetwork] Sapphire dicing

[Gloria Qiu]

Hi Natalia,

I’ve tried dicing 600um sapphire with resin hubless blade at 3mm/sec, 15krmp, and the blades always chip. The manufacturer also recommended depth-step as Ahdam suggested but I haven’t got time to try it. (It would be quite slow though).
My colleague at UNSW uses a standard procedure (one-step) with VT07/12 blades that I am keen to try. I found the blade and dicing information here and the result looks pretty decent.
https://www.aurotech.com/index.php/en/products/dicing-blade/vt07-12-series-detail

Hope this helps.


Best,

Gloria

Wenlan (Gloria) Qiu
Senior Process Engineer | Research & Prototype Foundry
Core Research Facilities | Research Portfolio

THE UNIVERSITY OF SYDNEY
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From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Ahdam Ali
Sent: Saturday, May 15, 2021 1:12 AM
To: Natalia Pankratova <natalia.a.pankratova at gmail.com>
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Sapphire dicing

Natalia,

At Nano3, we utilize a Disco DAD3220 Dicing Saw with Hubless blades in order to dice sapphire substrates. The process is relatively fool-proof, but one must be careful with dicing parameters. Cutting glass or sapphire typically require depth steps (multiple passes along a single cut) as well as very low feed speeds in order to ensure the integrity of the sample. This results in a considerably lower throughput when compared to dicing of a material such as Si.

Best,

On Fri, May 14, 2021 at 4:57 AM Natalia Pankratova <natalia.a.pankratova at gmail.com<mailto:natalia.a.pankratova at gmail.com>> wrote:
Dear All,

Can you please share your experience on dicing sapphire wafers? Blade dicing or laser? Do you have a favorite dicing brand/model?

Thank you in advance!

Best regards,

Natalia Pankratova.
Alice&Bob
Nanofabrication engineer
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Ahdam Ali
R&D Engineer II
UCSD Calit2 Nano3 Facility
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